JPH0226857B2 - - Google Patents
Info
- Publication number
- JPH0226857B2 JPH0226857B2 JP59256332A JP25633284A JPH0226857B2 JP H0226857 B2 JPH0226857 B2 JP H0226857B2 JP 59256332 A JP59256332 A JP 59256332A JP 25633284 A JP25633284 A JP 25633284A JP H0226857 B2 JPH0226857 B2 JP H0226857B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- curable resin
- resin
- laminate
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 239000002759 woven fabric Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 8
- 239000006227 byproduct Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920001567 vinyl ester resin Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000004439 roughness measurement Methods 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Description
【発明の詳細な説明】
本発明は表面平滑性の優れた印刷配線板用のガ
ラス基材金属箔張積層板およびその製造法に関す
る。
近年、電子機器の小型化に対応して印刷配線板
への高密度実装方式の開発および印刷配線板のパ
ターン密度の高密度化が急速に進展している。高
密度パターンの印刷配線板を作成するためには、
金属箔張積層板の回路を形成する金属箔面の表面
平滑性がすぐれていることが要求される。本発明
におけるようにガラス織布を金属箔に最も近い層
に用いた金属箔張積層板の場合、ガラス織布の織
り目が金属箔表面に現れやすく、織り目に基づく
表面粗さが大きいと、高密度配線板用には使用が
困難であつた。
かかる問題を解決するため本発明者らが鋭意検
討を行つた結果、金属箔に最も近い層のガラス織
布の金属箔側の表面を起毛加工することにより、
得られる積層板の金属箔面の表面粗さを大幅に改
良することが可能であることを見い出した。
本発明は、常温で液状で硬化に際し気体や液体
の副生物を発生しない硬化性樹脂を含浸した複数
枚の基材を積層し、該積層物の少なくとも片面に
金属箔を張つた後硬化させてなる金属箔張積層板
において、少なくとも金属箔に最も近い層の基材
がガラス織布であり、かつ該ガラス基材の金属箔
側の表面が起毛加工されていることを特徴とする
金属箔張積層板を提供する。
本発明で用いる基材はガラス織布を単独で複数
枚用いるか、あるいは最外層をガラス織布、中心
層をガラス不織布紙、セルロース混抄ガラス繊維
紙、合成繊維布、合成繊維不織布等で組合せて用
いてもよい。
金属箔に最も近い最外層のガラス織布に対する
起毛加工は、電気用積層板に使用される通常のガ
ラス織布の表面を研磨することにより行う。従つ
て本発明でいう起毛加工を施したガラス織布と
は、断熱材として用いられるような嵩高のいわゆ
るバルキー加工布とは異なる。バルキー加工布は
単糸、合撚糸の段階で特殊加工を施し、バルキー
性を持たせたヤーンから織り上げたものであり、
嵩高のため、基材としての補強性も少なく、印刷
配線板用の積層板用途には適さない。
起毛加工の方法としては、例えば、ガラス織布
を連続的に搬送しながら、ベルトサンダー、ロー
ルブラシ、ロールバフ等の研磨剤で研磨する方法
があげられ、研磨により織布を構成するガラス単
繊維の一部を切断し起毛することにより、本発明
の効果が発揮される。該加工は金属箔張積層板を
製造する工程中で行つてもかまわない。おな、中
心層のガラス織布に対しても起毛加工を施しても
さしつかえないが、積層板の曲げ強度が低下する
等の弊害があるため、最外層のガラス織布の金属
箔側の表面にのみ起毛加工を施すのが好ましい。
基材に含浸する樹脂は常温で液状でしかも硬化
に際し気体や液体の副生成物を発生しない一般に
低圧成形用樹脂と呼ばれる硬化性樹脂が用いられ
る。不飽和ポリエステル樹脂、ビニルエステル樹
脂、ウレタンアクリレート樹脂、ジアリルフタレ
ート樹脂等のラジカル重合型樹脂や、エポキシ樹
脂等の付加重合型の樹脂などが代表的なものであ
る。不飽和ポリエステル樹脂およびビニルエステ
ル樹脂は硬化収縮が比較的大きく積層板の金属箔
面の表面粗さがエポキシ樹脂の場合に比べて大き
いため、本発明による効果が特に顕著である。
印刷配線板用に使用される金属箔は電解銅箔が
一般的であるが、所望により圧延銅箔、アルミニ
ウム箔等を使用することができる。含浸用の樹脂
が不飽和ポリエステル樹脂、ビニルエステル樹脂
等のラジカル重合型樹脂の場合には、エポキシ樹
脂等の接着剤層を金属箔と樹脂含浸基材の間に設
ける方が金属箔面の表面平滑性および半田耐熱
性、金属箔の接着強度の特性から望ましい。
従来、ガラス基材金属箔張積層板はプレスによ
るバツチ方式により製造されていた。含浸用の樹
脂として常温で液状で硬化に際し気体や液体の副
生物を発生しない硬化性樹脂を用いる場合、本発
明者らが特開昭55−4838、同56−98136等で提案
しているような連続製造法で製造するのが適して
いる。特に硬化の際の成形圧が実質的に無圧の場
合、板厚精度に優れ、表面平滑性の良好な高品質
の金属箔張積層板を得ることができる。
次に本発明を実施例により説明する。
比較例 １
不飽和ポリエステル樹脂（ポリマール6304、武
田薬品）100重量部、クメンハイドロパーオキサ
イド１重量部、６％ナフテン酸コバルト0.2重量
部からなる不飽和ポリエテル樹脂液を調整した。
厚さ約180μｍの平織のガラス織布（WE 18K、
メタクリルシラン処理品、日東紡績）８層を連続
的に搬送させ、各基材に対して個別にカーテンフ
ロー方式で上記の不飽和ポリエステル樹脂液で含
浸を行い、樹脂含浸基材を積層した後、エポキシ
樹脂系接着剤を塗布した18μｍ厚さの電解銅箔
（日鉱グールド・フオイルTC箔）を積層物の両側
にラミネートし、一定厚みにしごいた後トンネル
型加熱炉で100℃で40分間加熱硬化を行い、両面
銅張積層板を得た。このものの表面粗さを表に示
す。
実施例 １
ガラス織布（WE 18K）の片側の表面をあらか
じめベルトサンダーにより連続的に起毛加工を行
つた。８層ガラス織布のうち外側の２層を上記の
