CA1278420C - Electromagnetic shielding - Google Patents
Electromagnetic shieldingInfo
- Publication number
- CA1278420C CA1278420C CA000515441A CA515441A CA1278420C CA 1278420 C CA1278420 C CA 1278420C CA 000515441 A CA000515441 A CA 000515441A CA 515441 A CA515441 A CA 515441A CA 1278420 C CA1278420 C CA 1278420C
- Authority
- CA
- Canada
- Prior art keywords
- accordance
- percent
- particle
- electrically conductive
- shielding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000676 Si alloy Inorganic materials 0.000 claims abstract 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- 239000011701 zinc Substances 0.000 claims description 12
- 239000011135 tin Substances 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims 3
- 229910052753 mercury Inorganic materials 0.000 claims 3
- 229910052763 palladium Inorganic materials 0.000 claims 3
- 229910052697 platinum Inorganic materials 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 239000011231 conductive filler Substances 0.000 claims 1
- 239000006023 eutectic alloy Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 150000002500 ions Chemical class 0.000 description 19
- 239000000843 powder Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 241000282461 Canis lupus Species 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 101100536354 Drosophila melanogaster tant gene Proteins 0.000 description 2
- 101150039033 Eci2 gene Proteins 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- LFVLUOAHQIVABZ-UHFFFAOYSA-N Iodofenphos Chemical compound COP(=S)(OC)OC1=CC(Cl)=C(I)C=C1Cl LFVLUOAHQIVABZ-UHFFFAOYSA-N 0.000 description 2
- 101100409194 Rattus norvegicus Ppargc1b gene Proteins 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- -1 pl~tinum Chemical compound 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 102100038740 Activator of RNA decay Human genes 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000256844 Apis mellifera Species 0.000 description 1
- 241000861718 Chloris <Aves> Species 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- 241001464057 Electroma Species 0.000 description 1
- 244000228957 Ferula foetida Species 0.000 description 1
- 241001634830 Geometridae Species 0.000 description 1
- 241000448472 Gramma Species 0.000 description 1
- 101000741919 Homo sapiens Activator of RNA decay Proteins 0.000 description 1
- 241000019008 Hyda Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241001072332 Monia Species 0.000 description 1
- 101100490488 Mus musculus Add3 gene Proteins 0.000 description 1
- 101100337974 Mus musculus Gsdmc gene Proteins 0.000 description 1
- 241000669618 Nothes Species 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 241000022563 Rema Species 0.000 description 1
- 201000010001 Silicosis Diseases 0.000 description 1
- 241000364027 Sinoe Species 0.000 description 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 1
- 241001000594 Tanna Species 0.000 description 1
- 241000534944 Thia Species 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229940037003 alum Drugs 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- JXSJBGJIGXNWCI-UHFFFAOYSA-N diethyl 2-[(dimethoxyphosphorothioyl)thio]succinate Chemical compound CCOC(=O)CC(SP(=S)(OC)OC)C(=O)OCC JXSJBGJIGXNWCI-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- XVQUOJBERHHONY-UHFFFAOYSA-N isometheptene Chemical compound CNC(C)CCC=C(C)C XVQUOJBERHHONY-UHFFFAOYSA-N 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229940061319 ovide Drugs 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000021251 pulses Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- 101150019895 thiE gene Proteins 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/042—Hollow waveguide joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/12743—Next to refractory [Group IVB, VB, or VIB] metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/1275—Next to Group VIII or IB metal-base component
