JPH0245573B2 - - Google Patents
Info
- Publication number
- JPH0245573B2 JPH0245573B2 JP57233104A JP23310482A JPH0245573B2 JP H0245573 B2 JPH0245573 B2 JP H0245573B2 JP 57233104 A JP57233104 A JP 57233104A JP 23310482 A JP23310482 A JP 23310482A JP H0245573 B2 JPH0245573 B2 JP H0245573B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- die
- brush
- press
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000428 dust Substances 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 239000000872 buffer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G59/00—De-stacking of articles
- B65G59/06—De-stacking from the bottom of the stack
- B65G59/061—De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack
- B65G59/062—De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack by means of reciprocating or oscillating escapement-like mechanisms
- B65G59/063—De-stacking from the bottom of the stack articles being separated substantially along the axis of the stack by means of reciprocating or oscillating escapement-like mechanisms comprising lifting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Cleaning In General (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23310482A JPS59123616A (ja) | 1982-12-28 | 1982-12-28 | ダイクリ−ナ− |
EP84107011A EP0170706B1 (en) | 1982-12-28 | 1984-06-19 | A frame separator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23310482A JPS59123616A (ja) | 1982-12-28 | 1982-12-28 | ダイクリ−ナ− |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59123616A JPS59123616A (ja) | 1984-07-17 |
JPH0245573B2 true JPH0245573B2 (zh) | 1990-10-11 |
Family
ID=16949832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23310482A Granted JPS59123616A (ja) | 1982-12-28 | 1982-12-28 | ダイクリ−ナ− |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59123616A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6162007U (zh) * | 1984-09-28 | 1986-04-26 | ||
JPH0763768B2 (ja) * | 1989-08-22 | 1995-07-12 | 宇部興産株式会社 | 金型表面のブラッシング装置 |
JP4935554B2 (ja) * | 2007-07-19 | 2012-05-23 | 株式会社デンソー | 車両用送風装置 |
JP5592711B2 (ja) * | 2010-06-18 | 2014-09-17 | 三和システムエンジニアリング株式会社 | 粉末成形品のばり取り装置 |
CN106594456B (zh) * | 2016-12-16 | 2018-12-25 | 天津惠博普管道技术有限公司 | 一种清管器接收防撞装置 |
CN108789917A (zh) * | 2018-06-19 | 2018-11-13 | 惠州市中塑王塑胶制品有限公司 | 一种塑料颗粒处理设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5976207A (ja) * | 1982-10-25 | 1984-05-01 | Kazuo Bando | プラスチツク成形金型面のクリ−ニング装置 |
-
1982
- 1982-12-28 JP JP23310482A patent/JPS59123616A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5976207A (ja) * | 1982-10-25 | 1984-05-01 | Kazuo Bando | プラスチツク成形金型面のクリ−ニング装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS59123616A (ja) | 1984-07-17 |
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