JPH0234463B2 - - Google Patents
Info
- Publication number
- JPH0234463B2 JPH0234463B2 JP57231126A JP23112682A JPH0234463B2 JP H0234463 B2 JPH0234463 B2 JP H0234463B2 JP 57231126 A JP57231126 A JP 57231126A JP 23112682 A JP23112682 A JP 23112682A JP H0234463 B2 JPH0234463 B2 JP H0234463B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- terminals
- electrode
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57231126A JPS59117147A (ja) | 1982-12-23 | 1982-12-23 | 複合電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57231126A JPS59117147A (ja) | 1982-12-23 | 1982-12-23 | 複合電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59117147A JPS59117147A (ja) | 1984-07-06 |
| JPH0234463B2 true JPH0234463B2 (enExample) | 1990-08-03 |
Family
ID=16918687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57231126A Granted JPS59117147A (ja) | 1982-12-23 | 1982-12-23 | 複合電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117147A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59151445A (ja) * | 1983-02-17 | 1984-08-29 | Rohm Co Ltd | 半導体装置 |
| US5138438A (en) * | 1987-06-24 | 1992-08-11 | Akita Electronics Co. Ltd. | Lead connections means for stacked tab packaged IC chips |
| KR100325290B1 (ko) * | 1999-05-20 | 2002-02-21 | 김영환 | 초고집적회로 비·엘·피 스택 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142507A (ja) * | 1982-02-19 | 1983-08-24 | Hitachi Metals Ltd | 希土類コバルト磁石の製造方法 |
-
1982
- 1982-12-23 JP JP57231126A patent/JPS59117147A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59117147A (ja) | 1984-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5880926A (en) | Electronic device with mounting structure | |
| JP2003068531A (ja) | インダクタ及びインダクタの製造方法 | |
| JPH11288751A (ja) | プリント配線基板への端子の取付構造 | |
| JPH0234463B2 (enExample) | ||
| US5097389A (en) | Structure for fixing feedthrough capacitor in high-frequency device and manufacturing method of high-frequency device | |
| JPH0529122U (ja) | チツプ形電子部品 | |
| JPH0338845Y2 (enExample) | ||
| JPH066027A (ja) | 回路モジュールの製造方法 | |
| JP3365426B2 (ja) | チップ型電子部品 | |
| CN223986739U (zh) | 贴片式端子及磁性器件 | |
| JP5693387B2 (ja) | コネクタ | |
| JP2858252B2 (ja) | 表面実装用電子部品の電極構造 | |
| JP3853029B2 (ja) | 電子部品 | |
| JPH0661415A (ja) | 電子回路装置およびその製造方法 | |
| JP2559104Y2 (ja) | 表面実装用コネクタ | |
| JP3758002B2 (ja) | 電子部品 | |
| JPH0576029U (ja) | 電子部品 | |
| JP3157975B2 (ja) | ラダー型フィルタ | |
| JPS6314470Y2 (enExample) | ||
| JPH081585Y2 (ja) | 表面実装用コネクタ | |
| JP4787718B2 (ja) | タブ端子 | |
| JPH0440283Y2 (enExample) | ||
| JP2001338841A (ja) | チップコンデンサ | |
| JP2873101B2 (ja) | 基板接続装置 | |
| JPH113696A (ja) | 電池の端子 |