JPH02224300A - Device for sucking electronic component - Google Patents

Abstract

PURPOSE:To lessen impulses to electronic components and shorten the time required for sucking action by calculating the distance which makes the transferring speed of a suction nozzle a high speed on the basis of information on the height of the suction nozzle and the thickness of electronic component, and controlling the driving source for transfer on the basis of the calculation result. CONSTITUTION:The distance which makes the transferring speed of a suction nozzle a high speed is calculated with a calculating means 140, on the basis of information on the height of the suction nozzle and the thickness of electronic component stored in a storage means 141. And, the controlling means 140 controls the transferring driving source 144 for the suction nozzle on the basis of the calculation result obtained by the calculating means 140. This makes it possible to perform sucking action without taking extra time even for components with a thin part-thickness. In addition, impulses are prevented from being applied even to a component with a large thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an electronic component suction device for picking up electronic components by suctioning them with a suction nozzle.

(b) Prior art This type of electronic component suction device is disclosed in Japanese Patent Application Laid-Open No. 61-280700.
According to this publication, the suction nozzle moves at a low speed in the vicinity where the suction nozzle comes into contact with the electronic component,
It was designed to move at high speed in other positions.

(8) Problems to be Solved by the Invention According to the conventional example described above, no matter whether the electronic component is thick or thin,
Since the distance over which the suction nozzle moves at high speed is constant, the time required for suction operation is longer for thinner parts, and the nozzle movement speed is slower for thicker parts. The disadvantage is that the nozzle hits the parts before the speed is completely slowed down.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to perform a suction operation without taking extra time even for thin parts, and at the same time, to avoid applying impact to thick parts.

(d) Means for Solving the Problems To this end, the present invention provides an electronic component suction device for picking up electronic components by suctioning them with a suction nozzle, and providing information regarding the height of the suction nozzle and the thickness of the electronic component. a storage means for storing, a means for calculating a distance for increasing the moving speed of the suction nozzle based on the information stored in the storage means, and a drive source for moving the suction nozzle based on the calculation result by the calculation means. The system is equipped with means for controlling.

Further, the present invention provides an electronic component suction device that picks up and takes out electronic components with a suction nozzle, which includes a first storage means for storing data regarding the packing form of the electronic component, and a distance for fast movement of the nozzle. a second storage means storing a plurality of formulas for calculating the distance and the distance at which the speed is to be reduced; and a plurality of calculations stored in the second storage means based on the packaging data stored in the first storage means. a selection means for selecting an arbitrary one among the formulas; a calculation means for calculating the distance based on the calculation formula selected by the selection means; and a drive source for moving the suction nozzle based on the calculation result by the calculation means. A control means for controlling the control is provided.

The present invention also provides a component suction device that moves a plurality of suction nozzles up and down using one drive source to suction electronic components, in which information regarding the height of each of the suction nozzles and the thickness of each of the electronic components is provided. a calculating means for calculating a minimum descending distance and a maximum descending distance of each nozzle based on the information stored in the storing means, and a calculating means for rapidly lowering the nozzle by the minimum descending distance calculated by the calculating means. and control means for controlling the drive source so as to lower the nozzle at a low speed to a maximum descending distance.

(*) Effect According to the configuration of claim 1, the distance at which the moving speed of the suction nozzle is increased is determined based on the information regarding the suction nozzle height and the thickness of the electronic component stored in the storage means. According to the structure of claim 2, wherein the control means is characterized by a moving drive source for the suction nozzle based on the calculation result by the calculation means, the selection means is the first
An arbitrary one is selected from among the plurality of calculation formulas stored in the second storage means based on the packaging data stored in the storage means.

Then, the calculation means calculates the distance at which the suction nozzle moves at high speed and the distance at which it moves at low speed, based on the calculation formula selected by the selection means. Then, the control means controls the drive source for moving the suction nozzle based on the calculation result of the calculation means.