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Composite Materials (AREA)
- Dispersion Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Sealing Material Composition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA000615868A CA1295123C (en) | 1985-08-06 | 1990-09-19 | Electromagnetic shielding |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/762962 | 1985-08-06 | ||
| US06/762,962 US4678716A (en) | 1985-08-06 | 1985-08-06 | Electromagnetic shielding |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000615868A Division CA1295123C (en) | 1985-08-06 | 1990-09-19 | Electromagnetic shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1278420C true CA1278420C (en) | 1991-01-02 |
Family
ID=25066522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000515441A Expired - Lifetime CA1278420C (en) | 1985-08-06 | 1986-08-06 | Electromagnetic shielding |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4678716A (en, 2012) |
| EP (2) | EP0213762B1 (en, 2012) |
| JP (1) | JPS6285500A (en, 2012) |
| AT (2) | ATE69907T1 (en, 2012) |
| CA (1) | CA1278420C (en, 2012) |
| DE (2) | DE3650280T2 (en, 2012) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4734140A (en) * | 1985-08-06 | 1988-03-29 | Chomerics, Inc. | Heat treatment of electromagnetic shielding composition |
| DE3620172A1 (de) * | 1986-06-14 | 1987-12-17 | Vacuumschmelze Gmbh | Abschirmhuelle aus elektrisch leitenden elementen |
| US4780575A (en) * | 1987-05-14 | 1988-10-25 | Flavin John W | Electrically conductive elastomer composition |
| EP0591126A4 (en) * | 1988-08-29 | 1995-09-06 | Marian J Ostolski | Process for making noble metal coated metallic particles, and resulting conductive materials |
| US4948922A (en) * | 1988-09-15 | 1990-08-14 | The Pennsylvania State University | Electromagnetic shielding and absorptive materials |
| US5399432A (en) * | 1990-06-08 | 1995-03-21 | Potters Industries, Inc. | Galvanically compatible conductive filler and methods of making same |
| US5175056A (en) * | 1990-06-08 | 1992-12-29 | Potters Industries, Inc. | Galvanically compatible conductive filler |
| US5115140A (en) * | 1991-01-24 | 1992-05-19 | Progressive Products, Inc. | EMR/RFR/MWR body shield composition |
| US5186635A (en) * | 1992-03-24 | 1993-02-16 | United Technologies Corporation | Electrical connector assembly with EMI protection |
| US5791654A (en) * | 1992-08-19 | 1998-08-11 | The Boeing Company | Corrosion resistant gasket in combination with aircraft antenna |
| US6719293B1 (en) * | 1992-08-19 | 2004-04-13 | The Boeing Company | Corrosion resistant gasket for aircraft |
| US6454267B1 (en) * | 1992-08-19 | 2002-09-24 | The Boeing Company | Corrosion resistant gasket for aircraft |
| US6454276B2 (en) * | 1992-08-19 | 2002-09-24 | The Boeing Company | Corrosion resistant gasket for aircraft |
| US5401914A (en) * | 1993-02-03 | 1995-03-28 | The Curran Company | Vent for shielded enclosures |
| CA2129073C (en) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| US6303180B1 (en) | 1993-09-10 | 2001-10-16 | Parker-Hannifin Corporation | Form-in-place EMI gaskets |
| US5519168A (en) * | 1993-10-12 | 1996-05-21 | Owens; William M. | Electromagnetic interference shielding |
| US5641438A (en) * | 1995-01-24 | 1997-06-24 | Bunyan; Michael H. | Method for forming an EMI shielding gasket |
