JP2770457B2 - Electronic component mounting method - Google Patents
Electronic component mounting methodInfo
- Publication number
- JP2770457B2 JP2770457B2 JP1201922A JP20192289A JP2770457B2 JP 2770457 B2 JP2770457 B2 JP 2770457B2 JP 1201922 A JP1201922 A JP 1201922A JP 20192289 A JP20192289 A JP 20192289A JP 2770457 B2 JP2770457 B2 JP 2770457B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- suction nozzle
- height
- suction
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子部品装着装置において、特に電子部品の
高さに応じて吸着高さを調整する吸着手段に関するもの
である。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to a suction unit that adjusts a suction height according to the height of an electronic component.
従来の技術 従来の電子部品装着装置における吸着手段の例を第４
図に基づいて説明する。2. Description of the Related Art An example of a suction unit in a conventional electronic component mounting apparatus is described as a fourth example.
Description will be made based on the drawings.
電子部品供給装置５から供給される高さの異なる電子
部品４を吸着する場合、従来電子部品４ごとの高さデー
タを制御装置にあらかじめインプットしておき、このデ
ータに基づき、吸着高さ駆動用モータ８を回転させるこ
とで、吸着ヘッド７を電子部品４の高さに適合した位置
に吸着ヘッド７を下降させ、エア管11によりバキューム
し電子部品４を吸着していた。In the case of picking up electronic components 4 having different heights supplied from the electronic component supply device 5, height data for each of the conventional electronic components 4 is input to a control device in advance, and based on this data, a suction height driving device is used. By rotating the motor 8, the suction head 7 is lowered to a position suitable for the height of the electronic component 4, and is vacuumed by the air pipe 11 to suck the electronic component 4.
発明が解決しようとする課題 しかし、このような手段において、電子部品ごとの高
さデータを制御装置にインプットする必要があり、イン
プットデータを間違え例えばデータが少なく、吸着ヘッ
ドが十分電子部品の高さ位置まで下降させなかった場合
には電子部品の吸着ができず、機械が停止することが起
る。また、インプットデータが大きく吸着ヘッドを下降
させすぎると、吸着ヘッドと電子部品との接触時のダメ
ージを大きくし、吸着ヘッド及び電子部品の破損を発生
させる可能性がある。さらに、電子部品の種類を変える
ごとに、電子部品の高さデータを入れる必要があり、機
種切換時、多くの時間が必要であり、近年、多機種少量
生産およびミックス生産など機種切換の頻度の高い生産
形態が増えていく状況においては、機種切換に即応でき
ないという問題を有していた。However, in such means, it is necessary to input the height data of each electronic component to the control device, and the input data is incorrect, for example, the data is small, and the suction head is sufficiently high in height of the electronic component. If it is not lowered to the position, the electronic components cannot be sucked and the machine will stop. If the input data is large and the suction head is lowered too much, damage at the time of contact between the suction head and the electronic component is increased, which may cause damage to the suction head and the electronic component. Furthermore, every time the type of electronic component is changed, it is necessary to enter the height data of the electronic component, which requires a lot of time when switching models. In a situation where high production forms are increasing, there has been a problem that it is not possible to immediately respond to model switching.
問題点を解決するための手段 本発明は上記従来の問題点を解消するもので、所定の
電子部品供給装置より電子部品を昇降可能な吸着ノズル
にて吸着しプリント基板の所定位置に実装する電子部品
実装方法において、所定の電子部品供給装置に前記吸着
ノズルを位置させる第１工程と、前記第１工程後、前記
吸着ノズルが吸着すべき電子部品の高さを測定する第２
工程と、前記第２工程にて得られたデータより前記吸着
ノズルの下降量を算出し、その算出結果に基づき前記吸
着ノズルを下降させて前記電子部品を吸着する第３工程
と、前記第３工程にて吸着された電子部品をプリント基
板の所定位置上方に位置させる第４工程と、前記第４工
程後、前記吸着ノズルを下降させて前記電子部品をプリ
ント基板に実装する第５工程とからなるものである。Means for Solving the Problems The present invention solves the above-mentioned conventional problems, and an electronic device that sucks an electronic component from a predetermined electronic component supply device with a suction nozzle that can move up and down and mounts the electronic component at a predetermined position on a printed circuit board. In the component mounting method, a first step of positioning the suction nozzle in a predetermined electronic component supply device, and a second step of measuring a height of an electronic component to be suctioned by the suction nozzle after the first step
A step of calculating the amount of descent of the suction nozzle from the data obtained in the second step, and lowering the suction nozzle based on the calculation result to suck the electronic component; A fourth step of positioning the electronic component sucked in the process above a predetermined position on the printed board; and a fifth step of lowering the suction nozzle and mounting the electronic component on the printed board after the fourth step. It becomes.
作用 本発明は上記した構成によって、電子部品違いによる
高さに合った位置へ吸着ヘッドを昇降させることがで
き、電子部品ごとの高さデータをインプットする必要が
ないため、誤データのインプットによる吸着率の低下あ
るいは吸着ヘッド及び電子部品の破損を防止することが
できる。また、機種切換時の電子部品の高さデータをイ
ンプットするといった無駄な時間を省き、機種切換に即
応できる。Effect of the Invention With the above configuration, the suction head can be moved up and down to a position suitable for the height due to the difference in electronic components, and there is no need to input height data for each electronic component. It is possible to prevent a reduction in the rate or damage to the suction head and the electronic components. In addition, it is possible to immediately respond to model switching by eliminating useless time such as inputting height data of electronic components at the time of model switching.
