JPH0243353B2 - - Google Patents
Info
- Publication number
- JPH0243353B2 JPH0243353B2 JP55113979A JP11397980A JPH0243353B2 JP H0243353 B2 JPH0243353 B2 JP H0243353B2 JP 55113979 A JP55113979 A JP 55113979A JP 11397980 A JP11397980 A JP 11397980A JP H0243353 B2 JPH0243353 B2 JP H0243353B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductor
- thickness
- plating
- fine pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 18
- 239000010409 thin film Substances 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 4
- 239000010408 film Substances 0.000 description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229920000459 Nitrile rubber Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- -1 etc. are preferred Chemical compound 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11397980A JPS5739598A (en) | 1980-08-21 | 1980-08-21 | Thick film fine pattern |
| US06/219,155 US4392013A (en) | 1979-12-27 | 1980-12-22 | Fine-patterned thick film conductor structure and manufacturing method thereof |
| NLAANVRAGE8006987,A NL183380C (nl) | 1979-12-27 | 1980-12-22 | Van een patroon voorziene en een dikke laag omvattende geleiderconstructie en werkwijze voor het vervaardigen daarvan. |
| GB8041120A GB2066583B (en) | 1979-12-27 | 1980-12-23 | Thick film conductor |
| DE3048740A DE3048740C2 (de) | 1979-12-27 | 1980-12-23 | Verfahren zum Herstellen einer feingerasterten Dickfilm-Leiterbahnenanordnung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11397980A JPS5739598A (en) | 1980-08-21 | 1980-08-21 | Thick film fine pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5739598A JPS5739598A (en) | 1982-03-04 |
| JPH0243353B2 true JPH0243353B2 (da) | 1990-09-28 |
Family
ID=14626002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11397980A Granted JPS5739598A (en) | 1979-12-27 | 1980-08-21 | Thick film fine pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5739598A (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476871U (da) * | 1990-11-16 | 1992-07-06 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07101652B2 (ja) * | 1988-11-01 | 1995-11-01 | 株式会社村田製作所 | 高周波コイルの製造方法 |
| US7852186B2 (en) | 2006-08-28 | 2010-12-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics |
| US7791900B2 (en) * | 2006-08-28 | 2010-09-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Galvanic isolator |
| US8093983B2 (en) | 2006-08-28 | 2012-01-10 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Narrowbody coil isolator |
| US7948067B2 (en) | 2009-06-30 | 2011-05-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer isolator packages |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5439876A (en) * | 1977-09-06 | 1979-03-27 | Victor Company Of Japan | Method of manufacturing filmmlike pattern |
| JPS5523919A (en) * | 1978-08-07 | 1980-02-20 | Nippon Carbide Kogyo Kk | Shooting preventing and cultivating method of ginger and agricultural covering material used therein |
-
1980
- 1980-08-21 JP JP11397980A patent/JPS5739598A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5439876A (en) * | 1977-09-06 | 1979-03-27 | Victor Company Of Japan | Method of manufacturing filmmlike pattern |
| JPS5523919A (en) * | 1978-08-07 | 1980-02-20 | Nippon Carbide Kogyo Kk | Shooting preventing and cultivating method of ginger and agricultural covering material used therein |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476871U (da) * | 1990-11-16 | 1992-07-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5739598A (en) | 1982-03-04 |
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