According to the structure of claim 3, the calculation means calculates the minimum descending distance of each nozzle based on the information regarding the height of each suction nozzle and the thickness of each electronic component stored in the memory culm. The control means controls the drive source to lower the nozzle at high speed by the calculated minimum lowering distance, and then lowers the nozzle at low speed to the maximum lowering distance.

(f) Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

In FIGS. 1 and 2, (1) is an electronic component mounting apparatus to which the present invention is applicable. (2) is a pair of supply conveyors, (3) is an X table section, (4) is a pair of discharge conveyors, (5) is a Y head section, and (6) is a pair of discharge conveyors.
) is a component supply unit that supplies electronic components (7), and (8
) is the tool exchange section.

The supply conveyor (2) conveys the printed circuit board (10),
The board (10) is supplied to the X table section (3), and the discharge conveyor (4) transports the printed circuit board (10) discharged from the X table section (3) to be discharged to a downstream device. It is something.

Next, the Y head section (5) will be explained in detail. In Figs. 1 to 3, (12) (12) are attachment points, which are attached to the head nuts (14) (14) fitted to the head ball screws (13) (13). Ori, to
Driven by the throat drive motor (15) (15), the ball screws (13) (13) rotate and are guided by the head linear guide (16) (16) (16) (16).
Move in the direction.

Electronic components (7) supplied from the component supply section (6) are mounted on the printed circuit board (10) at the X table section (3).

The mounting head (12) will be explained in detail. In Fig. 3, (18) is the suction nozzle (1) that suctions the electronic component (7).
9) is a vertically movable body that holds a tool (21) by vacuum suction so that it can be exchanged, and three of them are provided on the mounting head (12) so as to be able to move upwardly. Many types of tools (21) are available, each having a suction nozzle (19) with a different thickness depending on the size of the part (7). The tool (21) is exchanged at the tool exchange section (8).

(23) is a stopper mechanism that restricts the vertically movable body (18) from descending, and (24) is the vertically movable body (18).
It is a vertical movement drive mechanism that moves up and down.

Next, the stopper mechanism (23) will be explained in detail. (26
) is a stopper lever having a claw part (27) at the lower end, and a mounting plate (29) attached to the head nut (14).
) The upper end is rotatably attached to a solenoid (30), and swings about a support shaft (31) as the solenoid (30) moves back and forth.

That is, when the solenoid (30) protrudes in a demagnetized state, the claw portion (27) engages with the lower surface of the flange (32) and restricts the downward movement of the vertically movable body (18).
When the solenoid (30) is energized and retreats, the claw (27) comes off from the flange (32) provided on the vertically movable body (18), allowing the vertically movable body (18) to move downward.

Next, the vertical movement drive mechanism (24) will be described in detail.

When the vertical movement motor (34) rotates the vertical movement ball screw (35), the vertical movement plate (37) attached to the vertical movement nut (36) moves into the linear guide (38) provided on the mounting plate (49). ) (38). The vertically movable plate (37) has three locking pins (39) (39) (39) that engage with the lower surface of the flange (32) to support the vertically movable bodies (1g) (1g) (1B), respectively. ), and when the stopper lever (26) is unlocked, the vertically movable body 18) moves vertically while being supported by the locking pin (39) by rotation of the motor (34).

Next, the X table section (3) will be explained. In Fig. 1, (41) is an X table on which the printed circuit board (10) supplied to the supply conveyor (2) (2) is placed, and a nut (not shown) that fits into the X ball screw (42) is attached. The X linear guide (44) (44) is attached by rotating the X ball screw (42) by the X motor (43).
Move in the X direction along.

The electronic component (7) that was attracted by the nozzle (19) and moved by the mounting head (12) is placed in the Y of the mounting head (12).
It is mounted on the printed circuit board (10) on the X table (41) by the direction movement and the X direction movement of the X table (41).

