JPH0244518Y2 - - Google Patents
Info
- Publication number
- JPH0244518Y2 JPH0244518Y2 JP1986121208U JP12120886U JPH0244518Y2 JP H0244518 Y2 JPH0244518 Y2 JP H0244518Y2 JP 1986121208 U JP1986121208 U JP 1986121208U JP 12120886 U JP12120886 U JP 12120886U JP H0244518 Y2 JPH0244518 Y2 JP H0244518Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- spool
- bonding arm
- capillary
- horn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/075—
-
- H10W72/07502—
-
- H10W72/884—
-
- H10W90/736—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121208U JPH0244518Y2 (enExample) | 1986-08-07 | 1986-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986121208U JPH0244518Y2 (enExample) | 1986-08-07 | 1986-08-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327043U JPS6327043U (enExample) | 1988-02-22 |
| JPH0244518Y2 true JPH0244518Y2 (enExample) | 1990-11-27 |
Family
ID=31010261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986121208U Expired JPH0244518Y2 (enExample) | 1986-08-07 | 1986-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244518Y2 (enExample) |
-
1986
- 1986-08-07 JP JP1986121208U patent/JPH0244518Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327043U (enExample) | 1988-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4550871A (en) | Four-motion wire bonder | |
| CN1111035A (zh) | 超声波引线焊接装置 | |
| US3941486A (en) | Wire bonder | |
| CN102945813A (zh) | 一种用于全自动引线键合设备上的键合头装置 | |
| JPS6064955U (ja) | 巻線機のテンシヨン装置 | |
| CN107248500A (zh) | 一种取晶、固晶装置及其采用它的固晶机 | |
| US7025243B2 (en) | Bondhead for wire bonding apparatus | |
| JPH0244518Y2 (enExample) | ||
| US4575602A (en) | Apparatus for forming bonding balls on bonding wires | |
| US6474538B1 (en) | Bonding apparatus and bonding method | |
| KR100504036B1 (ko) | 본딩장치 | |
| JP3856532B2 (ja) | ワイヤボンダー用ボール形成装置 | |
| JP2000012567A (ja) | ダイボンダの接合材供給方法およびその装置 | |
| JPS629717Y2 (enExample) | ||
| JPH0220833Y2 (enExample) | ||
| JPS626651B2 (enExample) | ||
| KR910006240B1 (ko) | 다이 본딩 장치 | |
| JPS63293844A (ja) | ワイヤボンデイングヘツド | |
| SU499614A1 (ru) | Автомат монтажа микросхем | |
| CN115780948A (zh) | 一种铜丝线软支架封装设备 | |
| JPH09191023A (ja) | ワイヤボンディング装置 | |
| JP2587842Y2 (ja) | ボンディング装置におけるウエハ−リングのマウント部構造 | |
| JP2725102B2 (ja) | ワイヤボンディング方法 | |
| JPH0231434A (ja) | 半導体製造装置 | |
| JPS61290731A (ja) | ワイヤボンデイング装置 |