JPH0230194B2 - - Google Patents

Info

Publication number
JPH0230194B2
JPH0230194B2 JP61156243A JP15624386A JPH0230194B2 JP H0230194 B2 JPH0230194 B2 JP H0230194B2 JP 61156243 A JP61156243 A JP 61156243A JP 15624386 A JP15624386 A JP 15624386A JP H0230194 B2 JPH0230194 B2 JP H0230194B2
Authority
JP
Japan
Prior art keywords
wafer
oven
unit
row
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61156243A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6313332A (ja
Inventor
Yoshiki Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Canon Marketing Japan Inc
Original Assignee
Canon Inc
Canon Hanbai KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Canon Hanbai KK filed Critical Canon Inc
Priority to JP61156243A priority Critical patent/JPS6313332A/ja
Priority to GB8715456A priority patent/GB2194500B/en
Priority to DE19873722080 priority patent/DE3722080A1/de
Publication of JPS6313332A publication Critical patent/JPS6313332A/ja
Priority to US07/453,188 priority patent/US5015177A/en
Publication of JPH0230194B2 publication Critical patent/JPH0230194B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP61156243A 1986-07-04 1986-07-04 半導体製造装置 Granted JPS6313332A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP61156243A JPS6313332A (ja) 1986-07-04 1986-07-04 半導体製造装置
GB8715456A GB2194500B (en) 1986-07-04 1987-07-01 A wafer handling apparatus
DE19873722080 DE3722080A1 (de) 1986-07-04 1987-07-03 Einrichtung zum bearbeiten von halbleiterplaettchen
US07/453,188 US5015177A (en) 1986-07-04 1989-12-15 Wafer handling apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61156243A JPS6313332A (ja) 1986-07-04 1986-07-04 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS6313332A JPS6313332A (ja) 1988-01-20
JPH0230194B2 true JPH0230194B2 (Sortimente) 1990-07-04

Family

ID=15623504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61156243A Granted JPS6313332A (ja) 1986-07-04 1986-07-04 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS6313332A (Sortimente)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287016A (ja) * 1987-05-19 1988-11-24 Mitsubishi Electric Corp レジスト塗布・現像装置
JP2926593B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理装置及びレジスト処理装置及び基板処理方法及びレジスト処理方法
JP2926592B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理装置
JP2926703B2 (ja) * 1988-02-12 1999-07-28 東京エレクトロン株式会社 基板処理方法及び装置
JP2519096B2 (ja) * 1988-02-12 1996-07-31 東京エレクトロン株式会社 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法
JP2877744B2 (ja) * 1988-02-12 1999-03-31 東京エレクトロン株式会社 半導体基板のレジスト処理装置
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JP2615784B2 (ja) * 1988-03-18 1997-06-04 凸版印刷株式会社 現像処理機構を有する処理装置
JP2559617B2 (ja) * 1988-03-24 1996-12-04 キヤノン株式会社 基板処理装置
JPH021907A (ja) * 1988-06-09 1990-01-08 Nec Kyushu Ltd インライン型半導体熱処理装置
JP2615171B2 (ja) * 1988-12-19 1997-05-28 東京エレクトロン株式会社 半導体製造装置
JP2746669B2 (ja) * 1989-07-20 1998-05-06 東京エレクトロン株式会社 洗浄装置及び洗浄方法
JPH0666377B2 (ja) * 1990-03-30 1994-08-24 東京エレクトロン株式会社 処理装置および処理方法およびレジスト処理装置
JP2883888B2 (ja) * 1990-03-30 1999-04-19 東京エレクトロン株式会社 処理装置
EP0634783B1 (en) * 1993-07-16 1997-08-06 Semiconductor Systems, Inc. Thermal process module for substrate coat/develop system
JP2859849B2 (ja) * 1996-05-20 1999-02-24 東京エレクトロン株式会社 処理装置及び処理方法
JP3249395B2 (ja) 1996-06-21 2002-01-21 東京応化工業株式会社 処理ユニット構築体
JP5338777B2 (ja) * 2010-09-02 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
WO2013093978A1 (ja) 2011-12-22 2013-06-27 トヨタ自動車株式会社 トランスファ装置

Also Published As

Publication number Publication date
JPS6313332A (ja) 1988-01-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term