起毛加工を施したガラス織布に置き換え、加工を
施した面が銅箔側にくるように配置し、比較例１
と同様の方法で両面銅張積層板を作成した。表面
粗さの測定結果を表に示す。
比較例 ２
ビスフエノールＡ型エポキシ樹脂（エピコート
828、油圧シエルエポキシ）100重量部、メチルテ
トラヒドロ無水フタル酸（HN−2200 日立化
成）80重量部、ベンジルジメチルアミン0.5重量
部からなるエポキシ樹脂液を調合し、比較例１と
同様に８層のガラス織布に含浸させ、積層した
後、厚さ18μｍの接着剤を塗布していない銅箔を
積層物の両面に張り合わせ、厚みを調整後、130
℃で40分間の加熱硬化を行い両面銅張積層板を得
た。表面粗さを表に示す。
実施例 ２
実施例１と同様の基材構成で、比較例２のエポ
キシ樹脂液を含浸させ、比較例２と同様の条件で
両面銅張積層板を得た。表面粗さの測定結果を表
に示す。
【表】DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a glass-based metal foil-clad laminate for printed wiring boards with excellent surface smoothness and a method for producing the same. In recent years, in response to the miniaturization of electronic devices, rapid progress has been made in the development of high-density mounting methods for printed wiring boards and in the pattern density of printed wiring boards. In order to create printed wiring boards with high density patterns,
The metal foil surface forming the circuit of the metal foil-clad laminate is required to have excellent surface smoothness. In the case of a metal foil-clad laminate in which a glass woven fabric is used as the layer closest to the metal foil as in the present invention, the texture of the glass fabric tends to appear on the surface of the metal foil, and if the surface roughness based on the texture is large, the It was difficult to use it for high-density wiring boards. As a result of intensive studies by the present inventors to solve this problem, we found that by brushing the surface of the glass woven fabric closest to the metal foil on the metal foil side,
It has been found that it is possible to significantly improve the surface roughness of the metal foil surface of the resulting laminate. The present invention involves laminating a plurality of substrates impregnated with a curable resin that is liquid at room temperature and does not generate gas or liquid by-products upon curing, and then hardening after applying metal foil to at least one side of the laminate. A metal foil-clad laminate characterized in that at least the base material of the layer closest to the metal foil is a glass woven fabric, and the surface of the glass base material on the metal foil side is brushed. Provides laminates. The base material used in the present invention may be a single glass woven fabric, or a combination of glass woven fabric for the outermost layer, glass nonwoven paper, cellulose mixed glass fiber paper, synthetic fiber cloth, synthetic fiber nonwoven fabric, etc. for the center layer. May be used. The raising process for the outermost glass woven fabric closest to the metal foil is performed by polishing the surface of a normal glass woven fabric used for electrical laminates. Therefore, the raised glass woven fabric referred to in the present invention is different from the so-called bulky fabric used as a heat insulating material. Bulky-processed fabric is woven from yarns that undergo special processing at the single yarn and plied yarn stages to give them bulky properties.
