DE3650280D1 - Verfahren zur Behandlung von Teilchen, die zur Herstellung von Material zur elektromagnetischen Abschirmung benutzt werden. - Google Patents
Verfahren zur Behandlung von Teilchen, die zur Herstellung von Material zur elektromagnetischen Abschirmung benutzt werden.Info
- Publication number
- DE3650280D1 DE3650280D1 DE3650280T DE3650280T DE3650280D1 DE 3650280 D1 DE3650280 D1 DE 3650280D1 DE 3650280 T DE3650280 T DE 3650280T DE 3650280 T DE3650280 T DE 3650280T DE 3650280 D1 DE3650280 D1 DE 3650280D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- electromagnetic shielding
- shielding material
- particles used
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/042—Hollow waveguide joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12722—Next to Group VIII metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/12743—Next to refractory [Group IVB, VB, or VIB] metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/1275—Next to Group VIII or IB metal-base component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/762,962 US4678716A (en) | 1985-08-06 | 1985-08-06 | Electromagnetic shielding |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3650280D1 true DE3650280D1 (de) | 1995-04-27 |
DE3650280T2 DE3650280T2 (de) | 1995-08-10 |
Family
ID=25066522
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686305928T Expired - Lifetime DE3682635D1 (de) | 1985-08-06 | 1986-08-01 | Material zur elektromagnetischen abschirmung und herstellungsverfahren. |
DE3650280T Expired - Fee Related DE3650280T2 (de) | 1985-08-06 | 1986-08-01 | Verfahren zur Behandlung von Teilchen, die zur Herstellung von Material zur elektromagnetischen Abschirmung benutzt werden. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686305928T Expired - Lifetime DE3682635D1 (de) | 1985-08-06 | 1986-08-01 | Material zur elektromagnetischen abschirmung und herstellungsverfahren. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4678716A (de) |
EP (2) | EP0424977B1 (de) |
JP (1) | JPS6285500A (de) |
AT (2) | ATE69907T1 (de) |
CA (1) | CA1278420C (de) |
DE (2) | DE3682635D1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734140A (en) * | 1985-08-06 | 1988-03-29 | Chomerics, Inc. | Heat treatment of electromagnetic shielding composition |
DE3620172A1 (de) * | 1986-06-14 | 1987-12-17 | Vacuumschmelze Gmbh | Abschirmhuelle aus elektrisch leitenden elementen |
US4780575A (en) * | 1987-05-14 | 1988-10-25 | Flavin John W | Electrically conductive elastomer composition |
KR900702541A (ko) * | 1988-08-29 | 1990-12-07 | 마리안 제이 오스톨스키 | 귀금속 도금된 금속입자 및 이러한 입자로 얻은 전도성 재료의 제조방법 |
US4948922A (en) * | 1988-09-15 | 1990-08-14 | The Pennsylvania State University | Electromagnetic shielding and absorptive materials |
US5399432A (en) * | 1990-06-08 | 1995-03-21 | Potters Industries, Inc. | Galvanically compatible conductive filler and methods of making same |
US5175056A (en) * | 1990-06-08 | 1992-12-29 | Potters Industries, Inc. | Galvanically compatible conductive filler |
US5115140A (en) * | 1991-01-24 | 1992-05-19 | Progressive Products, Inc. | EMR/RFR/MWR body shield composition |
US5186635A (en) * | 1992-03-24 | 1993-02-16 | United Technologies Corporation | Electrical connector assembly with EMI protection |
US5791654A (en) * | 1992-08-19 | 1998-08-11 | The Boeing Company | Corrosion resistant gasket in combination with aircraft antenna |
US6454267B1 (en) * | 1992-08-19 | 2002-09-24 | The Boeing Company | Corrosion resistant gasket for aircraft |
US6454276B2 (en) * | 1992-08-19 | 2002-09-24 | The Boeing Company | Corrosion resistant gasket for aircraft |
US6719293B1 (en) * | 1992-08-19 | 2004-04-13 | The Boeing Company | Corrosion resistant gasket for aircraft |
US5401914A (en) * | 1993-02-03 | 1995-03-28 | The Curran Company | Vent for shielded enclosures |
CA2129073C (en) * | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
US6303180B1 (en) | 1993-09-10 | 2001-10-16 | Parker-Hannifin Corporation | Form-in-place EMI gaskets |
US5519168A (en) * | 1993-10-12 | 1996-05-21 | Owens; William M. | Electromagnetic interference shielding |
US5910524A (en) * | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
US5641438A (en) * | 1995-01-24 | 1997-06-24 | Bunyan; Michael H. | Method for forming an EMI shielding gasket |
US6635354B2 (en) | 1995-01-20 | 2003-10-21 | Parker-Hannifin Corporation | Form-in place EMI gaskets |
DE19617656A1 (de) * | 1996-05-03 | 1997-11-06 | Siegfried Schaal Metallveredel | Abschirm-Formteil für elektronische Bauelemente |
JP2000106197A (ja) * | 1998-09-30 | 2000-04-11 | Aisin Takaoka Ltd | 燃料電池及び燃料電池用セパレータ |
US6646199B2 (en) | 1999-10-20 | 2003-11-11 | Chemque, Inc. | Polymeric foam gaskets and seals |
