JPS6461208A - Cutting method of wafer - Google Patents
Cutting method of waferInfo
- Publication number
- JPS6461208A JPS6461208A JP21864087A JP21864087A JPS6461208A JP S6461208 A JPS6461208 A JP S6461208A JP 21864087 A JP21864087 A JP 21864087A JP 21864087 A JP21864087 A JP 21864087A JP S6461208 A JPS6461208 A JP S6461208A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- state
- protective film
- film
- stuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
PURPOSE:To prevent adhesion of a foreign matter such as trash or chips to the surface of a wafer, by a method wherein radiant rays are applied to a specific protective film after the wafer has been cut off in a chiplike state by sticking the film to the surface of the wafer and the film is peeled off from the surface of the wafer by heating and shrinking the wafer. CONSTITUTION:A dicing sheet 4 is stuck to the backside of a wafer 2 which is prior to cutting-off into a state of elemental small pieces and a protective film comprised of a heat-shrinkable plastic film is stuck to the surface of the said wafer with a radiation-crosslinkable adhesive agent. The wafer 2 is cut into a state of the elemental small pieces by a dicer 8 and a wafer chip 2a is obtained. Then radiant rays are applied to a protective film 6 side by a radiant ray irradiating device 18 of UV and the wafer is heated within a range not exerting a bad influence upon the wafer chip 2a at a heat-shrinkable temperature or higher of a base material 10. The protective film 6 stuck to the surface of the each wafer chip 2a is shrinked thermally into a state of a roll or a dumpling and peeled off from the surface of the wafer chip 2a.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21864087A JPS6461208A (en) | 1987-09-01 | 1987-09-01 | Cutting method of wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21864087A JPS6461208A (en) | 1987-09-01 | 1987-09-01 | Cutting method of wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6461208A true JPS6461208A (en) | 1989-03-08 |
JPH057168B2 JPH057168B2 (en) | 1993-01-28 |
Family
ID=16723116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21864087A Granted JPS6461208A (en) | 1987-09-01 | 1987-09-01 | Cutting method of wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6461208A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0365249U (en) * | 1989-10-30 | 1991-06-25 | ||
US20080121335A1 (en) * | 2006-11-29 | 2008-05-29 | Nitto Denko Corporation | Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet |
CN115178884A (en) * | 2022-09-13 | 2022-10-14 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Wafer thermal separation method |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011054641A (en) * | 2009-08-31 | 2011-03-17 | Nitto Denko Corp | Method for separating and removing dicing surface protection tape from object to be cut |
JP5597422B2 (en) * | 2010-01-19 | 2014-10-01 | デクセリアルズ株式会社 | Method for manufacturing electronic component with adhesive film and method for manufacturing mounting body |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61116504A (en) * | 1984-11-13 | 1986-06-04 | 山形日本電気株式会社 | Dicing method |
JPS6279649A (en) * | 1985-10-03 | 1987-04-13 | Mitsui Toatsu Chem Inc | Dicing method for semiconductor |
JPS62153376A (en) * | 1985-12-27 | 1987-07-08 | F S K Kk | Pressure-sensitive adhesive sheet |
JPS62153375A (en) * | 1985-12-27 | 1987-07-08 | F S K Kk | Pressure-sensitive adhesive sheet |
JPS62216244A (en) * | 1986-03-17 | 1987-09-22 | Fujitsu Ltd | Manufacture of semiconductor device |
-
1987
- 1987-09-01 JP JP21864087A patent/JPS6461208A/en active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61116504A (en) * | 1984-11-13 | 1986-06-04 | 山形日本電気株式会社 | Dicing method |
JPS6279649A (en) * | 1985-10-03 | 1987-04-13 | Mitsui Toatsu Chem Inc | Dicing method for semiconductor |
JPS62153376A (en) * | 1985-12-27 | 1987-07-08 | F S K Kk | Pressure-sensitive adhesive sheet |
JPS62153375A (en) * | 1985-12-27 | 1987-07-08 | F S K Kk | Pressure-sensitive adhesive sheet |
JPS62216244A (en) * | 1986-03-17 | 1987-09-22 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0365249U (en) * | 1989-10-30 | 1991-06-25 | ||
US20080121335A1 (en) * | 2006-11-29 | 2008-05-29 | Nitto Denko Corporation | Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet |
CN115178884A (en) * | 2022-09-13 | 2022-10-14 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Wafer thermal separation method |
Also Published As
Publication number | Publication date |
---|---|
JPH057168B2 (en) | 1993-01-28 |
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Legal Events
Date | Code | Title | Description |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
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EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
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