JPH0229537U - - Google Patents
Info
- Publication number
- JPH0229537U JPH0229537U JP10814788U JP10814788U JPH0229537U JP H0229537 U JPH0229537 U JP H0229537U JP 10814788 U JP10814788 U JP 10814788U JP 10814788 U JP10814788 U JP 10814788U JP H0229537 U JPH0229537 U JP H0229537U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- semiconductor device
- underlying
- treated
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図は本考案の一実施例における半導体装置の断
面図である。
１…プリント基板、２…銅箔パターン、３…半
田クリーム、４…フラツトパツケージＩＣ、５…
リード、６…半田メツキ層。
The figure is a sectional view of a semiconductor device according to an embodiment of the present invention. 1... Printed circuit board, 2... Copper foil pattern, 3... Solder cream, 4... Flat package IC, 5...
Lead, 6...Solder plating layer.
Claims (1)
表面処理を施し、他の部分を下地のＣｕを露出さ
せたリードを有する半導体装置。 A semiconductor device having a lead whose tip end is surface-treated with solder plating or Sn plating, and the other part has the underlying Cu exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10814788U JPH0229537U (en) | 1988-08-17 | 1988-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10814788U JPH0229537U (en) | 1988-08-17 | 1988-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229537U true JPH0229537U (en) | 1990-02-26 |
Family
ID=31343206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10814788U Pending JPH0229537U (en) | 1988-08-17 | 1988-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229537U (en) |
-
1988
- 1988-08-17 JP JP10814788U patent/JPH0229537U/ja active Pending