JPH0226778B2 - - Google Patents

Info

Publication number
JPH0226778B2
JPH0226778B2 JP57123914A JP12391482A JPH0226778B2 JP H0226778 B2 JPH0226778 B2 JP H0226778B2 JP 57123914 A JP57123914 A JP 57123914A JP 12391482 A JP12391482 A JP 12391482A JP H0226778 B2 JPH0226778 B2 JP H0226778B2
Authority
JP
Japan
Prior art keywords
silicone
coating
group
film
baking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57123914A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5914641A (ja
Inventor
Toshihiro Nishimura
Muneo Nakayama
Akira Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP57123914A priority Critical patent/JPS5914641A/ja
Publication of JPS5914641A publication Critical patent/JPS5914641A/ja
Publication of JPH0226778B2 publication Critical patent/JPH0226778B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02205Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
    • H01L21/02208Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP57123914A 1982-07-16 1982-07-16 シリコ−ン系被覆の形成方法 Granted JPS5914641A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57123914A JPS5914641A (ja) 1982-07-16 1982-07-16 シリコ−ン系被覆の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57123914A JPS5914641A (ja) 1982-07-16 1982-07-16 シリコ−ン系被覆の形成方法

Publications (2)

Publication Number Publication Date
JPS5914641A JPS5914641A (ja) 1984-01-25
JPH0226778B2 true JPH0226778B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-06-12

Family

ID=14872463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57123914A Granted JPS5914641A (ja) 1982-07-16 1982-07-16 シリコ−ン系被覆の形成方法

Country Status (1)

Country Link
JP (1) JPS5914641A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726562Y2 (ja) * 1988-04-28 1995-06-14 日立建機株式会社 油圧アクチュエータ駆動装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6058592B2 (ja) * 1978-10-06 1985-12-20 株式会社日立製作所 半導体装置
JPS5813632A (ja) * 1981-07-17 1983-01-26 Japan Synthetic Rubber Co Ltd 耐熱性薄膜形成能を有するラダ−状低級アルキルポリシルセスキオキサン

Also Published As

Publication number Publication date
JPS5914641A (ja) 1984-01-25

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