JPH0226857B2 - - Google Patents
Info
- Publication number
- JPH0226857B2 JPH0226857B2 JP59256332A JP25633284A JPH0226857B2 JP H0226857 B2 JPH0226857 B2 JP H0226857B2 JP 59256332 A JP59256332 A JP 59256332A JP 25633284 A JP25633284 A JP 25633284A JP H0226857 B2 JPH0226857 B2 JP H0226857B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- curable resin
- resin
- laminate
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 239000002759 woven fabric Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 8
- 239000006227 byproduct Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920001567 vinyl ester resin Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000004439 roughness measurement Methods 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59256332A JPS61134245A (ja) | 1984-12-03 | 1984-12-03 | ガラス基材金属箔張積層板およびその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59256332A JPS61134245A (ja) | 1984-12-03 | 1984-12-03 | ガラス基材金属箔張積層板およびその製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61134245A JPS61134245A (ja) | 1986-06-21 |
| JPH0226857B2 true JPH0226857B2 (fr) | 1990-06-13 |
Family
ID=17291199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59256332A Granted JPS61134245A (ja) | 1984-12-03 | 1984-12-03 | ガラス基材金属箔張積層板およびその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134245A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444743A (en) * | 1987-08-11 | 1989-02-17 | Nec Corp | Copper clad laminated plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52796A (en) * | 1975-06-24 | 1977-01-06 | Tsurumi Soda Kk | Purification process of solution of sodium hypochlorite |
| JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
| JPS5812750A (ja) * | 1981-07-15 | 1983-01-24 | 松下電工株式会社 | 積層板の製造法 |
-
1984
- 1984-12-03 JP JP59256332A patent/JPS61134245A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52796A (en) * | 1975-06-24 | 1977-01-06 | Tsurumi Soda Kk | Purification process of solution of sodium hypochlorite |
| JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
| JPS5812750A (ja) * | 1981-07-15 | 1983-01-24 | 松下電工株式会社 | 積層板の製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61134245A (ja) | 1986-06-21 |
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