Due to its bulk, it has little reinforcing properties as a base material, and is not suitable for use as a laminate for printed wiring boards. An example of a napping method is to polish the woven glass fabric with an abrasive such as a belt sander, roll brush, or roll buff while continuously conveying it. The effects of the present invention are exhibited by cutting a portion and raising the nap. This processing may be performed during the process of manufacturing the metal foil-clad laminate. Although it is possible to apply brushing to the central layer of woven glass fabric, there are disadvantages such as a reduction in the bending strength of the laminate. It is preferable to apply a brushed finish only to the material. The resin to be impregnated into the base material is generally a curable resin called a low-pressure molding resin, which is liquid at room temperature and does not generate gas or liquid byproducts during curing. Typical examples include radical polymerization type resins such as unsaturated polyester resins, vinyl ester resins, urethane acrylate resins, and diallyl phthalate resins, and addition polymerization type resins such as epoxy resins. Since unsaturated polyester resins and vinyl ester resins have relatively large curing shrinkage and the surface roughness of the metal foil surface of the laminate is greater than that of epoxy resins, the effects of the present invention are particularly remarkable. The metal foil used for printed wiring boards is generally electrolytic copper foil, but rolled copper foil, aluminum foil, etc. can be used if desired. When the resin for impregnation is a radical polymerization type resin such as unsaturated polyester resin or vinyl ester resin, it is better to provide an adhesive layer such as epoxy resin between the metal foil and the resin-impregnated base material to improve the surface of the metal foil surface. Desirable for its smoothness, soldering heat resistance, and adhesive strength of metal foil. Conventionally, glass-based metal foil-clad laminates have been manufactured by a batch method using a press. When using a curable resin that is liquid at room temperature and does not generate gas or liquid by-products during curing as a resin for impregnation, it is possible to use a curable resin that does not generate gas or liquid by-products during curing. It is suitable to manufacture using a continuous manufacturing method. In particular, when the molding pressure during curing is substantially no pressure, a high-quality metal foil-clad laminate with excellent plate thickness accuracy and good surface smoothness can be obtained. Next, the present invention will be explained by examples. Comparative Example 1 An unsaturated polyester resin liquid was prepared containing 100 parts by weight of an unsaturated polyester resin (Polymer 6304, Takeda Pharmaceutical Co., Ltd.), 1 part by weight of cumene hydroperoxide, and 0.2 parts by weight of 6% cobalt naphthenate.
Plain weave glass woven fabric (WE 18K, approximately 180μm thick)
After continuously transporting 8 layers of methacrylic silane treated product, Nitto Boseki, and individually impregnating each base material with the above unsaturated polyester resin liquid using the curtain flow method, and laminating the resin-impregnated base materials, 18μm thick electrolytic copper foil (Nikko Gould Foil TC foil) coated with epoxy resin adhesive is laminated on both sides of the laminate, squeezed to a certain thickness, and then heated and cured at 100℃ for 40 minutes in a tunnel heating furnace. A double-sided copper-clad laminate was obtained. The surface roughness of this material is shown in the table. Example 1 The surface of one side of a glass woven fabric (WE 18K) was previously subjected to a continuous napping process using a belt sander. Comparative Example 1
A double-sided copper-clad laminate was made using the same method as above. The surface roughness measurement results are shown in the table. Comparative example 2 Bisphenol A type epoxy resin (Epicote
828, Hydraulic Shell Epoxy), 80 parts by weight of methyltetrahydrophthalic anhydride (HN-2200, Hitachi Chemical), and 0.5 parts by weight of benzyldimethylamine. After impregnating the glass woven fabric and laminating it, 18 μm thick copper foil without adhesive is pasted on both sides of the laminate, and after adjusting the thickness, 130