Next, the component supply section (6) will be explained. In FIGS. 1 and 4, the parts supply section (6) in this embodiment is
A tape component supply device (47) that supplies electronic components (7) housed in a tape (46) is arranged in parallel. Electronic components (
7) has a wide variety of products. Normally, one supply device (47) supplies one type of electronic component (7), and multiple supply devices (47) supply a wide variety of components (7) with different component thicknesses. However, adjacent supply devices (47) are arranged in parallel with a predetermined interval. As mentioned above, there are three vertically movable bodies (18) attached to the mounting head (12), and the intervals at which the vertically movable bodies (18) (1B) (18) are attached are determined by the supply device ( 47) and the type of tool (21) matches the part (7).3
A feeding device (47) in which the book nozzles (19) (19) (19) can simultaneously descend and pick up parts (7) (7) (7) at the same time, but which supplies large parts (7)
If they are mixed, they cannot be installed at equal intervals.

(57) is a CRT, which displays a predetermined screen by operating the keyboard (56).

The aforementioned component data is shown in FIG. 7, and component thickness data is stored for each component name.

What is shown in Fig. 8 is the component thickness margin, R1 is data representing a margin that absorbs the component thickness dimension error in the upward direction of the upper surface of the component, and i is the component thickness dimension in the lower direction of the component upper surface. This data represents a margin for absorbing errors.

What is shown in FIG. 9 is nozzle height data, which stores the height from the component placement surface at the component pick-up position of the component supply device (47) to the tip of each nozzle (19) at the standby position. There is. In Fig. 5, the height of the nozzle (19) on the right side is 'L□'', and the height of the nozzle (19) on the center and left side (
19) are "L2." and "L," respectively.

Next, the control of this electronic component mounting apparatus will be described below.

In FIG. 10, (50) is a CPU as a control device, which performs given control related to component mounting operations, such as the vertical movement of the vertically movable body (18), and (51) indicates component data, component thickness margin, and A RAM (52) stores various data related to component mounting, such as nozzle height data, and a ROM (52) stores programs related to mounting operations.

(53) is the interface, (54) is the mounting head (
12) is a mounting head drive unit that drives a head drive motor (15) for movement in the Y direction, and (55) is a vertical movement drive that drives a vertical movement motor (34) to move the vertical movement body (18) up and down. Department.

(56) is a keyboard that allows various data to be set, and the information is stored in the RAM (51), which is a memory.

These various data can be arbitrarily set by operating various keys on the keyboard (56). For example, the setting operation of the above-mentioned nozzle height data will be described below.

First, press the selection key F4 (59), and the CRT (
57), a screen like the one shown in FIG. 11 is displayed.

Use the cursor key (60) to move the cursor (61), and use the numeric keypad (62) to enter the data 'Ls J' Lv J' corresponding to the nozzle (19).
Set La J.

You can also set the component thickness margin in the same way, by pressing the SET key (6
The setting operation is completed by pressing 3), and various data are stored in a predetermined area of the RAM (51).

The operation of the above configuration will be described below.

First, the mounting head (12) is driven by the head drive motor (15) to supply components to take out the electronic component (7) along the head linear guide (16) via the head ball screw (13) and head nut (14). Move to part (6). Under the control of the CPU (50), the mounting head drive unit (54) drives the head drive motor (15) to move the nozzles (19) (19) (19) to predetermined tape component supply devices (47) (47) (47). ) to stop on top.

At this time, the vertically moving bodies (18) (18) at the left end, center, and right end
) (18) is released from the restriction of the stopper lever (26) by the excitation of the solenoid (30), and the corresponding nozzle (19) descends to attract the part (7), but only one nozzle Since it is more efficient to pick up a plurality of parts at the same time than to pick up the part (7), if possible, any two or three parts are lowered to pick up the part (7) at the same time. Here, it is assumed that the three trains descend at the same time.