US6483719B1 (en) * | 2000-03-21 | 2002-11-19 | Spraylat Corporation | Conforming shielded form for electronic component assemblies |
US20040053055A1 (en) * | 2002-07-03 | 2004-03-18 | Robinson John W. | Rubber toughened epoxy resins for resin infusion processing, methods of using the resins and articles made therefrom |
US20050178669A1 (en) * | 2004-02-17 | 2005-08-18 | Strubbe John L. | Method of electroplating aluminum |
US20060047053A1 (en) * | 2004-08-27 | 2006-03-02 | Ivan Pawlenko | Thermoconductive composition for RF shielding |
US7355857B2 (en) | 2006-02-07 | 2008-04-08 | Methode Electronics, Inc. | Heat sink gasket |
JP2009533552A (ja) * | 2006-04-12 | 2009-09-17 | チバ ホールディング インコーポレーテッド | 金属被覆粒子の処理方法 |
KR20110034604A (ko) * | 2008-06-23 | 2011-04-05 | 파커-한니핀 코포레이션 | Emi 차폐 재료 |
CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
KR101319488B1 (ko) * | 2012-01-06 | 2013-10-17 | 한국전자통신연구원 | 전자파 차폐 구조를 위한 환기구 구조체 |
EP2787510B1 (de) * | 2013-04-02 | 2018-05-30 | Heraeus Deutschland GmbH & Co. KG | Partikel mit Al, Si und Mg in elektrisch leitenden Pasten und Solarzellenherstellung |
JP6230022B2 (ja) * | 2014-02-27 | 2017-11-15 | 国立大学法人秋田大学 | Ag被覆Al−Si合金粒子及びその製造方法、並びに、導電性ペースト |
CN113020587B (zh) * | 2021-02-09 | 2022-12-30 | 哈尔滨工业大学(深圳) | 银包铜粉的制备方法 |
CN114916217B (zh) * | 2022-05-30 | 2023-08-29 | 中国电子科技集团公司第二十九研究所 | 一种高屏蔽效能的带自粘胶型导电密封衬垫 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3194860A (en) * | 1962-10-02 | 1965-07-13 | John E Ehrreich | Manufacture of reinforced conductive plastic gaskets |
US3140342A (en) * | 1963-07-05 | 1964-07-07 | Chomerics Inc | Electrical shielding and sealing gasket |
US3202488A (en) * | 1964-03-04 | 1965-08-24 | Chomerics Inc | Silver-plated copper powder |
US3476530A (en) * | 1966-06-10 | 1969-11-04 | Chomerics Inc | Iron based conductive filler for plastics |
US4030892A (en) * | 1976-03-02 | 1977-06-21 | Allied Chemical Corporation | Flexible electromagnetic shield comprising interlaced glassy alloy filaments |
US4076652A (en) * | 1976-05-24 | 1978-02-28 | E. I. Du Pont De Nemours And Company | Elastic resistor compositions containing metallic-conductive particles and conductive lubricant particles |
US4189618A (en) * | 1978-07-31 | 1980-02-19 | Allied Chemical Corporation | Electromagnetic shielding envelopes from wound glassy metal filaments |
US4174419A (en) * | 1978-11-08 | 1979-11-13 | Allied Chemical Corporation | Stabilized magnetic shields |
US4305847A (en) * | 1979-07-26 | 1981-12-15 | Acheson Industries, Inc. | Copper coating composition for shielding electronic equipment and the like |
US4316944A (en) * | 1980-06-18 | 1982-02-23 | United Technologies Corporation | Noble metal-chromium alloy catalysts and electrochemical cell |
US4434541A (en) * | 1980-12-22 | 1984-03-06 | Chomerics, Inc. | Electromagnetic shielding |
US4507359A (en) * | 1980-12-22 | 1985-03-26 | Chomerics, Inc. | Electromagnetic shielding |
US4404125A (en) * | 1981-10-14 | 1983-09-13 | General Electric Company | Polyphenylene ether resin compositions for EMI electromagnetic interference shielding |
US4442182A (en) * | 1982-05-26 | 1984-04-10 | Teledyne Penn-Union | One-piece, composite electrical connector |
JPS6042442A (ja) * | 1983-08-19 | 1985-03-06 | Nippon Oil Co Ltd | 導電性樹脂組成物 |
JPS6099182A (ja) * | 1983-11-04 | 1985-06-03 | Atsugi Chuo Kenkyusho Kk | シアノアクリレート混合用金属粉 |
-
1985
- 1985-08-06 US US06/762,962 patent/US4678716A/en not_active Expired - Lifetime
-
1986
- 1986-08-01 DE DE8686305928T patent/DE3682635D1/de not_active Expired - Lifetime
- 1986-08-01 EP EP90121272A patent/EP0424977B1/de not_active Expired - Lifetime
- 1986-08-01 AT AT86305928T patent/ATE69907T1/de not_active IP Right Cessation
- 1986-08-01 AT AT90121272T patent/ATE120301T1/de not_active IP Right Cessation
- 1986-08-01 DE DE3650280T patent/DE3650280T2/de not_active Expired - Fee Related
- 1986-08-01 EP EP86305928A patent/EP0213762B1/de not_active Expired - Lifetime
- 1986-08-06 CA CA000515441A patent/CA1278420C/en not_active Expired - Lifetime
- 1986-08-06 JP JP61183519A patent/JPS6285500A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
EP0213762A2 (de) | 1987-03-11 |
EP0424977A3 (en) | 1991-07-03 |
ATE69907T1 (de) | 1991-12-15 |
EP0424977B1 (de) | 1995-03-22 |
JPS6285500A (ja) | 1987-04-18 |
ATE120301T1 (de) | 1995-04-15 |
EP0424977A2 (de) | 1991-05-02 |
CA1278420C (en) | 1991-01-02 |
DE3682635D1 (de) | 1992-01-09 |
EP0213762B1 (de) | 1991-11-27 |
EP0213762A3 (en) | 1987-11-04 |
DE3650280T2 (de) | 1995-08-10 |
US4678716A (en) | 1987-07-07 |
JPH0231519B2 (de) | 1990-07-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |