JPH0236278Y2 - - Google Patents

Info

Publication number
JPH0236278Y2
JPH0236278Y2 JP1984059024U JP5902484U JPH0236278Y2 JP H0236278 Y2 JPH0236278 Y2 JP H0236278Y2 JP 1984059024 U JP1984059024 U JP 1984059024U JP 5902484 U JP5902484 U JP 5902484U JP H0236278 Y2 JPH0236278 Y2 JP H0236278Y2
Authority
JP
Japan
Prior art keywords
plating
gold
silver
wire bonding
gold plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984059024U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60172360U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5902484U priority Critical patent/JPS60172360U/ja
Publication of JPS60172360U publication Critical patent/JPS60172360U/ja
Application granted granted Critical
Publication of JPH0236278Y2 publication Critical patent/JPH0236278Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP5902484U 1984-04-20 1984-04-20 プリント基板 Granted JPS60172360U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5902484U JPS60172360U (ja) 1984-04-20 1984-04-20 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5902484U JPS60172360U (ja) 1984-04-20 1984-04-20 プリント基板

Publications (2)

Publication Number Publication Date
JPS60172360U JPS60172360U (ja) 1985-11-15
JPH0236278Y2 true JPH0236278Y2 (pm) 1990-10-03

Family

ID=30585064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5902484U Granted JPS60172360U (ja) 1984-04-20 1984-04-20 プリント基板

Country Status (1)

Country Link
JP (1) JPS60172360U (pm)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011102040A1 (ja) 2010-02-19 2011-08-25 旭硝子株式会社 素子搭載用基板およびその製造方法
WO2011138949A1 (ja) 2010-05-07 2011-11-10 旭硝子株式会社 素子搭載用基板およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879253U (pm) * 1971-12-29 1973-09-28
JPS6138187Y2 (pm) * 1981-04-07 1986-11-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011102040A1 (ja) 2010-02-19 2011-08-25 旭硝子株式会社 素子搭載用基板およびその製造方法
WO2011138949A1 (ja) 2010-05-07 2011-11-10 旭硝子株式会社 素子搭載用基板およびその製造方法

Also Published As

Publication number Publication date
JPS60172360U (ja) 1985-11-15

Similar Documents

Publication Publication Date Title
JPH0236278Y2 (pm)
JPS6050343B2 (ja) 半導体装置製造用リ−ドフレ−ム
JPS5998545A (ja) 半導体装置
JPH06177315A (ja) 多層リードフレーム
JP2756791B2 (ja) 樹脂封止型半導体装置
JP2743157B2 (ja) 樹脂封止型半導体装置
JP2652222B2 (ja) 電子部品搭載用基板
JPH0225251Y2 (pm)
JPH0222992Y2 (pm)
JPS6290938A (ja) 半導体装置
JPH0143872Y2 (pm)
JPS63147339A (ja) 半導体装置
JPH0719797B2 (ja) 半導体装置の実装具
JP2549278Y2 (ja) 混成集積回路基板
JPH04119653A (ja) 集積回路素子
JPS6234466Y2 (pm)
JPH0466384B2 (pm)
JP2542227B2 (ja) 混成ｉｃ基板装置
JPS6393124A (ja) Ｌｓｉチツプの接続方式
JPS6344991Y2 (pm)
JPS62249435A (ja) 半導体装置
JPH02159033A (ja) 半導体装置
JPS6292354A (ja) ハイブリツドｉｃ
JPS6276744A (ja) 集積回路用容器
JPS62180738U (pm)