JPH0236279Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to an improvement in a clamp device that is installed in a wire bonder and that clamps or unclamps a lead wire as appropriate during the bonding process.

(Prior Art) As is well known, the lead wire of a wire bonder is drawn out from a wire supply source to a capillary, and lead wiring is performed from a first bond position to a second bond position by moving this capillary. . In that case, the movement of the capillary follows the following path. That is, first, after a wire bond connection is made at the first bonding position, the capillary rises to a predetermined position, and after this rising is completed, it horizontally moves to just above the second bonding position, and then from directly above this to the second bonding position. Perform a downward movement to the bond position. Then, the intended bonding connection is performed at this second bonding position, and lead connection between the first bonding position and the second bonding position is achieved.

However, in this case, since the straight line distance from the first bond position to directly above the second bond position is greater than the straight line distance from the first bond position to the second bond position, the straight line distance from the position directly above the second bond to the second bond position When the capillary descends to this point, the lead wire becomes slack, resulting in a so-called underloop condition, which causes various problems.

In order to prevent such under-loops, in recent years a wire clamp device has been installed above the capillary, which clamps the lead wire when the capillary descends to the second bonding position, and removes the excess lead wire due to the descent of the capillary. The above-mentioned under loop is prevented from occurring by pulling up the capillary relatively upwardly from the capillary.

As such a clamp device, one shown in FIG. 1 is known. In the figure, a clamp holder 1 is fixed to the main body of a wire bonder (not shown), and the clamp holder 1 is formed with a first stepped surface 1a and a second stepped surface 1b. A clamp material 2 is provided at the tip of the first stepped surface 1a.
is fixed, and a fixed side clamping surface 2a is formed on the surface thereof. In addition, the second stepped surface 1
b, the base of a thin movable spring plate 4 is fastened and fixed with a screw 5 via a presser plate 3, and a movable clamp member 7 is attached to the tip of the movable spring plate 4 via a buffer material 6. Fixed. A movable clamp surface 7a is formed on the surface of the movable clamp member 7, and the movable clamp surface 7a faces the fixed clamp surface 2a with the lead wire 8 in between. Note that the lead wire 8 is fed out from a lead wire supply source, and the clamping surface 2
It passes between a and 7a and reaches the capillary.

A base portion of a clamping force transmitting plate 9 is fixed to the end face of the clamp holder 1 with screws in the same manner as in the case of the movable spring plate 4. This clamping force transmission plate 9 is also made of a thin spring plate, and its tip is bent at an almost right angle, and comes into contact with the back surface of the movable spring plate 4 on a line connecting the centers of both fixed and movable clamping surfaces 2a and 7a. has been done.

On the other hand, a swingable clamp opening/closing rod 10 driven by a cam or the like (not shown) is provided at a side of the clamping force transmitting plate 9.
A clamping force adjusting screw 11 is screwed into the clamp opening/closing rod 10, and the tip of the clamping force adjusting screw 11 is brought into contact with approximately the center of the clamping force transmitting plate 9. Therefore, by moving the clamping force adjusting screw forward or backward, the clamping force of the lead wire 8 is adjusted, and the clamp adjusting screw 11 is locked by the locking screw 12 at this optimum adjusted position. It's summery.
This clamping force must be applied within a range that does not cause abnormal deformation to the lead wire 8, and is usually 2g to 5g.
is set within the range. The clamp force transmitting plate 9 and the clamp opening/closing rod 10 constitute a clamp driving means 14 for driving the movable clamp surface 7a.

In the conventional device having the above configuration, when the clamp opening/closing rod 10 is in the clamp position, that is, when the clamp opening/closing rod 10 is swung in the direction of the clamping force transmitting plate 9 and is in the position shown in FIG. A transmission force is received by the clamp force adjustment screw 11, and this transmission force causes the movable spring plate 4 to
is bent in the direction of the lead wire 8, and the lead wire 8
is clamped and fixed between fixed and movable clamp surfaces 2a and 7a on both sides.

