JPH023629Y2 - - Google Patents

Info

Publication number
JPH023629Y2
JPH023629Y2 JP1984097571U JP9757184U JPH023629Y2 JP H023629 Y2 JPH023629 Y2 JP H023629Y2 JP 1984097571 U JP1984097571 U JP 1984097571U JP 9757184 U JP9757184 U JP 9757184U JP H023629 Y2 JPH023629 Y2 JP H023629Y2
Authority
JP
Japan
Prior art keywords
bonding
lead
lead frame
wire
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984097571U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6112237U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984097571U priority Critical patent/JPS6112237U/ja
Publication of JPS6112237U publication Critical patent/JPS6112237U/ja
Application granted granted Critical
Publication of JPH023629Y2 publication Critical patent/JPH023629Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP1984097571U 1984-06-27 1984-06-27 ボンデイング装置 Granted JPS6112237U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984097571U JPS6112237U (ja) 1984-06-27 1984-06-27 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984097571U JPS6112237U (ja) 1984-06-27 1984-06-27 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6112237U JPS6112237U (ja) 1986-01-24
JPH023629Y2 true JPH023629Y2 (enExample) 1990-01-29

Family

ID=30657127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984097571U Granted JPS6112237U (ja) 1984-06-27 1984-06-27 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6112237U (enExample)

Also Published As

Publication number Publication date
JPS6112237U (ja) 1986-01-24

Similar Documents

Publication Publication Date Title
US5976964A (en) Method of improving interconnect of semiconductor device by utilizing a flattened ball bond
JP4860128B2 (ja) ワイヤボンディング方法
JPS61125062A (ja) ピン取付け方法およびピン取付け装置
US5611478A (en) Lead frame clamp for ultrasonic bonding
KR100721280B1 (ko) 반도체 칩 조립체의 형성 방법과 기판 상의 회로로부터반도체 칩으로 와이어 본드부를 형성하는 장치
JPS60167454A (ja) 半導体装置
JPH023629Y2 (enExample)
JP3670371B2 (ja) 半導体装置およびその製造方法
JPH08153748A (ja) シングルポイントボンディング方法
KR200153438Y1 (ko) 탭테이프를 이용한 칩스케일 패키지
KR100721274B1 (ko) 반도체 칩 조립체의 형성 방법
JPH0732216B2 (ja) 半導体装置
JPH0238448Y2 (enExample)
JP2007109749A (ja) リードフレーム及び該リードフレームを使用した半導体装置
JPS63160262A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
KR200292328Y1 (ko) 반도체 패키지
JP3801397B2 (ja) 半導体装置の実装基板及び半導体装置実装体
JPH0642348Y2 (ja) 半導体装置
JPH0888249A (ja) フェイスダウンボンディング方法
JP2004335947A (ja) 半導体装置及び半導体装置の作製方法
JPS61131464A (ja) ワイヤボンデイング方法
JP2004063868A (ja) 半導体装置の製造方法
JP2564595B2 (ja) 半導体装置の製造方法
CN201051497Y (zh) 封装前的焊线架结构及其半导体功率晶体封装结构
JP3257266B2 (ja) 半導体装置