EP0101936B1 - Boride-dispersed alloy material and process for manufacturing same - Google Patents
Boride-dispersed alloy material and process for manufacturing same Download PDFInfo
- Publication number
- EP0101936B1 EP0101936B1 EP19830107389 EP83107389A EP0101936B1 EP 0101936 B1 EP0101936 B1 EP 0101936B1 EP 19830107389 EP19830107389 EP 19830107389 EP 83107389 A EP83107389 A EP 83107389A EP 0101936 B1 EP0101936 B1 EP 0101936B1
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- EP
- European Patent Office
- Prior art keywords
- boride
- alloy
- gold
- silver
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000956 alloy Substances 0.000 title claims description 57
- 238000000034 method Methods 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000010931 gold Substances 0.000 claims description 46
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 44
- 229910045601 alloy Inorganic materials 0.000 claims description 43
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 38
- 229910052737 gold Inorganic materials 0.000 claims description 38
- 239000004332 silver Substances 0.000 claims description 38
- 229910052709 silver Inorganic materials 0.000 claims description 36
- 239000002344 surface layer Substances 0.000 claims description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 20
- 239000011159 matrix material Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 18
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 16
- 229910001020 Au alloy Inorganic materials 0.000 claims description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000007769 metal material Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910052796 boron Inorganic materials 0.000 claims description 12
- 229910052720 vanadium Inorganic materials 0.000 claims description 12
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 12
- 239000010936 titanium Substances 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 9
- 239000010941 cobalt Substances 0.000 claims description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 8
- 239000003353 gold alloy Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 7
- 239000011777 magnesium Substances 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000010955 niobium Substances 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- 229910052793 cadmium Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 5
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 5
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 239000010419 fine particle Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000001000 micrograph Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- -1 MgB4 Inorganic materials 0.000 description 4
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 3
- 229910015346 Ni2B Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910033181 TiB2 Inorganic materials 0.000 description 3
- WRLJWIVBUPYRTE-UHFFFAOYSA-N [B].[Ni].[Ni] Chemical compound [B].[Ni].[Ni] WRLJWIVBUPYRTE-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 3
- 238000005271 boronizing Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052580 B4C Inorganic materials 0.000 description 2
- 229910019918 CrB2 Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910020073 MgB2 Inorganic materials 0.000 description 2
- 229910015173 MoB2 Inorganic materials 0.000 description 2
- 229910019748 NbB Inorganic materials 0.000 description 2
- 229910019742 NbB2 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910004531 TaB Inorganic materials 0.000 description 2
- 229910004533 TaB2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910007948 ZrB2 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 description 2
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- PQTCMBYFWMFIGM-UHFFFAOYSA-N gold silver Chemical compound [Ag].[Au] PQTCMBYFWMFIGM-UHFFFAOYSA-N 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910017937 Ag-Ni Inorganic materials 0.000 description 1
- 229910017984 Ag—Ni Inorganic materials 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C12/00—Solid state diffusion of at least one non-metal element other than silicon and at least one metal element or silicon into metallic material surfaces
Definitions
- This invention relates to a gold or silver alloy material including at least a boride-dispersed surface portion and a process for manufacturing same.
- Such alloy is useful as a material for electrical contacts, sliding parts, or the like.
- a composite material composed of a metal and a boride can be produced by sintering or melting.
- a former method comprises preparing an appropriate mixture of a fine boride powder and, for example, copper powder, and sintering it at an appropriate temperature in an appropriate gas atmosphere. This method, however, involves difficulty in the uniform distribution of the boride, and is expensive.
- a later method comprises preparing a mixture of copper and a boride, heating it to a high temperature to melt, it, and cooling the molten mixture to solidify it. This method has the disadvantage of the boride being crystallized when the molten alloy is solidified. The boride forms too coarse particles to be satisfactorily finely divided even by forging. Moreover, both of these methods fail to have a boride distributed exclusively in the surface portion of a metallic material, and therefore, produced an alloy having low electrical conductivity.
- the document US-A-2 001 017 discloses a permanently fashioned article (e.g. used for a dish, a crucible or a ring, made of a material consisting of one or more metals of the group consisting of platinum, palladium and gold with small amounts of such metals as copper, nickel, silver, cobalt, tungsten, chromium, tantalum, molybdenum or the like.
- This material is intended to be used for jewellery, an alloy for dental industry or the like.
- the surface of the material is hardened by absorbing an element selected from the group consisting of boron, silicon and zirconium.
- the hardened surface is formed as a continuous layer mainly to improve the deformation resistance and the strength while keeping the color or fine appearance of the surface.
