JPH0230154A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0230154A
JPH0230154A JP63180891A JP18089188A JPH0230154A JP H0230154 A JPH0230154 A JP H0230154A JP 63180891 A JP63180891 A JP 63180891A JP 18089188 A JP18089188 A JP 18089188A JP H0230154 A JPH0230154 A JP H0230154A
Authority
JP
Japan
Prior art keywords
pad
electrode
semiconductor device
stress
circle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63180891A
Other languages
English (en)
Inventor
Juri Kato
樹理 加藤
Ryuhei Miyagawa
宮川　隆平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP63180891A priority Critical patent/JPH0230154A/ja
Publication of JPH0230154A publication Critical patent/JPH0230154A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05555—Shape in top view being circular or elliptic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野］ 本発明は、半導体装置に関する。特に熱応力に優れた半
導体装置において有効である。
〔従来の技術］ 従来、ＬＳＩチップのパッド開口部及び電極部は、長方
形または正方形であった。
［発明が解決しようとする課題］ チップ及びパッケージの大型化に伴ない封止樹脂応力が
顕著になり、パッド電極ＡＬのスライド、ボンディング
オーブンの不具合が多発した。
特に、電極パッドの４角に応力が集中し、４角のＡＬス
ライド、４角近傍のボンディング不良が多い、またチッ
プ端と平行な電極パッド面のスライドが大きい。
本発明は、かかる従来の欠点であるＡＬｌを極パッドの
スライド及びボンディングオーブンを回避し、熱ストレ
スに強い高信頼性な半導体装置を提供することを目的と
する。
［課題を解決するための手段］ 本発明は、パッド電極を多角形または円形にすることに
より、従来の四角パッドの角に集中していた応力及びチ
ップ端に、平行なパッド面に加わる応力が回避され、Ａ
Ｌのスライド及びボンディングオーブンが緩和される。
〔実　施　例１ 以下実施例を用いて説明する。第１図は１本発明による
半導体の表面図であり、ＡＬバッド３は円形の形を取る
。ｌはチップ端を示し、２はポリイミド保護膜の開口部
で、２′はポリイミド保護膜の終端部を示す。実施例で
は、ポリイミド保護膜開口部は円形の形を取り、ＡＬパ
ッド３より大きいが、同一の大きさでも、小さくても同
様な効果を得ることができる。また８角形などの内角の
大きい多角形でも良い。
［発明の効果１ 本発明によれば、電極パッドの角の部分がなくなり、ま
た応力の方向（すなわちチップ周辺に垂直な方向）に垂
直なパッドの辺がな（なるため、樹脂応力が緩和でき、
ＡＬスライド、ボンディングオーブンの生じない高信頼
性な半導体装置を提供可能にする。
導体装置の平面図。
■　・　・ ２　・　・ ２′ ３　・　・ チップ端 ポリイミド保護膜の開口部 ・ポリイミド保護膜終端 ＡＬ電極パッド 以 出願人　セイコーエプソン株式会社 代理人　弁理士　上　柳　雅　誉（他１名）
【図面の簡単な説明】

Claims (2)

    【特許請求の範囲】
  1. （１）ＬＳＩチップパッド電極において、その形が、内
    角が９０゜より大きい多角形または円形の形を取ること
    を特徴とする半導体装置。
  2. （２）ＬＳＩチップのポリイミドコート保護膜のパッド
    開口部が、内角が９０゜より大きい多角形または円形の
    形を取り、該パッド電極と同じ、もしくは、異なる大き
    さを持つことを特徴とする請求項１記載の半導体装置。
JP63180891A 1988-07-19 1988-07-19 半導体装置 Pending JPH0230154A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63180891A JPH0230154A (ja) 1988-07-19 1988-07-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63180891A JPH0230154A (ja) 1988-07-19 1988-07-19 半導体装置

Publications (1)

Publication Number Publication Date
JPH0230154A true JPH0230154A (ja) 1990-01-31

Family

ID=16091136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63180891A Pending JPH0230154A (ja) 1988-07-19 1988-07-19 半導体装置

Country Status (1)

Country Link
JP (1) JPH0230154A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7317244B2 (en) 2002-01-15 2008-01-08 Oki Electric Industry Co., Ltd. Semiconductor device and manufacturing method thereof
CN107845622A (zh) * 2017-12-04 2018-03-27 睿力集成电路有限公司 具有硅穿孔的芯片堆叠体及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7317244B2 (en) 2002-01-15 2008-01-08 Oki Electric Industry Co., Ltd. Semiconductor device and manufacturing method thereof
CN107845622A (zh) * 2017-12-04 2018-03-27 睿力集成电路有限公司 具有硅穿孔的芯片堆叠体及其制造方法

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