JPH0241863Y2 - - Google Patents
Info
- Publication number
- JPH0241863Y2 JPH0241863Y2 JP1983067885U JP6788583U JPH0241863Y2 JP H0241863 Y2 JPH0241863 Y2 JP H0241863Y2 JP 1983067885 U JP1983067885 U JP 1983067885U JP 6788583 U JP6788583 U JP 6788583U JP H0241863 Y2 JPH0241863 Y2 JP H0241863Y2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- storage container
- opening
- package
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W72/30—
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- H10W70/682—
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- H10W70/685—
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- H10W72/01308—
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- H10W72/073—
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- H10W72/07311—
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- H10W72/07353—
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- H10W72/075—
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- H10W72/334—
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- H10W72/387—
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- H10W72/884—
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- H10W72/931—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983067885U JPS59173336U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983067885U JPS59173336U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59173336U JPS59173336U (ja) | 1984-11-19 |
| JPH0241863Y2 true JPH0241863Y2 (cg-RX-API-DMAC10.html) | 1990-11-08 |
Family
ID=30198069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983067885U Granted JPS59173336U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59173336U (cg-RX-API-DMAC10.html) |
-
1983
- 1983-05-06 JP JP1983067885U patent/JPS59173336U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59173336U (ja) | 1984-11-19 |
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