On the other hand, when the clamp opening/closing rod 10 moves to the clamp release position, that is, the clamp opening/closing rod 10 swings in the opposite direction to the position shown in FIG.
The contact with is released. As a result, the movable spring plate 4
Both the clamp force transmission plate 9 returns from the deflected position to the original free position, and a certain gap is formed between the lead wire 8 and the movable clamp surface 7a.

The operation of the clamp opening/closing rod 10 is controlled by a cam or the like in correspondence with each step position of the vertical movement of the capillary.

(Problems to be solved by the invention) In recent years, bonding speeds have been increased with the aim of improving production efficiency. Therefore, the clamping and releasing operations of the clamp opening/closing rod 10 are performed at high speed, and the clamping force is transmitted from the clamping force transmitting plate 9 to the movable spring plate 4 and its release is performed impulsively.

However, the movable spring plate 4 and the clamping force transmission plate 9 are made of thin spring material from the viewpoint of reducing the clamping force, and therefore, these spring materials are The problem is that it causes vibration. Therefore, in particular, when the clamp is released, the movable clamp surface 7a vibrates toward and away from the lead wire 8, that is, causes interference with the lead wire 8, which may cause poor shape of the loop when the lead wire 8 is formed. Furthermore, due to the contact and separation vibration of the movable clamp surface 7a, the followability of the movable clamp surface 7a to the opening/closing command is substantially inferior, and this is a problem in increasing the speed of wire bonding. It was becoming an obstacle.

This invention was made in consideration of the above problems.
This prevents shocking vibration of the movable clamp surface when the lead wire is unclamped, thereby avoiding interference with the lead wire, and improves the ability of the movable clamp surface to follow clamp release commands, thereby improving wire bonding. The object of the present invention is to provide a wire bonder clamping device that can sufficiently respond to increased speeds.

(Means for Solving the Problems) The present invention has the following configuration in order to solve the above problems. That is, there is a fixed side clamp surface that is fixedly disposed on the clamp holder and faces the lead wire, a movable spring plate whose base end is fixed to the clamp holder, and the fixed side on the front surface of this movable spring plate. A wire clamp for a wire bonder, which has a movable clamp surface disposed to face the clamp surface, and a clamp driving means for driving the movable clamp surface to open and close the movable clamp surface with respect to the fixed clamp surface to clamp and unclamp a lead wire. The device is a wire clamping device for a wire bonder, in which a bounce prevention member is provided in the vicinity of the movable spring plate to restrict shock vibration of the movable spring plate that occurs when the lead wire is clamped and unclamped. .

(Function) In the present invention having the above configuration, when the clamp driving means performs a clamping operation, the movable spring plate receives an instantaneous force from the clamp driving means and bends in the direction of the fixed clamp surface, thereby fixing and fixing the lead wire.
Clamp between the movable clamp surfaces on both sides. and,
When the clamp drive means performs a clamp release operation, the movable spring plate is instantaneously subjected to the release action of the transmission force, and therefore begins to generate impact vibrations. However, since this impact vibration is similarly regulated by the bounce prevention member, the movable clamp surface does not vibrate toward or away from the lead wire.

(Example) Hereinafter, an example of the present invention will be described based on the drawings. In the description of this embodiment, the same members as those in the conventional device are given the same reference numerals, and the description thereof will be omitted.

FIG. 3 shows an embodiment of the present invention.
Bound prevention member 13 characteristic of the present invention
is arranged near the movable spring plate 4.
As shown in FIG. 4, this bounce prevention member 13 has a fulcrum shaft 13a at one end of a rod-shaped base shaft 13C.
Bound regulating arms 13b are each bent at the other end to form a U-shape, and the fulcrum shaft 13a is fitted into a rotation hole provided in the clamp opening/closing rod 10 so as to be frictionally rotatable. Note that this fulcrum shaft 13
The frictional resistance a is set to a sufficiently large value to prevent the fulcrum shaft 13a from rotating freely due to the reaction force of the movable spring plate 4. If required, it is designed so that its size can be adjusted by, for example, spring pressure. Further, depending on the case, a locking means for locking the fulcrum shaft 13a at a desired adjustment position is provided. Furthermore, if the arrangement position and dimensions of the bound regulating arm 13b and various other specifications are determined, the fulcrum shaft 13a may be fixedly arranged at a predetermined optimal rotational position from the beginning.

