JPH0231519B2 - - Google Patents

Info

Publication number
JPH0231519B2
JPH0231519B2 JP61183519A JP18351986A JPH0231519B2 JP H0231519 B2 JPH0231519 B2 JP H0231519B2 JP 61183519 A JP61183519 A JP 61183519A JP 18351986 A JP18351986 A JP 18351986A JP H0231519 B2 JPH0231519 B2 JP H0231519B2
Authority
JP
Japan
Prior art keywords
particles
aluminum
conductive
shielding material
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61183519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6285500A (ja
Inventor
Uinsento Tsuengu Uennshan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOMERITSUKUSU Inc
Original Assignee
KOMERITSUKUSU Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOMERITSUKUSU Inc filed Critical KOMERITSUKUSU Inc
Publication of JPS6285500A publication Critical patent/JPS6285500A/ja
Publication of JPH0231519B2 publication Critical patent/JPH0231519B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/04Fixed joints
    • H01P1/042Hollow waveguide joints
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005Conductive
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12028Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049Nonmetal component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674Ge- or Si-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12715Next to Group IB metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12722Next to Group VIII metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736Al-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736Al-base component
    • Y10T428/12743Next to refractory [Group IVB, VB, or VIB] metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736Al-base component
    • Y10T428/1275Next to Group VIII or IB metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electromagnetism (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Sealing Material Composition (AREA)
JP61183519A 1985-08-06 1986-08-06 電磁気干渉シ−ルデイング材 Granted JPS6285500A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/762,962 US4678716A (en) 1985-08-06 1985-08-06 Electromagnetic shielding
US762962 1985-08-06

Publications (2)

Publication Number Publication Date
JPS6285500A JPS6285500A (ja) 1987-04-18
JPH0231519B2 true JPH0231519B2 (en, 2012) 1990-07-13

Family

ID=25066522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61183519A Granted JPS6285500A (ja) 1985-08-06 1986-08-06 電磁気干渉シ−ルデイング材

Country Status (6)