The name of the part that each nozzle (19) (19) (19) picks up is "R3" for the right nozzle (19), "R3" for the nozzle in the center (19), and "R3" for the nozzle on the right
9) is "R84," the left nozzle (19) is "R1," and the part thickness is as shown in Figure 5. (The part thickness is based on the part data in Figure 7.) Three vertically moving bodies ( 18) (18) (1g) The three solenoids (
30) (30) (30) are all energized, and the three stopper levers (26) (26) (26) are all energized with the support shafts (31) (3
1) Rotate around (31) as a fulcrum and the claw parts (27) (27) (2
7) comes off from the flange (32) (32) (32) to release the restriction. Thus each flange (32) (32
) (32) vertically moving body (1g>(1B) (18)
is in a state where it is supported by the locking pins (39) (39) (39).

Here, the CPU (50) calculates the descending distance from each nozzle (19) to the top surface of each component (7) based on the component data and nozzle height data stored in the RAM (51) according to the flowchart in FIG. calculate.

The calculated values are (L+-t+), (Lx tm), (L
m ti) is compared by the comparison means inside the CPU (50) to find the minimum value "PI" and the maximum value '1mi. The descending distance of the nozzle (19) (Lm t
i) is the minimum value 'Qnr, and the thinnest part (7)
The descending distance (L+
t+) is the maximum value "1 m".

Next, the CPU (50) calculates A=lnffit using the minimum value "fln" and the parts inventory margin "PIJ".
In addition to calculating t-a)-ffi, the parts inventory margin ``c'' is calculated.

Calculate n-(j!m+L)-A by L+1.
) +Q, -A are calculated. Thereafter, the CPU (50) rotates the vertical movement motor (34) at high speed via the vertical movement drive section (55).

Then, the vertically movable ball screw (35) rotates, and the vertically movable plate (37) engages with the linear guide (3) via the vertically movable nut (36).
8) and descends, locking pins (39) (39) (
Vertical moving body (18) (1g) (1g>
descends at high speed.

The CPU (50) has a vertically moving plate (37) and a vertically moving body (1
8) The vertical movement motor (34) is rotated at high speed via the vertical movement drive unit (55) until (18) (18) has descended by a distance rA, and when it has descended by a distance rA, the vertical movement motor (34) is rotated at a low speed. Rotate the motor (34).

In other words, the tip of the nozzle (19) on the left side shown in FIG. Even if there is variation in the thickness, as long as it is within "PI" in the thickness direction, the nozzle (19) will not collide with the component (7) at high speed.

The descending distance of the other nozzles (19) (19) to the parts (7) (7) is longer than the left nozzle (19), so the other nozzles (19) (19) reach the parts (7) (7) at high speed. There will be no collision.

Thereafter, the vertical movement plate (34) is driven by the vertical movement drive section (55) under the control of the CPU (50).
7) rotates at low speed until it descends a distance rB and then stops.

That is, the descending speed of the nozzle (19) is controlled by the CPU (50) as shown in FIG.

When the nozzle (19) comes into contact with the upper surface of the component (7) during the descent, the vertically movable body (18) is only supported from below by the locking bin (39) and is fixed to the vertically movable plate (37). Since it is not fixed, it will stop in the state of contact. Since the vertically moving plate 18) contacts the component (7) at low speed, it will not bend the lead or damage the component. The tip of component (7) (part name 'RIJ) is at a position where it is lowered by "ri" from the top surface of component (7) (part name 'RIJ).
)rRl'' up to the maximum ``ri,'' even if the nozzle (19) is thinner than tlJ, the nozzle (19) can come into contact with the top surface of the component (7) and suction is performed.Therefore, the right nozzle (19)
Center and left nozzles (19) with short descending distance to 7)
) (19) has already come into contact with and attracted to parts (7) (7) at this time.

After that, the motor (34) is rotated in the opposite direction by the drive of the vertical movement drive unit (55), and the vertical movement body (18) (18) (
18) rises while adsorbing parts (7) (7) (7).