| US6635354B2 (en) | 1995-01-20 | 2003-10-21 | Parker-Hannifin Corporation | Form-in place EMI gaskets |
| US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
| DE19617656A1 (de) * | 1996-05-03 | 1997-11-06 | Siegfried Schaal Metallveredel | Abschirm-Formteil für elektronische Bauelemente |
| JP2000106197A (ja) * | 1998-09-30 | 2000-04-11 | Aisin Takaoka Ltd | 燃料電池及び燃料電池用セパレータ |
| US6646199B2 (en) | 1999-10-20 | 2003-11-11 | Chemque, Inc. | Polymeric foam gaskets and seals |
| US6483719B1 (en) * | 2000-03-21 | 2002-11-19 | Spraylat Corporation | Conforming shielded form for electronic component assemblies |
| US20040053055A1 (en) * | 2002-07-03 | 2004-03-18 | Robinson John W. | Rubber toughened epoxy resins for resin infusion processing, methods of using the resins and articles made therefrom |
| JP2007523263A (ja) * | 2004-02-17 | 2007-08-16 | タイコ・プリンテッド・サーキット・グループ・リミテッド・パートナーシップ | アルミニウムへの電気メッキ方法 |
| US20060047053A1 (en) * | 2004-08-27 | 2006-03-02 | Ivan Pawlenko | Thermoconductive composition for RF shielding |
| US7355857B2 (en) | 2006-02-07 | 2008-04-08 | Methode Electronics, Inc. | Heat sink gasket |
| US20090280326A1 (en) * | 2006-04-12 | 2009-11-12 | Thomas Giesenberg | Process for the Treatment of Metal Coated Particles |
| WO2009158045A1 (en) * | 2008-06-23 | 2009-12-30 | Parker-Hannifin Corporation | Emi shielding materials |
| CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
| KR101319488B1 (ko) * | 2012-01-06 | 2013-10-17 | 한국전자통신연구원 | 전자파 차폐 구조를 위한 환기구 구조체 |
| ES2684721T3 (es) * | 2013-04-02 | 2018-10-04 | Heraeus Deutschland GmbH & Co. KG | Partículas que comprenden AI, Si y Mg en pastas electroconductoras y preparación de células fotovoltaicas |
| JP6230022B2 (ja) * | 2014-02-27 | 2017-11-15 | 国立大学法人秋田大学 | Ａｇ被覆Ａｌ−Ｓｉ合金粒子及びその製造方法、並びに、導電性ペースト |
| JP2023551445A (ja) * | 2020-11-20 | 2023-12-08 | エリコン メテコ（ユーエス）インコーポレイテッド | 改良されたマイクロ波遮蔽性能を有する導電性フィラー |
| CN113020587B (zh) * | 2021-02-09 | 2022-12-30 | 哈尔滨工业大学（深圳） | 银包铜粉的制备方法 |
| CN114916217B (zh) * | 2022-05-30 | 2023-08-29 | 中国电子科技集团公司第二十九研究所 | 一种高屏蔽效能的带自粘胶型导电密封衬垫 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3194860A (en) * | 1962-10-02 | 1965-07-13 | John E Ehrreich | Manufacture of reinforced conductive plastic gaskets |
| US3140342A (en) * | 1963-07-05 | 1964-07-07 | Chomerics Inc | Electrical shielding and sealing gasket |
| US3202488A (en) * | 1964-03-04 | 1965-08-24 | Chomerics Inc | Silver-plated copper powder |
| US3476530A (en) * | 1966-06-10 | 1969-11-04 | Chomerics Inc | Iron based conductive filler for plastics |
| US4030892A (en) * | 1976-03-02 | 1977-06-21 | Allied Chemical Corporation | Flexible electromagnetic shield comprising interlaced glassy alloy filaments |
| US4076652A (en) * | 1976-05-24 | 1978-02-28 | E. I. Du Pont De Nemours And Company | Elastic resistor compositions containing metallic-conductive particles and conductive lubricant particles |
| US4189618A (en) * | 1978-07-31 | 1980-02-19 | Allied Chemical Corporation | Electromagnetic shielding envelopes from wound glassy metal filaments |
| US4174419A (en) * | 1978-11-08 | 1979-11-13 | Allied Chemical Corporation | Stabilized magnetic shields |
| US4305847A (en) * | 1979-07-26 | 1981-12-15 | Acheson Industries, Inc. | Copper coating composition for shielding electronic equipment and the like |
| US4316944A (en) * | 1980-06-18 | 1982-02-23 | United Technologies Corporation | Noble metal-chromium alloy catalysts and electrochemical cell |
| US4507359A (en) * | 1980-12-22 | 1985-03-26 | Chomerics, Inc. | Electromagnetic shielding |