Country Link
US (1) US4678716A (en, 2012)
EP (2) EP0213762B1 (en, 2012)
JP (1) JPS6285500A (en, 2012)
AT (2) ATE69907T1 (en, 2012)
CA (1) CA1278420C (en, 2012)
DE (2) DE3650280T2 (en, 2012)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734140A (en) * 1985-08-06 1988-03-29 Chomerics, Inc. Heat treatment of electromagnetic shielding composition
DE3620172A1 (de) * 1986-06-14 1987-12-17 Vacuumschmelze Gmbh Abschirmhuelle aus elektrisch leitenden elementen
US4780575A (en) * 1987-05-14 1988-10-25 Flavin John W Electrically conductive elastomer composition
EP0591126A4 (en) * 1988-08-29 1995-09-06 Marian J Ostolski Process for making noble metal coated metallic particles, and resulting conductive materials
US4948922A (en) * 1988-09-15 1990-08-14 The Pennsylvania State University Electromagnetic shielding and absorptive materials
US5399432A (en) * 1990-06-08 1995-03-21 Potters Industries, Inc. Galvanically compatible conductive filler and methods of making same
US5175056A (en) * 1990-06-08 1992-12-29 Potters Industries, Inc. Galvanically compatible conductive filler
US5115140A (en) * 1991-01-24 1992-05-19 Progressive Products, Inc. EMR/RFR/MWR body shield composition
US5186635A (en) * 1992-03-24 1993-02-16 United Technologies Corporation Electrical connector assembly with EMI protection
US5791654A (en) * 1992-08-19 1998-08-11 The Boeing Company Corrosion resistant gasket in combination with aircraft antenna
US6719293B1 (en) * 1992-08-19 2004-04-13 The Boeing Company Corrosion resistant gasket for aircraft
US6454267B1 (en) * 1992-08-19 2002-09-24 The Boeing Company Corrosion resistant gasket for aircraft
US6454276B2 (en) * 1992-08-19 2002-09-24 The Boeing Company Corrosion resistant gasket for aircraft
US5401914A (en) * 1993-02-03 1995-03-28 The Curran Company Vent for shielded enclosures
CA2129073C (en) 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US6303180B1 (en) 1993-09-10 2001-10-16 Parker-Hannifin Corporation Form-in-place EMI gaskets
US5519168A (en) * 1993-10-12 1996-05-21 Owens; William M. Electromagnetic interference shielding
US5641438A (en) * 1995-01-24 1997-06-24 Bunyan; Michael H. Method for forming an EMI shielding gasket
US6635354B2 (en) 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
US5910524A (en) * 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
DE19617656A1 (de) * 1996-05-03 1997-11-06 Siegfried Schaal Metallveredel Abschirm-Formteil für elektronische Bauelemente
JP2000106197A (ja) * 1998-09-30 2000-04-11 Aisin Takaoka Ltd 燃料電池及び燃料電池用セパレータ
US6646199B2 (en) 1999-10-20 2003-11-11 Chemque, Inc. Polymeric foam gaskets and seals
US6483719B1 (en) * 2000-03-21 2002-11-19 Spraylat Corporation Conforming shielded form for electronic component assemblies
US20040053055A1 (en) * 2002-07-03 2004-03-18 Robinson John W. Rubber toughened epoxy resins for resin infusion processing, methods of using the resins and articles made therefrom
JP2007523263A (ja) * 2004-02-17 2007-08-16 タイコ・プリンテッド・サーキット・グループ・リミテッド・パートナーシップ アルミニウムへの電気メッキ方法
US20060047053A1 (en) * 2004-08-27 2006-03-02 Ivan Pawlenko Thermoconductive composition for RF shielding
US7355857B2 (en) 2006-02-07 2008-04-08 Methode Electronics, Inc. Heat sink gasket
US20090280326A1 (en) * 2006-04-12 2009-11-12 Thomas Giesenberg Process for the Treatment of Metal Coated Particles
WO2009158045A1 (en) * 2008-06-23 2009-12-30 Parker-Hannifin Corporation Emi shielding materials
CA2704683A1 (en) * 2010-05-28 2010-08-12 Ibm Canada Limited - Ibm Canada Limitee Grounded lid for micro-electronic assemblies
KR101319488B1 (ko) * 2012-01-06 2013-10-17 한국전자통신연구원 전자파 차폐 구조를 위한 환기구 구조체
ES2684721T3 (es) * 2013-04-02 2018-10-04 Heraeus Deutschland GmbH & Co. KG Partículas que comprenden AI, Si y Mg en pastas electroconductoras y preparación de células fotovoltaicas
JP6230022B2 (ja) * 2014-02-27 2017-11-15 国立大学法人秋田大学 Ag被覆Al−Si合金粒子及びその製造方法、並びに、導電性ペースト
JP2023551445A (ja) * 2020-11-20 2023-12-08 エリコン メテコ(ユーエス)インコーポレイテッド 改良されたマイクロ波遮蔽性能を有する導電性フィラー
CN113020587B (zh) * 2021-02-09 2022-12-30 哈尔滨工业大学(深圳) 银包铜粉的制备方法
CN114916217B (zh) * 2022-05-30 2023-08-29 中国电子科技集团公司第二十九研究所 一种高屏蔽效能的带自粘胶型导电密封衬垫