Then, the solenoids (30) (30) (30) are demagnetized, the stopper levers (26) (26) (26) swing, and the claws (27) (27) (27) engage with the fins (32). The vertically moving body (18) (1g>(18) is locked.

The mounting head (12) is connected to the mounting head drive section (54).
) and moves in the Y direction to a predetermined position on the X table section (5). The X table (41) is driven by the X motor (43) and moved in the X direction along the X nonear guide (44) through rotation of the X ball screw (42).

Then, the stopper mechanism (23) of the vertically movable body 18) having the nozzle (19) in a predetermined position is unlocked, and the vertically movable body 18) is rotated by the rotation of the vertically movable motor (34).
8) descends.

The printed circuit board (10) supplied to the supply conveyor (2) is placed on the X table (41), and the nozzle (
The component (7) that has been completely suctioned by the substrate (19) is mounted on the substrate (10). After that, the vertical motion body (18) is moved by the vertical motion motor (18).
34) rises and is locked by the stopper mechanism (23).

The parts (7) (7>) that are adsorbed by the remaining two nozzles (19) (19) are also attached to the mounting head (12) and the X table (
41) are mounted at respective predetermined positions in the same manner as described above.

After finishing the part placement, the placement head (12) places the next part (
7) Move to the parts supply section (6) to take out.

The parts (7) (7) to be taken out next are the nozzles on the right (
19) is 'RIJ', and the central nozzle (19) is 'R
1° and the left nozzle (19) is RIJ, the mounting head (12) first connects the right nozzle (19).
The central nozzle (19) is positioned above the component supply device (47) that supplies rRfi, and is stopped. At this time, the left nozzle (19) is located above the supply device (47) that supplies 'Rs J.

Then, the stopper mechanism (23) unlocks the right and center vertically movable bodies (1g) (18), and the CPU (50) moves each part (7) from each nozzle (19) based on the flowchart in Figure 11. Descending distance to the top surface (1, 1-11)
, (1,*-t,) and compare. The maximum value 1m is (Ll-11) and the minimum value in is (Ll t*)
It is.

Then, A - (t* t*) y I and B - (L
, - Kai) 10! 8-A is calculated in the same manner as above. After this C
PU (50) is nozzle (19) (19) by distance rA''
While the nozzles (19) are being lowered, the vertical motor (34) is rotated at high speed to lower the nozzles (19) at high speed. Then, the CPU (50) rotates the vertical movement motor (34) at low speed from the position lowered by a distance "A", and the nozzle (19) (
19) as the distance r B .

lower at low speed and stop. While descending at a low speed over a distance rB, the nozzles (19) (19) attract the parts (7) (7), ascend, and are locked by the stopper mechanism (23).

After this, install the remaining left nozzle (19) so that it is located on the supply device (47) that supplies "R1".
9) moves, and the stopper mechanism (23) unlocks the left vertical moving body (18). The CPU (50) calculates the distance "A" and the distance "rB" in the same way as described above, but in this case, both the minimum value and the maximum value are <Ls - t+) and A -
(L.

-t, )-1, and B-1r+l are calculated, and the nozzle (
19> is lowered at high speed and lowered at low speed by these distances in the same manner as described above to attract the component (7).

Then, the parts (7) (7) (7) are mounted on the printed circuit board (10) in the same manner as described above. Parts (7) after this
When the components are removed and mounted onto the printed circuit board (10) and the mounting of components onto the printed circuit board (10) is completed, the board (10) is discharged to a downstream device by the discharge conveyor (4).

In this embodiment, a case has been described in which a chip component (7) completely encapsulated in a tape is taken out, but a component (7) supplied by a stick or a component (7) placed on a tray is also processed by the CPU. (50) performs similar control and can take out part (7).

Other embodiments of the present invention will be described below with reference to FIGS. 14 to 32.

