JPH0228914B2 - - Google Patents
Info
- Publication number
- JPH0228914B2 JPH0228914B2 JP58045387A JP4538783A JPH0228914B2 JP H0228914 B2 JPH0228914 B2 JP H0228914B2 JP 58045387 A JP58045387 A JP 58045387A JP 4538783 A JP4538783 A JP 4538783A JP H0228914 B2 JPH0228914 B2 JP H0228914B2
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plated
- layer
- resistor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010410 layer Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011247 coating layer Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 39
- 229910052759 nickel Inorganic materials 0.000 description 20
- 238000007747 plating Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58045387A JPS59171155A (ja) | 1983-03-17 | 1983-03-17 | ニツケルメツキ抵抗体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58045387A JPS59171155A (ja) | 1983-03-17 | 1983-03-17 | ニツケルメツキ抵抗体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59171155A JPS59171155A (ja) | 1984-09-27 |
| JPH0228914B2 true JPH0228914B2 (US20080293856A1-20081127-C00150.png) | 1990-06-27 |
Family
ID=12717854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58045387A Granted JPS59171155A (ja) | 1983-03-17 | 1983-03-17 | ニツケルメツキ抵抗体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59171155A (US20080293856A1-20081127-C00150.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100714354B1 (ko) | 2004-07-27 | 2007-05-02 | 브레인 파워 코. | 인쇄회로기판의 임베디드 박막 저항기의 제조 방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913665A (US20080293856A1-20081127-C00150.png) * | 1972-05-17 | 1974-02-06 |
-
1983
- 1983-03-17 JP JP58045387A patent/JPS59171155A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913665A (US20080293856A1-20081127-C00150.png) * | 1972-05-17 | 1974-02-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59171155A (ja) | 1984-09-27 |
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