JPH0235477B2 - - Google Patents

Info

Publication number
JPH0235477B2
JPH0235477B2 JP56005708A JP570881A JPH0235477B2 JP H0235477 B2 JPH0235477 B2 JP H0235477B2 JP 56005708 A JP56005708 A JP 56005708A JP 570881 A JP570881 A JP 570881A JP H0235477 B2 JPH0235477 B2 JP H0235477B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
lamination
frame
laminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56005708A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57118698A (en
Inventor
Kohei Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP570881A priority Critical patent/JPS57118698A/ja
Publication of JPS57118698A publication Critical patent/JPS57118698A/ja
Publication of JPH0235477B2 publication Critical patent/JPH0235477B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP570881A 1981-01-16 1981-01-16 Method of laminating multilayer printed board Granted JPS57118698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP570881A JPS57118698A (en) 1981-01-16 1981-01-16 Method of laminating multilayer printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP570881A JPS57118698A (en) 1981-01-16 1981-01-16 Method of laminating multilayer printed board

Publications (2)

Publication Number Publication Date
JPS57118698A JPS57118698A (en) 1982-07-23
JPH0235477B2 true JPH0235477B2 (cs) 1990-08-10

Family

ID=11618609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP570881A Granted JPS57118698A (en) 1981-01-16 1981-01-16 Method of laminating multilayer printed board

Country Status (1)

Country Link
JP (1) JPS57118698A (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6062194A (ja) * 1983-09-14 1985-04-10 松下電工株式会社 多層印刷配線板の製造方法
JPS63209840A (ja) * 1987-02-26 1988-08-31 東芝ケミカル株式会社 多層プリント基板の製造装置
JPH01139229A (ja) * 1987-11-25 1989-05-31 Nec Corp 多層印刷配線板の製造方法
JPH01190436A (ja) * 1988-01-26 1989-07-31 Toppan Printing Co Ltd 多層プリント配線板の製造方法
CN115946433A (zh) * 2022-12-26 2023-04-11 深圳市华芯微测技术有限公司 一种多层陶瓷基板的制作方法以及真空压合装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043856U (cs) * 1973-08-22 1975-05-02

Also Published As

Publication number Publication date
JPS57118698A (en) 1982-07-23

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