In FIG. 14, (101) is a chip-shaped electronic component (1
02) to the printed circuit board (103), (104) and (105) are
), and (106) is a suction head portion having a suction nozzle (107) and the like.

The head portion (106) includes an X-axis direction guide body (108)
is movable in the X direction by an X direction drive source along
The guide body (108) is movable along the Y-axis direction guide bodies (109) and (110) by a Y-direction drive source.

Therefore, the head section (106) is movable in the X and Y directions.

(111) is an electronic component (
102) one pitch at a time, and a supply reel (114) is housed in a box (113). (115) is a parts magazine that stores electronic parts (102) stacked vertically; (116) is a part magazine that stores electronic parts (102) vertically stacked;
102) is placed on the parts tray.

Next, the head section (106) will be explained below.

In FIG. 15, (117) is a servo motor for vertically moving the nozzle fixed to the support base (118), and the motor (117) is a servo motor for vertically moving the nozzle.
The output shaft of 7) is connected via a coupling (119) to a pole screw (121) whose end is supported on a support stand (120). Since this ball screw (121) is fitted into the vertical moving body (122), the motor (
When the pole screw (121) is energized, the pole screw (121) rotates, and the vertical moving body (122>) moves up and down.

(123) is a vertical arm having a cam follower at one end and rotatable at the other end being pivotally supported by the movable body (122);
The arm (123) is biased upward by a spring (125) stretched between the arm (123) and the hook (124), but its upward rotation is restricted by a stopper (126).

A nozzle shaft (107A) detachably connected to the suction nozzle (107) can move up and down within the guide tube (131) via a bearing (132). (133) is a rotating disk on the upper part of the nozzle shaft (7A), which is connected to a vacuum source (not shown), and whose upper surface can be engaged with a stopper (118A) which is a cam follower of the support part (11B), and which is attached to the suction nozzle (107). The upward movement is limited, and the arm (123) engages with the lower surface to support the nozzle (107).

Next, the control of this component mounting device will be described below.

In FIG. 17, (140) is the CP as a control device.
U presides over certain controls related to component mounting operations, such as moving the suction nozzle (107) up and down. (141) is a RAM that stores various data related to mounting, such as the vertical movement of the suction nozzle (107), and (142) is a ROM that stores programs related to the mounting operation.

(143) is an interface, (144) is a suction head drive unit for driving the XY drive source of the suction head (106), and (145) is a servo motor (
117).

<146) is a key manual device that allows you to set various data.
The information is stored in the RAM (141) which is a memory. (147) is a CRT, and the key manual device (14)
7) displays a predetermined screen.

Fig. 18 shows a parts data table that determines the part thickness and packaging style depending on the type of electronic parts, and Fig. 19 shows a dimensional error absorption distance data table. .

is above the top surface of the part, ! , is the data below the top surface of the component. FIG. 20 shows a nozzle height data table, where data L is the distance from the standby position of the suction nozzle (107) to the reference level.

These various data can be arbitrarily set by operating various keys on the key input device (146). For example, the operation of setting the nozzle height data L mentioned above will be described below.

First, press the selection key F 4 (146A), then CR
T (147) displays a screen as shown in Figure 21. Use the cursor keys (146B) to select the cursor (147A).
) and arbitrarily set the data L using the numeric keypad (146C).

Similarly, dimensional error absorption distance data can also be set.
The setting operation is completed by pressing the key (1460), and various data are stored in a predetermined area of the RAM<141).

The operation of the above configuration will be described below. First, in a standby state, the suction head section (106) is in a state as shown in FIG. 15.

From this state, the ROM (
142) according to the program of the electronic component automatic mounting device (
101) starts operation 0 For example, if the component data is R1, the suction head section (106) controls the X-direction and Y-direction driving sources by the suction head section drive section (144), and starts the operation of the embossed tape feeder unit (111). ). Then, the nozzle vertical servo motor (117) is energized, rotates the ball screw (121), and lowers the vertical moving body (122).