On the other hand, the bound regulating arm 13b straddles the movable spring plate 4 and faces the inner side of the movable spring plate 4, that is, the surface on the attachment side of the movable clamp member 7. When the clamp opening/closing rod 10 is in the clamp position, the bound regulating arm 13b is disposed with a predetermined gap t between the movable spring plate 4 and the movable spring plate 4.

This embodiment is constructed as described above. For example, when the clamp opening/closing rod 10 moves to the clamping position, the clamping force is transmitted from the clamping force transmission plate 9 to the movable spring plate 4, and the lead wire 8 is clamped. achieved.

On the other hand, when the clamp opening/closing rod 10 moves to the clamp release position, the movable spring plate 4 is instantaneously subjected to the clamp force transmission release action and begins to generate impact vibrations. However, when this clamp is released, the movable spring plate 4 is pulled to the right in FIG. As a result of the shock vibration of the spring plate 4 being prevented by the bound regulating arm 13b, the movable side clamping surface 7a is reliably separated without causing any vibration that would cause it to come into contact with the lead wire 8. Therefore, the clamp surface 7a does not interfere with the lead wire when the clamp is released, and the movable clamp surface 7a follows the clamp release command extremely quickly.

(Other Application Examples) Wire bonders are usually provided with two types of clamp devices. One is a tension clamp device to prevent under-loops that occur when the capillary is lowered to the second bond position, and the other is a tension clamp device that prevents under-loops that occur when the capillary is lowered to the second bond position. This is a cut clamp device that clamps the lead wire when cutting the lead wire.

Although this embodiment has been described using a tension clamp device as an example, the device of the present invention can also be applied to a cut clamp device.

(Effects of the invention) Since the present invention is constructed as described above, when the clamp is released, the movable clamp surface does not interfere with the lead wire due to shocking contact/separation vibration, and the movable spring plate Since the impact vibration of the clamp is effectively suppressed, it is possible to greatly improve the ability of the movable clamp surface to follow clamping and unclamping commands, thereby sufficiently promoting high-speed wire bonding. It is possible to do so.

[Brief explanation of the drawing]

FIG. 1 is a front view of a conventional clamp device in a closed state, FIG. 2 is a front view of the same device in an open state, and FIG. 3 is a front view of the clamp device of the present invention.
FIG. 4 is a front view of the bounce prevention member used in the device of the present invention. DESCRIPTION OF SYMBOLS 1... Clamp holder, 2a... Fixed side clamp surface, 4... Movable spring plate, 7a... Movable side clamp surface, 8... Lead wire, 9... Clamp force transmission plate, 10... Clamp opening/closing rod, 13... Bound prevention member, 14... Clamp driving means.

Claims (1)

[Scope of claim for utility model registration] (1) A fixed side clamp surface that is fixedly disposed on the clamp holder and faces the lead wire, a movable spring plate whose base end is fixed to the clamp holder, and this movable spring plate. a movable clamp surface disposed opposite the fixed clamp surface on the front surface of the clamp, and a clamp that clamps and unclamps the lead wire by driving the movable clamp surface to open and close the movable clamp surface with respect to the fixed clamp surface. 1. A wire clamping device for a wire bonder having a driving means, characterized in that a bounce preventing member is provided near the movable spring plate for regulating impact vibration of the movable spring plate. (2) The clamp driving means includes a clamping force transmitting plate whose base end is fixed to the clamp holder and whose distal end is linked to the back surface of the movable spring plate, and a clamping force transmitting plate that is swingably provided at a side position of the clamping force transmitting plate. and a clamp opening/closing rod that transmits the clamping force to the clamping force transmission plate through this swinging action. A utility model according to claim 1, which has a rectangular U-shape, the fulcrum shaft is attached to the clamp opening/closing rod, and the bound regulating arm is opposed to the front surface of the movable spring plate. Wire bonder wire clamp device.