JPH04273134A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPH04273134A
JPH04273134A JP3053700A JP5370091A JPH04273134A JP H04273134 A JPH04273134 A JP H04273134A JP 3053700 A JP3053700 A JP 3053700A JP 5370091 A JP5370091 A JP 5370091A JP H04273134 A JPH04273134 A JP H04273134A
Authority
JP
Japan
Prior art keywords
wire
capillary
point
neck part
bonding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3053700A
Other languages
English (en)
Other versions
JP2814151B2 (ja
Inventor
Yoshimitsu Terakado
義光 寺門
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP3053700A priority Critical patent/JP2814151B2/ja
Priority to KR1019920001397A priority patent/KR920017205A/ko
Priority to US07/842,257 priority patent/US5192018A/en
Publication of JPH04273134A publication Critical patent/JPH04273134A/ja
Application granted granted Critical
Publication of JP2814151B2 publication Critical patent/JP2814151B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は第１ボンド点と第２ボン
ド点との間をワイヤで接続するワイヤボンデイング方法
に係り、特にワイヤルーピング方法に関する。
【０００２】
【従来の技術】従来、ワイヤルーピング形状の安定化を
図るために、例えば特開昭５７ー８７１４３号公報、特
開昭６３ー４２１３５号公報に示すように、ワイヤをク
ランプするクランパは開状態で、第１ボンド点にワイヤ
を接続後、キヤピラリを上昇させ、その後キヤピラリを
第２ボンド点と逆方向に僅かに水平移動させるリバース
動作を行わせている。即ち、リバース動作は、第１ボン
ド点と第２ボンド点にワイヤを張るワイヤルーピング方
向とは逆の変形をワイヤに与える動作である。
【０００３】
【発明が解決しようとする課題】上記従来技術における
リバース動作は、キヤピラリを水平に移動させているの
で、ワイヤを引きずる動作となり、ワイヤに該ワイヤを
変形させる以外の余分な力が加わり、ワイヤのネック部
（第１ボンド点の部分）にダメージを与えるという問題
点があった。
【０００４】本発明の目的は、理想的なワイヤループの
形成及びワイヤにダメージを与えないでリバース動作を
伴ったワイヤルーピングが行えるワイヤボンデイング方
法を提供することにある。
【０００５】
【課題を解決するための手段】上記目的を達成するため
の本発明の構成は、第１ボンド点にワイヤを接続後、キ
ヤピラリを上昇させ、その後リバース動作を行わせるワ
イヤボンデイング方法において、前記リバース動作は、
第１ボンド点のワイヤネック部又はワイヤネック部近傍
を中心とした円弧動作であることを特徴とする。
【０００６】
【作用】リバース動作は、円弧動作であるので、理想的
なワイヤループの形成及びキヤピラリがワイヤを引きず
ることがなく、ワイヤにダメージを与えない。
【０００７】
【実施例】以下、本発明の一実施例を図１及び図２によ
り説明する。ワイヤ１をクランプするクランパは開状態
で、第１ボンド点Ａにワイヤ１を接続後、キヤピラリ２
はＢ点まで上昇する。このＢ点で一旦又は瞬時停止した
後、次にキヤピラリ２をワイヤネック部１ａ又はワイヤ
ネック部１ａの近傍を中心とした半径Ｒの円弧動作でリ
バース動作を行わせてＣ点まで移動させる。
【０００８】このように、リバース動作は、ワイヤネッ
ク部１ａ又はワイヤネック部１ａの近傍を中心とした円
弧動作であるので、キヤピラリ２がワイヤ１を引きずる
ことがない。このため、ワイヤ１には該ワイヤ１を変形
させる力以外の力は加わらなく、ワイヤ１にダメージを
与えないでワイヤルーピングが行える。
【０００９】前記リバース動作後のＣ点からは、キヤピ
ラリ２はワイヤループ形成に必要な量のＤ点まで上昇し
てワイヤ１を繰り出す。その後、クランパを閉じ、ワイ
ヤネック部１ａ又はワイヤネック部１ａの近傍を中心と
した半径Ｌの円弧で第２ボンド点Ｆの上方のＥ点まで移
動し、続いて第２ボンド点Ｆに下降してボンデイングす
る。なお、Ｃ点から第２ボンド点Ｆまでのキヤピラリ２
の動作は、前記した従来例に開示されている動作と同様
の動作を行わせてもよい。
【００１０】
【発明の効果】本発明によれば、リバース動作は、円弧
動作であるので、キヤピラリがワイヤを引きずることが
なく、ワイヤにダメージを与えないと共に、理想的なワ
イヤループが形成される。
【図面の簡単な説明】
【図１】本発明の一実施例になるキヤピラリの軌跡を示
す説明図である。
【図２】要部説明図である。
【符号の説明】
１　　　　ワイヤ １ａ　　ワイヤネック部 ２　　　　キヤピラリ Ａ　　　　第１ボンド点

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】　　第１ボンド点にワイヤを接続後、キヤ
    ピラリを上昇させ、その後リバース動作を行わせるワイ
    ヤボンデイング方法において、前記リバース動作は、第
    １ボンド点のワイヤネック部又はワイヤネック部近傍を
    中心とした円弧動作であることを特徴とするワイヤボン
    デイング方法。
JP3053700A 1991-02-27 1991-02-27 ワイヤボンデイング方法 Expired - Fee Related JP2814151B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3053700A JP2814151B2 (ja) 1991-02-27 1991-02-27 ワイヤボンデイング方法
KR1019920001397A KR920017205A (ko) 1991-02-27 1992-01-30 와이어 본딩방법
US07/842,257 US5192018A (en) 1991-02-27 1992-02-27 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3053700A JP2814151B2 (ja) 1991-02-27 1991-02-27 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPH04273134A true JPH04273134A (ja) 1992-09-29
JP2814151B2 JP2814151B2 (ja) 1998-10-22

Family

ID=12950099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3053700A Expired - Fee Related JP2814151B2 (ja) 1991-02-27 1991-02-27 ワイヤボンデイング方法

Country Status (3)

Country Link
US (1) US5192018A (ja)
JP (1) JP2814151B2 (ja)
KR (1) KR920017205A (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
JP3333413B2 (ja) * 1996-12-27 2002-10-15 株式会社新川 ワイヤボンディング方法
JP3370539B2 (ja) * 1997-01-13 2003-01-27 株式会社新川 ワイヤボンディング方法
JP3455092B2 (ja) * 1997-10-27 2003-10-06 株式会社新川 半導体装置及びワイヤボンディング方法
TW424027B (en) * 1998-01-15 2001-03-01 Esec Sa Method of making wire connections of predetermined shaped
EP0937530A1 (de) * 1998-02-19 1999-08-25 ESEC Management SA Verfahren zum Herstellen von Drahtverbindungen an Halbleiterchips
US6102275A (en) * 1998-07-10 2000-08-15 Palomar Technologies, Inc. Bond head having dual axes of motion
US7464854B2 (en) * 2005-01-25 2008-12-16 Kulicke And Soffa Industries, Inc. Method and apparatus for forming a low profile wire loop
TWI518814B (zh) * 2013-04-15 2016-01-21 新川股份有限公司 半導體裝置以及半導體裝置的製造方法
US10600756B1 (en) 2017-02-15 2020-03-24 United States Of America, As Represented By The Secretary Of The Navy Wire bonding technique for integrated circuit board connections

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
JPS5787143A (en) * 1980-11-19 1982-05-31 Shinkawa Ltd Method for wire bonding
US4445633A (en) * 1982-02-11 1984-05-01 Rockwell International Corporation Automatic bonder for forming wire interconnections of automatically controlled configuration
JPS6342135A (ja) * 1986-08-08 1988-02-23 Shinkawa Ltd ワイヤボンデイング方法

Also Published As

Publication number Publication date
JP2814151B2 (ja) 1998-10-22
KR920017205A (ko) 1992-09-26
US5192018A (en) 1993-03-09

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