Then, since the upper and lower arms (123) support the suction nozzle (107) and the nozzle shaft (107A) via the rotating disk (133) by the spring (125), the suction nozzle (107) and the nozzle shaft (107A) is lowered with the lowering of the vertical moving body (122), and as shown in FIG. 16, the electronic component (102) is sucked and taken out.

At this time, the nozzle shaft (107A) has a bearing <132
), the nozzle guide tube (131) is smoothly moved down.

When the part data is R1, the packaging style data is "1" according to FIG. 18, and this packaging style is shown in FIG. 23.

If the packaging is IJ, the nozzle height from the reference level to the standby position is L as shown in Figure 24.
102), in order to reduce suction errors and to account for variations in component dimensions, the suction nozzle (107) is moved a certain distance after contacting the top surface of the component, as shown in FIG. Downward dimensional error absorption distance data! , descending.

That is, since the upper surface of the component is theoretically at the reference level, the suction nozzle (107) will be lowered from the standby position by a distance L+l*.

If the speed at which the suction nozzle (107) contacts the electronic component (102) is too fast, the impact may damage the electronic component (102).
This speed must be slow to avoid damaging the However, if the suction nozzle (107) descends from the standby position at low speed, the suction operation will take too much time, so it is necessary to lower it at high speed to just before the top surface of the component and then lower it a certain distance at low speed. Electronic parts (
102) from the top surface, that is, the reference level.
), the upward dimensional error absorption distance data j2. Make the transition from high speed to low speed at high altitudes.

CPU (140) is the high speed descent distance (L-11
) and low speed descending distance (j!I+L), and as shown in Figure 27, the suction nozzle (1
07), the nozzle vertical drive unit is controlled so that the nozzle vertical drive unit moves downward.

Also, if the part data is R2, the packaging is 10'', but
The descending operation of the suction nozzle (107) will be explained as follows based on FIGS. 28, 29, and 30.

The nozzle height data L is the distance from the standby position of the suction nozzle to the reference level as in the case of packaging type "1" as shown in Fig. 28, but since the bottom surface of the component and the reference level match, the top surface of the component is Since the component thickness is 0 minutes higher than the reference level, the distance that the suction nozzle (107) descends at high speed is (L t*
j2+). The distance to descend at low speed is the same as for packaging type "1"<Ce, +1. ), and descends at high and low speeds as shown in Figure 31.

That is, as shown in the flowchart shown in FIG. 32, the CPU (140) calculates the high-speed descent distance for each packaging style according to the packaging style data, calculates the low-speed descent distance, and converts the calculated distance into high-speed descent. and controls the nozzle vertical drive unit (145) to lower the nozzle at a low speed.

Note that the tape feeder unit (111) supplies parts in both "0." and "1" packaging format, and the component magazine (R5) and component tray (116) supply components with packaging format r□. .

Thereafter, the suction nozzle (1) that has suctioned the electronic component (102)
07) rises, and the suction head part (1
06) moves a predetermined distance in the X and Y directions and mounts the electronic component (102) at a predetermined position on the printed circuit board (103).

(G) Effects of the Invention As described above, the present invention can reduce the impact on electronic components and shorten the time required for the suction operation as much as possible.

Furthermore, even when a plurality of suction nozzles are driven by one drive source to suction electronic components, the time required for the suction operation can be minimized by reducing the impact applied to the electronic components by all suction nozzles.

