JPH0236279Y2 - - Google Patents
Info
- Publication number
- JPH0236279Y2 JPH0236279Y2 JP12843485U JP12843485U JPH0236279Y2 JP H0236279 Y2 JPH0236279 Y2 JP H0236279Y2 JP 12843485 U JP12843485 U JP 12843485U JP 12843485 U JP12843485 U JP 12843485U JP H0236279 Y2 JPH0236279 Y2 JP H0236279Y2
- Authority
- JP
- Japan
- Prior art keywords
- clamp
- movable
- spring plate
- movable spring
- clamping force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 32
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 230000002265 prevention Effects 0.000 description 6
- 238000000926 separation method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12843485U JPH0236279Y2 (en, 2012) | 1985-08-23 | 1985-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12843485U JPH0236279Y2 (en, 2012) | 1985-08-23 | 1985-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237929U JPS6237929U (en, 2012) | 1987-03-06 |
| JPH0236279Y2 true JPH0236279Y2 (en, 2012) | 1990-10-03 |
Family
ID=31024099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12843485U Expired JPH0236279Y2 (en, 2012) | 1985-08-23 | 1985-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236279Y2 (en, 2012) |
-
1985
- 1985-08-23 JP JP12843485U patent/JPH0236279Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6237929U (en, 2012) | 1987-03-06 |
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