JPH0231797Y2 - - Google Patents
Info
- Publication number
- JPH0231797Y2 JPH0231797Y2 JP1983108943U JP10894383U JPH0231797Y2 JP H0231797 Y2 JPH0231797 Y2 JP H0231797Y2 JP 1983108943 U JP1983108943 U JP 1983108943U JP 10894383 U JP10894383 U JP 10894383U JP H0231797 Y2 JPH0231797 Y2 JP H0231797Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- component
- lead
- solder
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000010354 integration Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10894383U JPS6018578U (ja) | 1983-07-15 | 1983-07-15 | 湿式多層セラミツク基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10894383U JPS6018578U (ja) | 1983-07-15 | 1983-07-15 | 湿式多層セラミツク基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6018578U JPS6018578U (ja) | 1985-02-07 |
| JPH0231797Y2 true JPH0231797Y2 (US20090163788A1-20090625-C00002.png) | 1990-08-28 |
Family
ID=30253973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10894383U Granted JPS6018578U (ja) | 1983-07-15 | 1983-07-15 | 湿式多層セラミツク基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6018578U (US20090163788A1-20090625-C00002.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61216394A (ja) * | 1986-03-26 | 1986-09-26 | イビデン株式会社 | Ｉｃカード用多層プリント配線基板 |
| JP2766146B2 (ja) * | 1992-10-29 | 1998-06-18 | 京セラ株式会社 | コンデンサ内蔵多層回路基板 |
| JP2016082074A (ja) * | 2014-10-17 | 2016-05-16 | ダイキン工業株式会社 | 電装装置およびその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4853256A (US20090163788A1-20090625-C00002.png) * | 1971-11-08 | 1973-07-26 | ||
| JPS5032473A (US20090163788A1-20090625-C00002.png) * | 1973-07-30 | 1975-03-29 | ||
| JPS57143891A (en) * | 1981-03-02 | 1982-09-06 | Hitachi Ltd | Multilayer circuit board |
-
1983
- 1983-07-15 JP JP10894383U patent/JPS6018578U/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4853256A (US20090163788A1-20090625-C00002.png) * | 1971-11-08 | 1973-07-26 | ||
| JPS5032473A (US20090163788A1-20090625-C00002.png) * | 1973-07-30 | 1975-03-29 | ||
| JPS57143891A (en) * | 1981-03-02 | 1982-09-06 | Hitachi Ltd | Multilayer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6018578U (ja) | 1985-02-07 |
