JPH0230839Y2 - - Google Patents
Info
- Publication number
- JPH0230839Y2 JPH0230839Y2 JP1985199187U JP19918785U JPH0230839Y2 JP H0230839 Y2 JPH0230839 Y2 JP H0230839Y2 JP 1985199187 U JP1985199187 U JP 1985199187U JP 19918785 U JP19918785 U JP 19918785U JP H0230839 Y2 JPH0230839 Y2 JP H0230839Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- bonding
- carrier unit
- pedestal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985199187U JPH0230839Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-12-26 | 1985-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985199187U JPH0230839Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-12-26 | 1985-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62107450U JPS62107450U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-07-09 |
| JPH0230839Y2 true JPH0230839Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-08-20 |
Family
ID=31160573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985199187U Expired JPH0230839Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-12-26 | 1985-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230839Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
| JPS626687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1981-05-20 | 1987-02-16 |
-
1985
- 1985-12-26 JP JP1985199187U patent/JPH0230839Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62107450U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-07-09 |