- This hardened surface has good wear resistance but poor electrical conductivity.
- the process of this invention comprises: preparing a gold, silver or gold or silver based alloy metallic material having a surface portion containing 0.5 to 40 atom % of at least one boride-forming metal element, the balance being selected from gold, silver, a gold alloy or a silver alloy; and diffusing boron into said surface portion to form therein a surface layer in which fine particles of a boride of the boride-forming metal element are uniformly dispersed.
- the boride-forming metal element is selected from the group consisting of beryllium (Be), magnesium (Mg), aluminum (Al), silicon (Si), titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), gallium (Ga), arsenic (As), zirconium (Zr), niobium (Nb), molybdenum (Mo), palladium (Pd), cadmium (Cd), tantalum (Ta), tungsten (W) and platinum (Pt).
- the alloy material of this invention comprises a matrix mainly composed of gold or silver.
- This composition is favorable since gold and silver have high electrical and thermal conductivity. Further, they have excellent corrosion resistance against every kind of acidic solution, such as hydrochloric acid or sulfuric acid, and alkaline solution, such as sodium hydroxide or calcium hydroxide. Gold and silver also exhibit high resistance against oxidation when, for example, heated in the air.
- the matrix of the alloy material of this invention is composed of one of the following compositions:
- the matrix material composed of gold and silver has excellent corrosion resistance and oxidation resistance.
- This material alloyed with a boride forming element and/or a boride-non-forming element possesses improved mechanical characteristics, e.g. high mechanical strength.
- the surface layer has the diffusion structure wherein fine boride particles resulted from boron and at least one boride-forming element are uniformly dispersed in the surface portion of the substrate.
- the boride-forming element is selected from the group consisting of beryllium, magnesium, aluminum, silicon, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, gallium, arsenic, zirconium, niobium, molybdenum, palladium, cadmium, tantalum, tungsten, platinum, etc. These elements have relatively high hardness, a low specific resistance and a high melting point. All of these elements are capable of forming a solid solution or being dispersed in gold, silver, a gold alloy, a silver alloy or a gold-silver alloy, and combining with boron to form fine and uniformly dispersed particles of a boride.
- the surface layer of the boride-dispersed alloy material of this invention includes fine and uniformly dispersed particles of at least one boride selected from the group consisting of AIB 2 , AIB, o , AsB, AsB s , CdB s , C 02 B, CoB, CrB, CrB 2 , FeB, Fe 2 B, MgB 2 , MgB 4 , MoB 2 , M0 2 B, NbB, NbB 2 , Ni 2 B, PtB, Pt 2 B 3 , TaB, TaB 2 , TiB 2 , VB, VB 2 , W 2 B s , ZrB 2 .
- the surface layer has a diffusion structure in which fine particles of these borides are uniformly dispersed and thus have high resistance to wear, adhesion and arc. Further, since the substrate is mainly formed of gold or silver, the surface layer formed thereon also possesses excellent corrosion and oxidation resistance. This composition serves to prevent the formation of oxides on the surface.
- the surface layer which is 0.01 to 0.25 mm in depth, and which contains 0.5 to 40 atom % of at least one element selected from Be, Mg, Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Ga, As, Zr, Nb, Mo, Pd, Cd, Ta, W and Pt, the balance being gold, silver or an alloy of gold or silver, since it is importantto form a boride in the surface layer alone.
- the matrix of the alloy material may be formed of gold, silver, or a gold or silver based alloy, depending on the purpose for which the alloy is used.
- At least one of the metal elements hereinabove listed is used, since they are all capable of forming a solid solution or being dispersed in gold, silver, or an alloy of gold or silver, and combining with the boron diffused in the surface portion of the metallic material to form fine boride particles therein.
- the boride of any such element has a relatively high degree of hardness, a low specific resistance and a high melting point, which are important properties for electrical contacts or sliding parts for which the material produced by the process of this invention can advantageously be used.
- Table 1 compares the physical properties of various borides with those of conventional electrical contact materials.
- All of these borides have a specific resistance of 14 to 100xlQ-s Q cm, a melting point of 1,220°C to 3,100°C and a hardness of Hv 1,500 to 3,300, and are superior to the conventional materials in melting point and hardness.
- the proportion of the boride-forming element is in the range of 0.5 to 40. atom %. If it is less than 0.5 atom %, it is impossible to form the boride in a sufficient quantity to ensure the effect expected from the resulting boride. If it exceeds 40%, the formation of too much boride interferes with its proper mixing with gold, silver or a gold or silver alloy in the material produced by this invention, resulting in a reduction in its electrical conductivity and thermal conductivity, and the formation of a surface layer which is easy to crack or peel.
