JPH0237097B2 - - Google Patents
Info
- Publication number
- JPH0237097B2 JPH0237097B2 JP57208892A JP20889282A JPH0237097B2 JP H0237097 B2 JPH0237097 B2 JP H0237097B2 JP 57208892 A JP57208892 A JP 57208892A JP 20889282 A JP20889282 A JP 20889282A JP H0237097 B2 JPH0237097 B2 JP H0237097B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring conductor
- members
- bumps
- conductor members
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 59
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Wire Bonding (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57208892A JPS5999794A (ja) | 1982-11-29 | 1982-11-29 | 厚膜回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57208892A JPS5999794A (ja) | 1982-11-29 | 1982-11-29 | 厚膜回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5999794A JPS5999794A (ja) | 1984-06-08 |
| JPH0237097B2 true JPH0237097B2 (US07943777-20110517-C00090.png) | 1990-08-22 |
Family
ID=16563849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57208892A Granted JPS5999794A (ja) | 1982-11-29 | 1982-11-29 | 厚膜回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5999794A (US07943777-20110517-C00090.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59163891A (ja) * | 1983-03-08 | 1984-09-14 | 富士通株式会社 | セラミツク配線板 |
| JPH0695519B2 (ja) * | 1985-12-26 | 1994-11-24 | 株式会社東芝 | バンプ形成方法 |
| JP2787230B2 (ja) * | 1989-07-29 | 1998-08-13 | イビデン株式会社 | 電子部品塔載用基板 |
| JP5110042B2 (ja) * | 2005-01-25 | 2012-12-26 | セイコーエプソン株式会社 | デバイス実装方法 |
| JP6508217B2 (ja) * | 2015-01-16 | 2019-05-08 | 株式会社村田製作所 | 基板、基板の製造方法及び弾性波装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259571A (en) * | 1975-11-11 | 1977-05-17 | Oki Electric Ind Co Ltd | Substrate for face down bonding |
| JPS54137661A (en) * | 1978-04-18 | 1979-10-25 | Ngk Spark Plug Co | Method of producing integrated circuit board |
-
1982
- 1982-11-29 JP JP57208892A patent/JPS5999794A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259571A (en) * | 1975-11-11 | 1977-05-17 | Oki Electric Ind Co Ltd | Substrate for face down bonding |
| JPS54137661A (en) * | 1978-04-18 | 1979-10-25 | Ngk Spark Plug Co | Method of producing integrated circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5999794A (ja) | 1984-06-08 |
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