A double-sided copper-clad laminate was obtained by heat curing at ℃ for 40 minutes. The surface roughness is shown in the table. Example 2 A double-sided copper-clad laminate was obtained using the same base material configuration as Example 1 and impregnated with the epoxy resin liquid of Comparative Example 2 under the same conditions as Comparative Example 2. The surface roughness measurement results are shown in the table. 【table】
Claims (1)
を発生しない硬化性樹脂を含浸した複数枚の基材
を積層し、該積層物の少なくとも片面に金属箔を
張つた後硬化させてなる金属箔張積層板におい
て、少なくとも金属箔に最も近い層の基材がガラ
ス織布であり、かつ該ガラス基材の金属箔側の表
面が起毛加工されていることを特徴とする金属箔
張積層板。 ２ 前記硬化性樹脂が不飽和ポリエステル樹脂で
ある第１項の金属箔張積層板。 ３ 前記硬化性樹脂がエポキシ樹脂である第１項
の金属箔張積層板。 ４ 前記硬化性樹脂がビニルエステル樹脂である
第１項の金属箔張積層板。 ５ 複数枚のシート状基材を連続的に搬送しなが
ら、常温で液状で硬化に際し気体や液体の副生物
を発生しない硬化性樹脂液を含浸し、含浸した基
材を合体し、合体した積層物の少なくとも片面に
金属箔を張り、次いで積層物を連続的に硬化させ
ることを含む金属箔張積層板の連続製造法におい
て、少なくとも金属箔に最も近い層の基材とし
て、金属箔側の表面が起毛加工されているガラス
織布を使用することを特徴とする金属箔張積層板
の連続製造法。 ６ 硬化の際の成形圧が実質的に無圧である第５
項の方法。 ７ 前記硬化性樹脂が不飽和ポリエステル樹脂で
ある第５項の方法。 ８ 前記硬化性樹脂がエポキシ樹脂である第５項
の方法。 ９ 前記硬化性樹脂がビニルエステル樹脂である
第５項の方法。[Scope of Claims] 1. After laminating a plurality of base materials impregnated with a curable resin that is liquid at room temperature and does not generate gas or liquid by-products upon curing, and pasting metal foil on at least one side of the laminate. The cured metal foil-clad laminate is characterized in that at least the base material of the layer closest to the metal foil is a glass woven fabric, and the surface of the glass base material on the metal foil side is brushed. Metal foil laminate. 2. The metal foil-clad laminate of item 1, wherein the curable resin is an unsaturated polyester resin. 3. The metal foil-clad laminate according to item 1, wherein the curable resin is an epoxy resin. 4. The metal foil-clad laminate of item 1, wherein the curable resin is a vinyl ester resin. 5 While continuously transporting multiple sheet-like base materials, impregnate them with a curable resin liquid that is liquid at room temperature and does not generate gas or liquid by-products upon curing, and combine the impregnated base materials to form a combined laminate. In a continuous manufacturing process for metal foil-clad laminates, which involves applying metal foil to at least one side of the object and then curing the laminate continuously, the surface on the metal foil side is used as the substrate for at least the layer closest to the metal foil. A continuous manufacturing method for a metal foil-clad laminate, characterized by using a glass woven fabric that has been brushed. 6 No. 5, in which the molding pressure during curing is substantially no pressure.
Section method. 7. The method of item 5, wherein the curable resin is an unsaturated polyester resin. 8. The method of item 5, wherein the curable resin is an epoxy resin. 9. The method of item 5, wherein the curable resin is a vinyl ester resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59256332A JPS61134245A (en) | 1984-12-03 | 1984-12-03 | Glass base material metallic-foil lined laminated board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59256332A JPS61134245A (en) | 1984-12-03 | 1984-12-03 | Glass base material metallic-foil lined laminated board and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61134245A JPS61134245A (en) | 1986-06-21 |
| JPH0226857B2 true JPH0226857B2 (en) | 1990-06-13 |
Family
ID=17291199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59256332A Granted JPS61134245A (en) | 1984-12-03 | 1984-12-03 | Glass base material metallic-foil lined laminated board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61134245A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444743A (en) * | 1987-08-11 | 1989-02-17 | Nec Corp | Copper clad laminated plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52796A (en) * | 1975-06-24 | 1977-01-06 | Tsurumi Soda Kk | Purification process of solution of sodium hypochlorite |
| JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
| JPS5812750A (en) * | 1981-07-15 | 1983-01-24 | 松下電工株式会社 | Manufacture of laminated board |
-
1984
- 1984-12-03 JP JP59256332A patent/JPS61134245A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52796A (en) * | 1975-06-24 | 1977-01-06 | Tsurumi Soda Kk | Purification process of solution of sodium hypochlorite |
| JPS5698136A (en) * | 1980-01-08 | 1981-08-07 | Kanegafuchi Chem Ind Co Ltd | Continuous manufacture of laminated substance |
| JPS5812750A (en) * | 1981-07-15 | 1983-01-24 | 松下電工株式会社 | Manufacture of laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61134245A (en) | 1986-06-21 |
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