- the surface layer in which the boride is dispersed has a depth of 0.01 to 0.25 mm. This limitation is important to ensure the wear, adhesion and arc resistance required of the surface of any electrical contact that may be formed from the material according to this invention, while satisfying the requirements for the high electrical and thermal conductivity in the inner portion of the alloy matrix.
- the distribution of a boride throughout the alloy matrix is not always beneficial for imparting high electrical and thermal conductivity. This purpose can be better attained if gold or silver of higher purity is employed in the matrix, or a reinforcing element is added thereto, depending on the characteristics required, while the boride is dispersed only in the surface layer.
- the diffusion of boron may, on some occasions, fail to form a uniform layer of fine boride particles, depending on the composition of the material in the surface layer. On such occasions, it is advisable to achieve uniform boride distribution by reducing the quantity of a boride-forming metal element in the matrix alloy, or adding another element that may form a boride more easily.
- the alloy material may, as a whole, comprise an alloy of a boride-forming element with gold or silver. This alloy may be prepared by melting the metals in question.
- an alloy is formed only in the surface layer of the metallic material.
- a metal such as vanadium or nickel
- a metal is coated on the surface of gold or silver as the matrix, and heated for diffusion into the matrix so that an alloy may be formed only in its surface layer.
- the metal such as vanadium
- the diffusion of vanadium, etc. into the matrix may be effected by its thermal diffusion at a high temperature.
- the metallic material can be of any shape, including that of a plate, bar or wire, depending on the purpose for which the alloy will be used.
- the metallic material thus prepared is subjected to boronizing by a known method, for example, immersing the metallic material in a molten salt bath containing dissolved boron, burying the metallic material in a mixture of the powder of boron carbide, etc., and the powder of boron fluoride, ammonium chloride, etc., and heating it, or vacuum deposition of boron.
- the boron diffused in the metallic material combines with vanadium, etc., in the matrix alloy to form a boride or borides.
- At least one of the following borides is formed: AIB 2 , AIB 1o , AsB, AsB 6 , CdB 6 , C 02 B, CoB, CrB, CrB 2 , FeB, Fe 2 B, MgB 2 , MgB 4 , MoB 2 , M 02 B, NbB, NbB 2 , Ni 2 B, PtB, Pt 2 B 3 , TaB, TaB 2 , TiB 2 , VB, VB 2 , W 2 B 5 , ZrB 2 , etc.
- a layer in which boride particles are dispersed is, thus, formed in gold, silver or a gold or silver alloy.
- a boride having an average particle diameter of, 0.1 to 10 ⁇ m The surface layer contains 0.6 to 50% by volume of boride particles, and has a thickness of 0.01 to 0.25 mm, and preferably 0.01 to 0.1 mm.
- a thicker layer can, if desired, be formed by a longer boronizing time, or a higher boronizing temperature.
- the process of this invention facilitates the uniform distribution of fine boride particles exclusively in the surface layer of the metallic material. Moreover, it is less expensive than the conventional sintering method, and produces a boride-dispersed alloy which is superior in properties to the product of the conventional method.
- the borides are higher than the conventional materials for electrical contacts in hardness, melting point, decomposition temperature and chemical stability. Therefore, the metallic material produced by the dispersion of a boride only in its surface layer in accordance with the process of this invention has a surface layer which is excellent in wear, adhesion and arc resistance, and thus provides a material for electrical contacts or sliding parts in which the surface layer forms a contact area.
- the product of this invention is sufficiently high in electrical and thermal conductivity as a material for electrical contacts, since the boride is a relatively good electrical conductor and finely distributed only in the surface layer, while the matrix comprises gold, silver or a gold or silver alloy which is a still better conductor. The material as a whole is low in resistance, since the boride exists only in its surface layer.
- the process of this invention can produce an alloy material having substantially any matrix composition based on gold or silver so selected as to facilitate its working, such as bending, punching or coining, or improve its thermal conductivity.
- a cobalt-gold alloy composed of 85.0 atom % of Au and 15.0 atom % of Co and in a shape having a diameter of 10 mm was prepared by melting 95 parts by weight of gold and 5 parts by weight of cobalt. The alloy was swaged into a diameter of 4 mm, and then, rolled into a plate having a thickness of 1 mm. A sample measuring 4 mm by 20 mm was prepared from the plate.
- the sample was immersed for four hours in a molten salt bath containing 60 parts by weight of borax (Na 2 B 4 0 7 ) and 40 parts by weight of boron carbide (B 4 C) powder having a particle diameter of 79 to 149 um, and having a temperature of 900°C, whereby boron was diffused into the sample.
- the sample was removed from the bath, and air cooled.
- the sample was cut to present a cross section, and it was examined by a microscope.
- the resulting microphotograph is shown in Figure 1, in which a layer in which a boride is distributed is shown at 1, and a cobalt-gold matrix alloy at 2.
- the results indicate the distribution of boride particles having a diameter of 2 to 10 um up to a depth of about 0.08 mm below the surface of the alloy.
- the boride in the surface layer showed a ratio of about 18% by volume.
- the boride was identified by X-ray diffraction and EPMA as CoB.
- the metal surrounding the boride was gold.
- a nickel-gold alloy composed of 73 atom % of Au and 27 atom % of Ni was prepared by melting 90 parts by weight of gold and 10 parts by weight of nickel. Boron was diffused in the alloy by the method set forth in Example 1. As a result, there was obtained a boride-dispersed alloy having a surface layer which was about 0.1 mm in depth, and in which a boride having a particle diameter of 5 to 20 pm had been distributed. The boride was identified as Ni 2 B, and found to occupy about 32% by volume in the surface portion.
- An alloy composed of 95 atom % of Ag and 5 atom % of Co was prepared by melting 97 parts by weight of silver and 3 parts by weight of cobalt.
- the alloy was boronized by the method employed in Example 1 to yield a boride-dispersed alloy.
- the alloy was found to have a boride-dispersed layer containing very fine CoB particles having a diameter of about 0.5 ⁇ m.
- the layer had a thickness of 0.09 mm.
- the boride occupied about 6% by volume in the layer.
- An alloy composed of 93 atom % of Ag and 7 atom % of Ti was prepared by melting 97 parts by weight of silver and 3 parts by weight of titanium.
- the alloy was boronized by the method employed in Example 1, whereby a boride-dispersed layer having a boride-dispersed layer 1 was produced.
- Figure 3 is a microphotograph showing a cross section thereof.
- the layer 1 had a thickness of about 0.25 mm.
- the boride had a particle diameter of about 2 to 15 p m, and occupied about 8% by volume in the layer 1.
- the boride was identified by X-ray diffraction as TiB 2 .
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Description
- This invention relates to a gold or silver alloy material including at least a boride-dispersed surface portion and a process for manufacturing same. Such alloy is useful as a material for electrical contacts, sliding parts, or the like.
- It is known that a composite material composed of a metal and a boride can be produced by sintering or melting. A former method comprises preparing an appropriate mixture of a fine boride powder and, for example, copper powder, and sintering it at an appropriate temperature in an appropriate gas atmosphere. This method, however, involves difficulty in the uniform distribution of the boride, and is expensive. A later method comprises preparing a mixture of copper and a boride, heating it to a high temperature to melt, it, and cooling the molten mixture to solidify it. This method has the disadvantage of the boride being crystallized when the molten alloy is solidified. The boride forms too coarse particles to be satisfactorily finely divided even by forging. Moreover, both of these methods fail to have a boride distributed exclusively in the surface portion of a metallic material, and therefore, produced an alloy having low electrical conductivity.
- The document US-A-2 001 017 discloses a permanently fashioned article (e.g. used for a dish, a crucible or a ring, made of a material consisting of one or more metals of the group consisting of platinum, palladium and gold with small amounts of such metals as copper, nickel, silver, cobalt, tungsten, chromium, tantalum, molybdenum or the like. This material is intended to be used for jewellery, an alloy for dental industry or the like. One firstly mechanically works the material being soft and easily worked into a desired shape. Then, the surface of the material is hardened by absorbing an element selected from the group consisting of boron, silicon and zirconium. As a result, the hardened surface is formed as a continuous layer mainly to improve the deformation resistance and the strength while keeping the color or fine appearance of the surface. This hardened surface has good wear resistance but poor electrical conductivity.
- It is an object of this invention to provide a gold or silver alloy material including at least a boride dispersed surface portion being excellent in wear, adhesion and arc resistance and having high electrical and thermal conductivity.
- It is a further object of this invention to provide process for manufacturing the aforementioned alloy material.
- The objects are achieved with a process as claimed in claim 1 and a material as claimed in claim 5, respectively.
- The process of this invention comprises: preparing a gold, silver or gold or silver based alloy metallic material having a surface portion containing 0.5 to 40 atom % of at least one boride-forming metal element, the balance being selected from gold, silver, a gold alloy or a silver alloy; and diffusing boron into said surface portion to form therein a surface layer in which fine particles of a boride of the boride-forming metal element are uniformly dispersed.
- The boride-forming metal element is selected from the group consisting of beryllium (Be), magnesium (Mg), aluminum (Al), silicon (Si), titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), gallium (Ga), arsenic (As), zirconium (Zr), niobium (Nb), molybdenum (Mo), palladium (Pd), cadmium (Cd), tantalum (Ta), tungsten (W) and platinum (Pt).
-
- Figure 1 is a microphotograph showing a cross section, along the thickness, of a boride-dispersed alloy manufactured from an alloy composed of 85 atom % of gold and 15 atom % of cobalt by a process embodying this invention as will hereinafter be described in Example 1;
- Figure 2 is a microphotograph showing a cross section, along the thickness, of a boride-dispersed alloy manufactured from an alloy composed of 70 atom % of gold and 30 atom % of vanadium in Example 2 of this invention; and
- Figure 3 is a microphotograph showing a cross section, along the thickness, of a boride-dispersed alloy manufactured from an alloy composed of 93 atom % of silver and 7 atom % of titanium in Example 5.
- The alloy material of this invention comprises a matrix mainly composed of gold or silver. This composition is favorable since gold and silver have high electrical and thermal conductivity. Further, they have excellent corrosion resistance against every kind of acidic solution, such as hydrochloric acid or sulfuric acid, and alkaline solution, such as sodium hydroxide or calcium hydroxide. Gold and silver also exhibit high resistance against oxidation when, for example, heated in the air.
- The matrix of the alloy material of this invention is composed of one of the following compositions:
- (1) gold or silver;
- (2) a gold alloy, a silver alloy or a gold-silver alloy;
- (3) an alloy composed of gold and/or silver and at least one boride-forming element selected from the group consisting of beryllium, magnesium, aluminum, silicon, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, gallium, arsenic, zirconium, niobium, molybdenum, palladium, cadmium, tantalum, tungsten and platinum;
- (4) an alloy composed of gold and/or silver and at least one boride-nonforming element selected from the group consisting of copper, zinc, tin, lead, etc.; and
- (5) an alloy composed of gold and/or silver, at least one boride-forming element selected from the group consisting of beryllium, magnesium, aluminum, silicon, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, gallium, arsenic, zirconium, niobium, molybdenum, palladium, cadmium, tantalum, tungsten and platinum, and at least one boride-nonforming element selected from the group consisting of copper, zinc, tin, lead, etc.
- As described above, the matrix material composed of gold and silver has excellent corrosion resistance and oxidation resistance. This material alloyed with a boride forming element and/or a boride-non-forming element possesses improved mechanical characteristics, e.g. high mechanical strength.
- In the alloy material of this invention, the surface layer has the diffusion structure wherein fine boride particles resulted from boron and at least one boride-forming element are uniformly dispersed in the surface portion of the substrate.
- The boride-forming element is selected from the group consisting of beryllium, magnesium, aluminum, silicon, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, gallium, arsenic, zirconium, niobium, molybdenum, palladium, cadmium, tantalum, tungsten, platinum, etc. These elements have relatively high hardness, a low specific resistance and a high melting point. All of these elements are capable of forming a solid solution or being dispersed in gold, silver, a gold alloy, a silver alloy or a gold-silver alloy, and combining with boron to form fine and uniformly dispersed particles of a boride.
- The surface layer of the boride-dispersed alloy material of this invention includes fine and uniformly dispersed particles of at least one boride selected from the group consisting of AIB2, AIB,o, AsB, AsBs, CdBs, C02B, CoB, CrB, CrB2, FeB, Fe2B, MgB2, MgB4, MoB2, M02B, NbB, NbB2, Ni2B, PtB, Pt2B3, TaB, TaB2, TiB2, VB, VB2, W2Bs, ZrB2.
- Accordingly, the surface layer has a diffusion structure in which fine particles of these borides are uniformly dispersed and thus have high resistance to wear, adhesion and arc. Further, since the substrate is mainly formed of gold or silver, the surface layer formed thereon also possesses excellent corrosion and oxidation resistance. This composition serves to prevent the formation of oxides on the surface.
- According to the process of this invention, the surface layer which is 0.01 to 0.25 mm in depth, and which contains 0.5 to 40 atom % of at least one element selected from Be, Mg, Al, Si, Ti, V, Cr, Mn, Fe, Co, Ni, Ga, As, Zr, Nb, Mo, Pd, Cd, Ta, W and Pt, the balance being gold, silver or an alloy of gold or silver, since it is importantto form a boride in the surface layer alone. The matrix of the alloy material may be formed of gold, silver, or a gold or silver based alloy, depending on the purpose for which the alloy is used.
- At least one of the metal elements hereinabove listed is used, since they are all capable of forming a solid solution or being dispersed in gold, silver, or an alloy of gold or silver, and combining with the boron diffused in the surface portion of the metallic material to form fine boride particles therein. Moreover, the boride of any such element has a relatively high degree of hardness, a low specific resistance and a high melting point, which are important properties for electrical contacts or sliding parts for which the material produced by the process of this invention can advantageously be used. Table 1 compares the physical properties of various borides with those of conventional electrical contact materials. All of these borides have a specific resistance of 14 to 100xlQ-s Q cm, a melting point of 1,220°C to 3,100°C and a hardness of Hv 1,500 to 3,300, and are superior to the conventional materials in melting point and hardness.
- The proportion of the boride-forming element is in the range of 0.5 to 40. atom %. If it is less than 0.5 atom %, it is impossible to form the boride in a sufficient quantity to ensure the effect expected from the resulting boride. If it exceeds 40%, the formation of too much boride interferes with its proper mixing with gold, silver or a gold or silver alloy in the material produced by this invention, resulting in a reduction in its electrical conductivity and thermal conductivity, and the formation of a surface layer which is easy to crack or peel.
- The surface layer in which the boride is dispersed has a depth of 0.01 to 0.25 mm. This limitation is important to ensure the wear, adhesion and arc resistance required of the surface of any electrical contact that may be formed from the material according to this invention, while satisfying the requirements for the high electrical and thermal conductivity in the inner portion of the alloy matrix. The distribution of a boride throughout the alloy matrix is not always beneficial for imparting high electrical and thermal conductivity. This purpose can be better attained if gold or silver of higher purity is employed in the matrix, or a reinforcing element is added thereto, depending on the characteristics required, while the boride is dispersed only in the surface layer.
- The diffusion of boron may, on some occasions, fail to form a uniform layer of fine boride particles, depending on the composition of the material in the surface layer. On such occasions, it is advisable to achieve uniform boride distribution by reducing the quantity of a boride-forming metal element in the matrix alloy, or adding another element that may form a boride more easily.
- The alloy material may, as a whole, comprise an alloy of a boride-forming element with gold or silver. This alloy may be prepared by melting the metals in question.
- It has hitherto been usual to use a Ag-Ni alloy, Ag-CdO or Ag-In0 as a silver-containing material for electrical contacts. Any of these materials per se can be used as the matrix alloy for this invention, or it is possible to add a boride-forming element thereto. Nickel and copper reduce the consumption of silver by an arc, or the like, and InO and CdO provide a clean surface.
- Alternatively, an alloy is formed only in the surface layer of the metallic material. Most typically, a metal, such as vanadium or nickel, is coated on the surface of gold or silver as the matrix, and heated for diffusion into the matrix so that an alloy may be formed only in its surface layer. The metal, such as vanadium, can be coated on the matrix surface by a known method, for example, electroplating, chemical plating, vacuum deposition, sputtering or spray coating. The diffusion of vanadium, etc. into the matrix may be effected by its thermal diffusion at a high temperature.
- The metallic material can be of any shape, including that of a plate, bar or wire, depending on the purpose for which the alloy will be used.
- The metallic material thus prepared is subjected to boronizing by a known method, for example, immersing the metallic material in a molten salt bath containing dissolved boron, burying the metallic material in a mixture of the powder of boron carbide, etc., and the powder of boron fluoride, ammonium chloride, etc., and heating it, or vacuum deposition of boron. The boron diffused in the metallic material combines with vanadium, etc., in the matrix alloy to form a boride or borides. At least one of the following borides is formed: AIB2, AIB1o, AsB, AsB6, CdB6, C02B, CoB, CrB, CrB2, FeB, Fe2B, MgB2, MgB4, MoB2, M02B, NbB, NbB2, Ni2B, PtB, Pt2B3, TaB, TaB2, TiB2, VB, VB2, W2B5, ZrB2, etc.
- A layer in which boride particles are dispersed is, thus, formed in gold, silver or a gold or silver alloy. The smaller the boride particles, the better. According to the process of this invention, there is formed a boride having an average particle diameter of, 0.1 to 10 µm The surface layer contains 0.6 to 50% by volume of boride particles, and has a thickness of 0.01 to 0.25 mm, and preferably 0.01 to 0.1 mm. A thicker layer can, if desired, be formed by a longer boronizing time, or a higher boronizing temperature.
- The process of this invention facilitates the uniform distribution of fine boride particles exclusively in the surface layer of the metallic material. Moreover, it is less expensive than the conventional sintering method, and produces a boride-dispersed alloy which is superior in properties to the product of the conventional method.
- As is obvious from Table 1, the borides are higher than the conventional materials for electrical contacts in hardness, melting point, decomposition temperature and chemical stability. Therefore, the metallic material produced by the dispersion of a boride only in its surface layer in accordance with the process of this invention has a surface layer which is excellent in wear, adhesion and arc resistance, and thus provides a material for electrical contacts or sliding parts in which the surface layer forms a contact area. The product of this invention is sufficiently high in electrical and thermal conductivity as a material for electrical contacts, since the boride is a relatively good electrical conductor and finely distributed only in the surface layer, while the matrix comprises gold, silver or a gold or silver alloy which is a still better conductor. The material as a whole is low in resistance, since the boride exists only in its surface layer.
- The process of this invention can produce an alloy material having substantially any matrix composition based on gold or silver so selected as to facilitate its working, such as bending, punching or coining, or improve its thermal conductivity.
- The invention will now be described in further detail with reference to several examples thereof.
- A cobalt-gold alloy composed of 85.0 atom % of Au and 15.0 atom % of Co and in a shape having a diameter of 10 mm was prepared by melting 95 parts by weight of gold and 5 parts by weight of cobalt. The alloy was swaged into a diameter of 4 mm, and then, rolled into a plate having a thickness of 1 mm. A sample measuring 4 mm by 20 mm was prepared from the plate. The sample was immersed for four hours in a molten salt bath containing 60 parts by weight of borax (Na2B407) and 40 parts by weight of boron carbide (B4C) powder having a particle diameter of 79 to 149 um, and having a temperature of 900°C, whereby boron was diffused into the sample. The sample was removed from the bath, and air cooled.
- The sample was cut to present a cross section, and it was examined by a microscope. The resulting microphotograph is shown in Figure 1, in which a layer in which a boride is distributed is shown at 1, and a cobalt-gold matrix alloy at 2. The results indicate the distribution of boride particles having a diameter of 2 to 10 um up to a depth of about 0.08 mm below the surface of the alloy. The boride in the surface layer showed a ratio of about 18% by volume. The boride was identified by X-ray diffraction and EPMA as CoB. The metal surrounding the boride was gold.
- A nickel-gold alloy composed of 73 atom % of Au and 27 atom % of Ni was prepared by melting 90 parts by weight of gold and 10 parts by weight of nickel. Boron was diffused in the alloy by the method set forth in Example 1. As a result, there was obtained a boride-dispersed alloy having a surface layer which was about 0.1 mm in depth, and in which a boride having a particle diameter of 5 to 20 pm had been distributed. The boride was identified as Ni2B, and found to occupy about 32% by volume in the surface portion.
- Gold and vanadium were melted to form an alloy composed of 70 atom % of gold and 30 atom % of vanadium, and a columnar sample having a diameter of 6.4 mm and a length of 24 mm was prepared therefrom. The sample was buried in a mixture consisting of 75% by weight of boron carbide powder, 5% by weight of ammonium chloride powder and 20% by weight of alumina powder. The whole was placed in an alumina crucible, heated at 900°C for four hours, and air cooled in the crucible, whereby an alloy having a boride-dispersed surface layer 1 was produced. Figure 2 is a microphotograph showing a cross section thereof. The layer 1 had a thickness of about 0.06 mm. The boride had a particle diameter of about 5 to 15 pm, and was identified as VB2. The boride was found to occupy about 36% by volume in the layer 1.
- An alloy composed of 95 atom % of Ag and 5 atom % of Co was prepared by melting 97 parts by weight of silver and 3 parts by weight of cobalt. The alloy was boronized by the method employed in Example 1 to yield a boride-dispersed alloy. The alloy was found to have a boride-dispersed layer containing very fine CoB particles having a diameter of about 0.5 µm. The layer had a thickness of 0.09 mm. The boride occupied about 6% by volume in the layer.
- An alloy composed of 93 atom % of Ag and 7 atom % of Ti was prepared by melting 97 parts by weight of silver and 3 parts by weight of titanium. The alloy was boronized by the method employed in Example 1, whereby a boride-dispersed layer having a boride-dispersed layer 1 was produced. Figure 3 is a microphotograph showing a cross section thereof. The layer 1 had a thickness of about 0.25 mm. The boride had a particle diameter of about 2 to 15 pm, and occupied about 8% by volume in the layer 1. The boride was identified by X-ray diffraction as TiB2.
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP131457/82 | 1982-07-28 | ||
JP13145782A JPS5923835A (en) | 1982-07-28 | 1982-07-28 | Production of boride diffused alloy |
Publications (3)
Publication Number | Publication Date |
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EP0101936A2 EP0101936A2 (en) | 1984-03-07 |
EP0101936A3 EP0101936A3 (en) | 1985-01-30 |
EP0101936B1 true EP0101936B1 (en) | 1988-09-14 |
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EP19830107389 Expired EP0101936B1 (en) | 1982-07-28 | 1983-07-27 | Boride-dispersed alloy material and process for manufacturing same |
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EP (1) | EP0101936B1 (en) |
JP (1) | JPS5923835A (en) |
DE (1) | DE3377990D1 (en) |
Families Citing this family (13)
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JPS59104467A (en) * | 1982-12-06 | 1984-06-16 | Mitsubishi Metal Corp | Surface-hardened au alloy member for ornamental use |
JPS59143032A (en) * | 1983-02-04 | 1984-08-16 | Mitsubishi Metal Corp | Surface hardened pt alloy member for decoration |
JPS6021347A (en) * | 1983-07-12 | 1985-02-02 | Mitsubishi Metal Corp | High-strength au alloy member having surface layer hardened by boriding |
JPS6052540A (en) * | 1983-09-01 | 1985-03-25 | Mitsubishi Metal Corp | Hard au alloy tip material joined to substrate member and used |
JPS60110867A (en) * | 1983-11-18 | 1985-06-17 | Mitsubishi Metal Corp | Surface hardened ag alloy member having excellent resistance to wear and corrosion |
JPH0415177Y2 (en) * | 1984-10-24 | 1992-04-06 | ||
JPH01223992A (en) * | 1988-03-03 | 1989-09-07 | Brother Ind Ltd | Controller for cycle sewing machine |
JPH02225655A (en) * | 1989-02-28 | 1990-09-07 | Agency Of Ind Science & Technol | Gold alloy capable of coloring into bright black color and coloring method therefor |
JPH03166327A (en) * | 1989-11-22 | 1991-07-18 | Seiko Instr Inc | Hard-facing colored gold alloy |
DE4313272C1 (en) * | 1993-04-23 | 1994-05-05 | Degussa | Objects made of platinum@ and palladium@ - comprise hard scratch-resistant surface layer contg. boron@ in the metal lattice |
US6274254B1 (en) * | 1999-08-23 | 2001-08-14 | Lucent Technologies Inc. | Electrodeposited precious metal finishes having wear resistant particles therein |
CN102277524B (en) * | 2010-06-13 | 2013-04-24 | 厦门鑫柏龙仪器仪表有限公司 | Au-Fe-Ni-Cr alloy |
CN114107725B (en) * | 2021-12-07 | 2022-05-20 | 扬州亚光电缆有限公司 | Heat-resistant anti-oxidation silver alloy material and preparation method and application thereof |
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US1990277A (en) * | 1930-09-13 | 1935-02-05 | Feussner Otto | Metals of the platinum group and certain alloys |
US2001017A (en) * | 1930-09-13 | 1935-05-14 | Feussner Otto | Metal article |
FR1231094A (en) * | 1959-03-27 | 1960-09-26 | Soc Metallurgique Imphy | Process for producing borided metal parts and parts obtained by this process |
NL265282A (en) * | 1960-06-22 | |||
DE3307182A1 (en) * | 1982-05-26 | 1983-12-01 | Technical Materials, Inc., Lincoln, R.I. | Alloy for electrical contacts and use for such an alloy |
-
1982
- 1982-07-28 JP JP13145782A patent/JPS5923835A/en active Granted
-
1983
- 1983-07-27 EP EP19830107389 patent/EP0101936B1/en not_active Expired
- 1983-07-27 DE DE8383107389T patent/DE3377990D1/en not_active Expired
Also Published As
Publication number | Publication date |
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EP0101936A2 (en) | 1984-03-07 |
DE3377990D1 (en) | 1988-10-20 |
EP0101936A3 (en) | 1985-01-30 |
JPS5923835A (en) | 1984-02-07 |
JPS6154109B2 (en) | 1986-11-20 |
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