[Brief explanation of the drawing]

Fig. 1 is a plan view of an electronic component mounting device to which the electronic component suction device of the present invention is applied, Fig. 2 is a front view of the same electronic component mounting device, Fig. 3 is a perspective view of the mounting head, and Fig. 4 is a component supplying device. FIG. 5 and FIG. 6 are diagrams showing the distance relationship between each suction nozzle and the component, FIG. 7 is a diagram showing component data, and FIG.
0 is a diagram showing the component thickness margin, FIG. 9 is a diagram showing nozzle height data, FIG. 10 is a block diagram related to control of the electronic component mounting apparatus of the present invention, FIG. 11 is a diagram showing a CRT screen,
FIG. 12 is a diagram showing a flowchart, FIG. 13 is a diagram showing the relationship between the descending speed of the suction nozzle and time, and FIG. 14 is an overall perspective view of an electronic component automatic mounting device to which the electronic component suction device of the present invention is applied. FIG. 15 is a longitudinal sectional view of the suction head with the suction nozzle in the standby position, FIG. 16 is a longitudinal sectional view of the suction head with the suction nozzle suctioning an electronic component, and FIG.
rgJ is a block diagram related to the control of the electronic component suction device of the present invention, FIG. 18 is a diagram showing a component data table, FIG. 19 is a diagram showing dimensional error absorption distance data, and FIG. 20 is a diagram showing a nozzle height data table. Figure 21 is a diagram showing the CRT screen, Figures 22 and 23 are diagrams showing the packing form, and Figure 24 is a diagram showing the CRT screen.
Figures 25 and 26 are diagrams showing the distance relationship between the suction nozzle and electronic components for packaging style 11, and Figure 27 is a diagram showing the distance relationship between the suction nozzle and electronic components for packaging style 11.
Figures 28, 29, and 30 show the relationship between the moving speed of the nozzle up and down servo motor and time for case 1, and Figures 28, 29, and 30 show the distance between the suction nozzle and electronic components for packing type 0. A diagram showing the relationship, FIG. 31 is a diagram showing the relationship between the moving speed of the nozzle up and down servo motor and time in the case of packaging type r□.
FIG. 2 is a diagram showing a flowchart. (1)...Electronic component mounting device, (6)...Component supply unit, (7)...Electronic component, (10)...Printed circuit board, (12)...Mounting head, (18)... )・・
・Vertical moving body, (19)...Suction nozzle, (24)
...Vertical movement drive mechanism, (34>...Vertical movement motor, (35)...Vertical movement ball screw, (36)...
・Vertical movement nut, (37)...Vertical movement plate, (38
〉... Linear guide, (39)... Locking pin,
(47)... Tape component supply device, (50)...
CPU, (51)...RAM. (55)...Vertical movement drive unit, (102)...Electronic component, (107)...Suction nozzle, (117)...
...Servo motor for nozzle up and down, (140)...C
PU (control means, selection means, calculation means), (141
)...RAM (first storage means), (142)...
- ROM (second storage means).

Claims (3)

[Claims] (1) In an electronic component suction device that picks up electronic components with a suction nozzle and takes them out, there is a storage means for storing information regarding the height of the suction nozzle and the thickness of the electronic component, and information stored in the storage means. An electronic component suction device comprising means for calculating a distance for increasing the moving speed of the suction nozzle based on the above-mentioned information, and means for controlling a driving source for moving the suction nozzle based on the calculation result by the calculation means. (2) In an electronic component suction device that picks up and takes out electronic components with a suction nozzle, there is a first storage means for storing data regarding the packing form of the electronic component, and a distance and a low speed for the nozzle to move at high speed. a second storage means for storing a plurality of formulas for calculating the distance, and a plurality of calculation formulas stored in the second storage means based on the packaging data stored in the first storage means; a selection means for selecting an arbitrary one among them; a calculation means for calculating the distance based on a calculation formula selected by the selection means; and a control for a driving source for moving the suction nozzle based on a calculation result by the calculation means. An electronic component suction device comprising a control means for controlling. (3) In a component suction device that moves a plurality of suction nozzles up and down using one drive source to suction electronic components, information regarding the height of each of the suction nozzles and the thickness of each of the electronic components is stored. storage means for calculating the minimum descending distance and maximum descending distance of each nozzle based on the information stored in the storage means; A parts suction device comprising: control means for controlling the drive source to lower the nozzle at a low speed to a maximum descending distance.