| US4434541A (en) * | 1980-12-22 | 1984-03-06 | Chomerics, Inc. | Electromagnetic shielding |
| US4404125A (en) * | 1981-10-14 | 1983-09-13 | General Electric Company | Polyphenylene ether resin compositions for EMI electromagnetic interference shielding |
| US4442182A (en) * | 1982-05-26 | 1984-04-10 | Teledyne Penn-Union | One-piece, composite electrical connector |
| JPS6042442A (ja) * | 1983-08-19 | 1985-03-06 | Nippon Oil Co Ltd | 導電性樹脂組成物 |
| JPS6099182A (ja) * | 1983-11-04 | 1985-06-03 | Atsugi Chuo Kenkyusho Kk | シアノアクリレート混合用金属粉 |
-
1985
- 1985-08-06 US US06/762,962 patent/US4678716A/en not_active Expired - Lifetime
-
1986
- 1986-08-01 DE DE3650280T patent/DE3650280T2/de not_active Expired - Fee Related
- 1986-08-01 EP EP86305928A patent/EP0213762B1/en not_active Expired - Lifetime
- 1986-08-01 DE DE8686305928T patent/DE3682635D1/de not_active Expired - Lifetime
- 1986-08-01 EP EP90121272A patent/EP0424977B1/en not_active Expired - Lifetime
- 1986-08-01 AT AT86305928T patent/ATE69907T1/de not_active IP Right Cessation
- 1986-08-01 AT AT90121272T patent/ATE120301T1/de not_active IP Right Cessation
- 1986-08-06 JP JP61183519A patent/JPS6285500A/ja active Granted
- 1986-08-06 CA CA000515441A patent/CA1278420C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0424977A2 (en) | 1991-05-02 |
| EP0424977A3 (en) | 1991-07-03 |
| JPH0231519B2 (en, 2012) | 1990-07-13 |
| DE3650280T2 (de) | 1995-08-10 |
| EP0213762B1 (en) | 1991-11-27 |
| DE3682635D1 (de) | 1992-01-09 |
| EP0213762A3 (en) | 1987-11-04 |
| JPS6285500A (ja) | 1987-04-18 |
| DE3650280D1 (de) | 1995-04-27 |
| ATE120301T1 (de) | 1995-04-15 |
| EP0424977B1 (en) | 1995-03-22 |
| EP0213762A2 (en) | 1987-03-11 |
| US4678716A (en) | 1987-07-07 |
| ATE69907T1 (de) | 1991-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1278420C (en) | Electromagnetic shielding | |
| AU680515B2 (en) | A high temperature feed-through system and method for making same | |
| US8112152B2 (en) | Feedthrough apparatus with noble metal-coated leads | |
| US4434541A (en) | Electromagnetic shielding | |
| US5406444A (en) | Coated tantalum feedthrough pin | |
| US4620661A (en) | Corrosion resistant lid for semiconductor package | |
| US7113387B2 (en) | EMI filter capacitors designed for direct body fluid exposure | |
| JP3643128B2 (ja) | Ｅｍｉ遮蔽材料又は静電荷消失材料用組成物とｅｍｉ遮蔽を提供する方法 | |
| DE69330711T2 (de) | Elektronikgehäuse mit leiterrahmen mit verbesserter adhaesion | |
| CA1218201A (en) | Copper alloys with improved solderability shelf life | |
| DE68927296T2 (de) | Halbleiterverpackungen aus aluminiumlegierung | |
| US4507359A (en) | Electromagnetic shielding | |
| WO1993014613A1 (en) | Dissimilar metal connectors | |
| US5055356A (en) | Aluminium and aluminium alloy having corrosion-resistant protective layer, and methods of making such a layer | |
| FR2650443A1 (fr) | Connecteur en alliage a base de cuivre pour dispositifs electriques | |
| KR970005705B1 (ko) | 반도체 케이징 | |
| DE102016202763B4 (de) | Angepasste Durchführung | |
| US5763093A (en) | Aluminum nitride body having graded metallurgy | |
| US4769280A (en) | Electromagnetic shielding | |
| US5525262A (en) | Polythioether-spherical filler compositions | |
| Craig et al. | Molecular structure of tetrakis [benzenethiolatotrimethylplatinum (IV)],(μ3-SPh) 4 (PtMe3) 4 | |
| WO1987006765A1 (en) | Corrosion resistant pins for metal packaged microcircuits | |
| Sbar et al. | Performance of new copper based metallization systems in an 85° C 80-percent RH Cl 2 contaminated environment | |
| JPS6214452A (ja) | 半導体用リ−ドフレ−ム | |
| JPS60192319A (ja) | 固体電解コンデンサ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |