JPH04273134A - ワイヤボンデイング方法 - Google Patents
ワイヤボンデイング方法Info
- Publication number
- JPH04273134A JPH04273134A JP3053700A JP5370091A JPH04273134A JP H04273134 A JPH04273134 A JP H04273134A JP 3053700 A JP3053700 A JP 3053700A JP 5370091 A JP5370091 A JP 5370091A JP H04273134 A JPH04273134 A JP H04273134A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capillary
- point
- neck part
- bonding method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
め要約のデータは記録されません。
Description
ド点との間をワイヤで接続するワイヤボンデイング方法
に係り、特にワイヤルーピング方法に関する。
図るために、例えば特開昭57ー87143号公報、特
開昭63ー42135号公報に示すように、ワイヤをク
ランプするクランパは開状態で、第1ボンド点にワイヤ
を接続後、キヤピラリを上昇させ、その後キヤピラリを
第2ボンド点と逆方向に僅かに水平移動させるリバース
動作を行わせている。即ち、リバース動作は、第1ボン
ド点と第2ボンド点にワイヤを張るワイヤルーピング方
向とは逆の変形をワイヤに与える動作である。
リバース動作は、キヤピラリを水平に移動させているの
で、ワイヤを引きずる動作となり、ワイヤに該ワイヤを
変形させる以外の余分な力が加わり、ワイヤのネック部
(第1ボンド点の部分)にダメージを与えるという問題
点があった。
形成及びワイヤにダメージを与えないでリバース動作を
伴ったワイヤルーピングが行えるワイヤボンデイング方
法を提供することにある。
の本発明の構成は、第1ボンド点にワイヤを接続後、キ
ヤピラリを上昇させ、その後リバース動作を行わせるワ
イヤボンデイング方法において、前記リバース動作は、
第1ボンド点のワイヤネック部又はワイヤネック部近傍
を中心とした円弧動作であることを特徴とする。
なワイヤループの形成及びキヤピラリがワイヤを引きず
ることがなく、ワイヤにダメージを与えない。
り説明する。ワイヤ1をクランプするクランパは開状態
で、第1ボンド点Aにワイヤ1を接続後、キヤピラリ2
はB点まで上昇する。このB点で一旦又は瞬時停止した
後、次にキヤピラリ2をワイヤネック部1a又はワイヤ
ネック部1aの近傍を中心とした半径Rの円弧動作でリ
バース動作を行わせてC点まで移動させる。
ク部1a又はワイヤネック部1aの近傍を中心とした円
弧動作であるので、キヤピラリ2がワイヤ1を引きずる
ことがない。このため、ワイヤ1には該ワイヤ1を変形
させる力以外の力は加わらなく、ワイヤ1にダメージを
与えないでワイヤルーピングが行える。
ラリ2はワイヤループ形成に必要な量のD点まで上昇し
てワイヤ1を繰り出す。その後、クランパを閉じ、ワイ
ヤネック部1a又はワイヤネック部1aの近傍を中心と
した半径Lの円弧で第2ボンド点Fの上方のE点まで移
動し、続いて第2ボンド点Fに下降してボンデイングす
る。なお、C点から第2ボンド点Fまでのキヤピラリ2
の動作は、前記した従来例に開示されている動作と同様
の動作を行わせてもよい。
動作であるので、キヤピラリがワイヤを引きずることが
なく、ワイヤにダメージを与えないと共に、理想的なワ
イヤループが形成される。
す説明図である。
Claims (1)
- 【請求項1】 第1ボンド点にワイヤを接続後、キヤ
ピラリを上昇させ、その後リバース動作を行わせるワイ
ヤボンデイング方法において、前記リバース動作は、第
1ボンド点のワイヤネック部又はワイヤネック部近傍を
中心とした円弧動作であることを特徴とするワイヤボン
デイング方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3053700A JP2814151B2 (ja) | 1991-02-27 | 1991-02-27 | ワイヤボンデイング方法 |
KR1019920001397A KR920017205A (ko) | 1991-02-27 | 1992-01-30 | 와이어 본딩방법 |
US07/842,257 US5192018A (en) | 1991-02-27 | 1992-02-27 | Wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3053700A JP2814151B2 (ja) | 1991-02-27 | 1991-02-27 | ワイヤボンデイング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04273134A true JPH04273134A (ja) | 1992-09-29 |
JP2814151B2 JP2814151B2 (ja) | 1998-10-22 |
Family
ID=12950099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3053700A Expired - Fee Related JP2814151B2 (ja) | 1991-02-27 | 1991-02-27 | ワイヤボンデイング方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5192018A (ja) |
JP (1) | JP2814151B2 (ja) |
KR (1) | KR920017205A (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
JP3333413B2 (ja) * | 1996-12-27 | 2002-10-15 | 株式会社新川 | ワイヤボンディング方法 |
JP3370539B2 (ja) * | 1997-01-13 | 2003-01-27 | 株式会社新川 | ワイヤボンディング方法 |
JP3455092B2 (ja) * | 1997-10-27 | 2003-10-06 | 株式会社新川 | 半導体装置及びワイヤボンディング方法 |
TW424027B (en) * | 1998-01-15 | 2001-03-01 | Esec Sa | Method of making wire connections of predetermined shaped |
EP0937530A1 (de) * | 1998-02-19 | 1999-08-25 | ESEC Management SA | Verfahren zum Herstellen von Drahtverbindungen an Halbleiterchips |
US6102275A (en) * | 1998-07-10 | 2000-08-15 | Palomar Technologies, Inc. | Bond head having dual axes of motion |
US7464854B2 (en) * | 2005-01-25 | 2008-12-16 | Kulicke And Soffa Industries, Inc. | Method and apparatus for forming a low profile wire loop |
TWI518814B (zh) * | 2013-04-15 | 2016-01-21 | 新川股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
US10600756B1 (en) | 2017-02-15 | 2020-03-24 | United States Of America, As Represented By The Secretary Of The Navy | Wire bonding technique for integrated circuit board connections |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4327860A (en) * | 1980-01-03 | 1982-05-04 | Kulicke And Soffa Ind. Inc. | Method of making slack free wire interconnections |
JPS5787143A (en) * | 1980-11-19 | 1982-05-31 | Shinkawa Ltd | Method for wire bonding |
US4445633A (en) * | 1982-02-11 | 1984-05-01 | Rockwell International Corporation | Automatic bonder for forming wire interconnections of automatically controlled configuration |
JPS6342135A (ja) * | 1986-08-08 | 1988-02-23 | Shinkawa Ltd | ワイヤボンデイング方法 |
-
1991
- 1991-02-27 JP JP3053700A patent/JP2814151B2/ja not_active Expired - Fee Related
-
1992
- 1992-01-30 KR KR1019920001397A patent/KR920017205A/ko not_active Application Discontinuation
- 1992-02-27 US US07/842,257 patent/US5192018A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2814151B2 (ja) | 1998-10-22 |
KR920017205A (ko) | 1992-09-26 |
US5192018A (en) | 1993-03-09 |
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