JPH0223324B2 - - Google Patents

Info

Publication number
JPH0223324B2
JPH0223324B2 JP59238935A JP23893584A JPH0223324B2 JP H0223324 B2 JPH0223324 B2 JP H0223324B2 JP 59238935 A JP59238935 A JP 59238935A JP 23893584 A JP23893584 A JP 23893584A JP H0223324 B2 JPH0223324 B2 JP H0223324B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
dicing
adhesive
adhesive tape
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59238935A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61116504A (ja
Inventor
Masahiro Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP59238935A priority Critical patent/JPS61116504A/ja
Publication of JPS61116504A publication Critical patent/JPS61116504A/ja
Publication of JPH0223324B2 publication Critical patent/JPH0223324B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
JP59238935A 1984-11-13 1984-11-13 ダイシング方法 Granted JPS61116504A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59238935A JPS61116504A (ja) 1984-11-13 1984-11-13 ダイシング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59238935A JPS61116504A (ja) 1984-11-13 1984-11-13 ダイシング方法

Publications (2)

Publication Number Publication Date
JPS61116504A JPS61116504A (ja) 1986-06-04
JPH0223324B2 true JPH0223324B2 (enrdf_load_html_response) 1990-05-23

Family

ID=17037463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59238935A Granted JPS61116504A (ja) 1984-11-13 1984-11-13 ダイシング方法

Country Status (1)

Country Link
JP (1) JPS61116504A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0622213U (ja) * 1992-08-21 1994-03-22 伊藤景パック産業株式会社 展示用手提げ箱
JP2004338137A (ja) * 2003-05-13 2004-12-02 Fuji Photo Film Co Ltd 材料加工方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63205209A (ja) * 1987-02-20 1988-08-24 太陽誘電株式会社 セラミツク配線基板の裁断方法
JPS6461208A (en) * 1987-09-01 1989-03-08 Fsk Kk Cutting method of wafer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616527B2 (ja) * 1983-07-29 1994-03-02 関西日本電気株式会社 半導体ウエ−ハダイシング用接着シ−ト

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0622213U (ja) * 1992-08-21 1994-03-22 伊藤景パック産業株式会社 展示用手提げ箱
JP2004338137A (ja) * 2003-05-13 2004-12-02 Fuji Photo Film Co Ltd 材料加工方法

Also Published As

Publication number Publication date
JPS61116504A (ja) 1986-06-04

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