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3194860A (en) * 1962-10-02 1965-07-13 John E Ehrreich Manufacture of reinforced conductive plastic gaskets
US3140342A (en) * 1963-07-05 1964-07-07 Chomerics Inc Electrical shielding and sealing gasket
US3202488A (en) * 1964-03-04 1965-08-24 Chomerics Inc Silver-plated copper powder
US3476530A (en) * 1966-06-10 1969-11-04 Chomerics Inc Iron based conductive filler for plastics
US4030892A (en) * 1976-03-02 1977-06-21 Allied Chemical Corporation Flexible electromagnetic shield comprising interlaced glassy alloy filaments
US4076652A (en) * 1976-05-24 1978-02-28 E. I. Du Pont De Nemours And Company Elastic resistor compositions containing metallic-conductive particles and conductive lubricant particles
US4189618A (en) * 1978-07-31 1980-02-19 Allied Chemical Corporation Electromagnetic shielding envelopes from wound glassy metal filaments
US4174419A (en) * 1978-11-08 1979-11-13 Allied Chemical Corporation Stabilized magnetic shields
US4305847A (en) * 1979-07-26 1981-12-15 Acheson Industries, Inc. Copper coating composition for shielding electronic equipment and the like
US4316944A (en) * 1980-06-18 1982-02-23 United Technologies Corporation Noble metal-chromium alloy catalysts and electrochemical cell
US4507359A (en) * 1980-12-22 1985-03-26 Chomerics, Inc. Electromagnetic shielding
US4434541A (en) * 1980-12-22 1984-03-06 Chomerics, Inc. Electromagnetic shielding
US4404125A (en) * 1981-10-14 1983-09-13 General Electric Company Polyphenylene ether resin compositions for EMI electromagnetic interference shielding
US4442182A (en) * 1982-05-26 1984-04-10 Teledyne Penn-Union One-piece, composite electrical connector
JPS6042442A (ja) * 1983-08-19 1985-03-06 Nippon Oil Co Ltd 導電性樹脂組成物
JPS6099182A (ja) * 1983-11-04 1985-06-03 Atsugi Chuo Kenkyusho Kk シアノアクリレート混合用金属粉

Also Published As

Publication number Publication date
EP0424977A2 (en) 1991-05-02
EP0424977A3 (en) 1991-07-03
CA1278420C (en) 1991-01-02
DE3650280T2 (de) 1995-08-10
EP0213762B1 (en) 1991-11-27
DE3682635D1 (de) 1992-01-09
EP0213762A3 (en) 1987-11-04
JPS6285500A (ja) 1987-04-18
DE3650280D1 (de) 1995-04-27
ATE120301T1 (de) 1995-04-15
EP0424977B1 (en) 1995-03-22
EP0213762A2 (en) 1987-03-11
US4678716A (en) 1987-07-07
ATE69907T1 (de) 1991-12-15

Similar Documents

Publication Publication Date Title
JPH0231519B2 (en, 2012)
US4434541A (en) Electromagnetic shielding
US4507359A (en) Electromagnetic shielding
EP0162979B1 (en) Electrically conductive microballoons and compositions incorporating same
JP3727069B2 (ja) 錫被覆電気コネクタ
US4734140A (en) Heat treatment of electromagnetic shielding composition
JPH08250865A (ja) 電子ハウジングの製作に利用するシート上での金属ウイスカの形成を防止することにより電子ハウジングの信頼性をより高くする方法
EP0277640B1 (en) Zn-based composite-plated metallic material and plating method
US4769280A (en) Electromagnetic shielding
EP0101936B1 (en) Boride-dispersed alloy material and process for manufacturing same
CA1205604A (en) Electroless direct deposition of gold on metallized ceramics
US3505181A (en) Treatment of titanium surfaces
EP0199132B1 (de) Verfahren zur nasschemischen Herstellung einer Metallschicht
GB2047275A (en) Bath for electrolytic deposition of silver or silver alloy layers
JPH0565600B2 (en, 2012)
JPH06299363A (ja) 錫めっき方法
Tzeng Electromagnetic shielding
JPS6146553B2 (en, 2012)
SU1693119A1 (ru) Раствор дл травлени поверхности ударопрочного полистирола перед химической металлизацией
JPH032952B2 (en, 2012)
KR800001622B1 (ko) 리이드 프레임용 금속 스트립
WO1986007205A1 (en) Nickel-based electrical contact device
JPS62191451A (ja) 非晶質鉱物繊維複合材の製造方法
JPS62151598A (ja) 銀−パラジウム複合めつき方法
JP2004068086A (ja) アルミニウム合金および電子デバイス

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees