JPH0222993Y2 - - Google Patents

Info

Publication number
JPH0222993Y2
JPH0222993Y2 JP1984188159U JP18815984U JPH0222993Y2 JP H0222993 Y2 JPH0222993 Y2 JP H0222993Y2 JP 1984188159 U JP1984188159 U JP 1984188159U JP 18815984 U JP18815984 U JP 18815984U JP H0222993 Y2 JPH0222993 Y2 JP H0222993Y2
Authority
JP
Japan
Prior art keywords
wire
pressure contact
fixed arm
movable
permanent magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984188159U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61104547U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984188159U priority Critical patent/JPH0222993Y2/ja
Publication of JPS61104547U publication Critical patent/JPS61104547U/ja
Application granted granted Critical
Publication of JPH0222993Y2 publication Critical patent/JPH0222993Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP1984188159U 1984-12-13 1984-12-13 Expired JPH0222993Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984188159U JPH0222993Y2 (en, 2012) 1984-12-13 1984-12-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984188159U JPH0222993Y2 (en, 2012) 1984-12-13 1984-12-13

Publications (2)

Publication Number Publication Date
JPS61104547U JPS61104547U (en, 2012) 1986-07-03
JPH0222993Y2 true JPH0222993Y2 (en, 2012) 1990-06-21

Family

ID=30745629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984188159U Expired JPH0222993Y2 (en, 2012) 1984-12-13 1984-12-13

Country Status (1)

Country Link
JP (1) JPH0222993Y2 (en, 2012)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5850422B2 (ja) * 1978-11-20 1983-11-10 松下電子工業株式会社 ワイヤボンディング装置
JPS567443A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonder
JPS59112631A (ja) * 1982-12-17 1984-06-29 Matsushita Electric Ind Co Ltd ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPS61104547U (en, 2012) 1986-07-03

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