JPH025535Y2 - - Google Patents
Info
- Publication number
- JPH025535Y2 JPH025535Y2 JP18590484U JP18590484U JPH025535Y2 JP H025535 Y2 JPH025535 Y2 JP H025535Y2 JP 18590484 U JP18590484 U JP 18590484U JP 18590484 U JP18590484 U JP 18590484U JP H025535 Y2 JPH025535 Y2 JP H025535Y2
- Authority
- JP
- Japan
- Prior art keywords
- clamp
- spring plate
- lead wire
- wire
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 48
- 230000002159 abnormal effect Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000926 separation method Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18590484U JPH025535Y2 (en, 2012) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18590484U JPH025535Y2 (en, 2012) | 1984-12-07 | 1984-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61100135U JPS61100135U (en, 2012) | 1986-06-26 |
| JPH025535Y2 true JPH025535Y2 (en, 2012) | 1990-02-09 |
Family
ID=30743363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18590484U Expired JPH025535Y2 (en, 2012) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025535Y2 (en, 2012) |
-
1984
- 1984-12-07 JP JP18590484U patent/JPH025535Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61100135U (en, 2012) | 1986-06-26 |
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