JPH0154874B2 - - Google Patents
Info
- Publication number
- JPH0154874B2 JPH0154874B2 JP54169268A JP16926879A JPH0154874B2 JP H0154874 B2 JPH0154874 B2 JP H0154874B2 JP 54169268 A JP54169268 A JP 54169268A JP 16926879 A JP16926879 A JP 16926879A JP H0154874 B2 JPH0154874 B2 JP H0154874B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- thickness
- plating
- conductor
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 63
- 239000004020 conductor Substances 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 23
- 238000009713 electroplating Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 28
- 239000010410 layer Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 7
- 229920000459 Nitrile rubber Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 230000008719 thickening Effects 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RSEBUVRVKCANEP-UHFFFAOYSA-N 2-pyrroline Chemical compound C1CC=CN1 RSEBUVRVKCANEP-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 description 1
- 230000002999 depolarising effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- -1 etc. are preferred Chemical compound 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16926879A JPS5694684A (en) | 1979-12-27 | 1979-12-27 | Thin film fine pattern and method of manufacturing same |
| NLAANVRAGE8006987,A NL183380C (nl) | 1979-12-27 | 1980-12-22 | Van een patroon voorziene en een dikke laag omvattende geleiderconstructie en werkwijze voor het vervaardigen daarvan. |
| US06/219,155 US4392013A (en) | 1979-12-27 | 1980-12-22 | Fine-patterned thick film conductor structure and manufacturing method thereof |
| DE3048740A DE3048740C2 (de) | 1979-12-27 | 1980-12-23 | Verfahren zum Herstellen einer feingerasterten Dickfilm-Leiterbahnenanordnung |
| GB8041120A GB2066583B (en) | 1979-12-27 | 1980-12-23 | Thick film conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16926879A JPS5694684A (en) | 1979-12-27 | 1979-12-27 | Thin film fine pattern and method of manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5694684A JPS5694684A (en) | 1981-07-31 |
| JPH0154874B2 true JPH0154874B2 (da) | 1989-11-21 |
Family
ID=15883350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16926879A Granted JPS5694684A (en) | 1979-12-27 | 1979-12-27 | Thin film fine pattern and method of manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5694684A (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015199116A1 (ja) * | 2014-06-26 | 2015-12-30 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0620019B2 (ja) * | 1986-12-16 | 1994-03-16 | 富士電機株式会社 | 微細線材コイルの取出し保持装置 |
| JP5231863B2 (ja) * | 2008-05-16 | 2013-07-10 | 東京応化工業株式会社 | 導電層を有する三次元構造物及び三次元金属構造物の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243976A (en) * | 1975-10-03 | 1977-04-06 | Sumitomo Bakelite Co | Method of producing printed circuit board |
-
1979
- 1979-12-27 JP JP16926879A patent/JPS5694684A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243976A (en) * | 1975-10-03 | 1977-04-06 | Sumitomo Bakelite Co | Method of producing printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015199116A1 (ja) * | 2014-06-26 | 2015-12-30 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
| JP2016009854A (ja) * | 2014-06-26 | 2016-01-18 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
| US10111330B2 (en) | 2014-06-26 | 2018-10-23 | Sumitomo Electric Printed Circuits, Inc. | Printed circuit board, electronic component, and method for producing printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5694684A (en) | 1981-07-31 |
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