実施例 以下本発明の一実施例を添付図面にもとづいて説明す
る。Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings.
第１図，第２図において１は電子部品装着装置本体で
ある。２はXYテーブル、３はXYテーブル２の駆動の為の
DCモータ、５は電子部品４を多数収納している収納テー
プを順次所定のピッチで送る電子部品供給装置、６は電
子部品４の高さを測定するために吸着ヘッド７に取付け
られた光学式距離測定センサー、８は吸着ヘッド７の高
さを任意の位置に位置決め可能な駆動用モータ、10は吸
着ヘッド７により吸着した電子部品４があらかじめ設定
したデータにもとづいた位置に装着される電子回路基
板、12はこれらをNCプログラムデータにより制御を行な
う制御装置である。1 and 2, reference numeral 1 denotes an electronic component mounting apparatus main body. 2 is an XY table, 3 is for driving the XY table 2
A DC motor 5 is an electronic component supply device for sequentially feeding a storage tape containing a large number of electronic components 4 at a predetermined pitch, and 6 is an optical type attached to a suction head 7 for measuring the height of the electronic components 4. A distance measuring sensor, 8 is a drive motor that can position the height of the suction head 7 at an arbitrary position, and 10 is an electronic circuit in which the electronic component 4 sucked by the suction head 7 is mounted at a position based on preset data. The board 12 is a control device for controlling these with NC program data.
上記の構成において、電子部品４の高さに合せて吸着
ヘッド７を駆動させて吸着動作させる場合を第３図の動
作フローチャートにて説明する。A case where the suction head 7 is driven in accordance with the height of the electronic component 4 to perform a suction operation in the above configuration will be described with reference to an operation flowchart of FIG.
あらかじめ設定されたNCプログラムに従い制御装置12
により吸着ヘッド７を具備したXYテーブル２をDCモータ
３により電子部品供給装置５の所定の電子部品４まで位
置決めを行なう（ステップ１）。位置決め完了後、光学
式距離測定センサー６により電子部品４の高さを測定す
る（ステップ２）。測定した電子部品４の高さデータを
制御装置12に送り制御装置12よりこの電子部品高さデー
タをもとと吸着ヘッド７を高さ駆動モータ８により電子
部品４の高さまで下降させる（ステップ３）。バキュー
ム管11を通し吸着ノズル９を真空状態にし電子部品４を
吸着させる（ステップ４）。吸着完了後、吸着ヘッド７
を駆動モータ８により上昇させる（ステップ５）。吸着
ヘッド７を具備したXYテープル２をDCモータ３を駆動さ
せ電子回路基板10の装着すべき所定の位置に位置決めさ
せる（ステップ６）。位置決め完了後吸着ヘッド７を高
さ駆動モータ８により下降させる（ステップ９）。バキ
ュームを切り吸着ノズル９を電子部品４をはなし電子回
路基板10に装着させる（ステップ８）。装着完了後吸着
ヘッド７を高さ駆動モータ８により上昇させる（ステッ
プ９）。Control unit 12 according to a preset NC program
The XY table 2 provided with the suction head 7 is positioned by the DC motor 3 to a predetermined electronic component 4 of the electronic component supply device 5 (step 1). After the positioning is completed, the height of the electronic component 4 is measured by the optical distance measuring sensor 6 (Step 2). The measured height data of the electronic component 4 is sent to the controller 12 and the controller 12 lowers the suction head 7 to the height of the electronic component 4 by the height drive motor 8 based on the height data of the electronic component (step 3). ). The suction nozzle 9 is evacuated through the vacuum tube 11 to suck the electronic component 4 (step 4). After the suction is completed, the suction head 7
Is raised by the drive motor 8 (step 5). The XY table 2 having the suction head 7 is driven by the DC motor 3 to be positioned at a predetermined position where the electronic circuit board 10 is to be mounted (step 6). After the positioning is completed, the suction head 7 is lowered by the height drive motor 8 (step 9). The vacuum is cut off and the suction nozzle 9 is mounted on the electronic circuit board 10 without the electronic component 4 (step 8). After the mounting is completed, the suction head 7 is raised by the height drive motor 8 (step 9).
発明の効果 以上、本発明によれば、所定の電子部品供給装置より
電子部品を昇降可能な吸着ノズルにて吸着しプリント基
板の所定位置に実装する電子部品実装方法において、所
定の電子部品供給装置に前記吸着ノズルを位置させる第
１工程と、前記第１工程後、前記吸着ノズルが吸着すべ
き電子部品の高さを測定する第２工程と、前記第２工程
にて得られたデータより前記吸着ノズルの下降量を算出
し、その算出結果に基づき前記吸着ノズルを下降させて
前記電子部品を吸着する第３工程と、前記第３工程にて
吸着された電子部品をプリント基板の所定位置上方に位
置させる第４工程と、前記第４工程後、前記吸着ノズル
を下降させて前記電子部品をプリント基板に実装する第
５工程とからなることにより、自動的に良好な吸着動作
を行なうことができ、機種切換による電子部品の高さデ
ータをインプットする必要がなくなることにより、誤デ
ータインプットによる吸着率低下と、機械と電子部品の
破損を防ぐことができ、さらに機種切換の時間を大幅に
短縮できることから生産性の増大に効果を発揮するもの
である。Effects of the Invention As described above, according to the present invention, in a method for mounting an electronic component from a predetermined electronic component supply device by a suction nozzle capable of moving up and down and mounting the electronic component at a predetermined position on a printed circuit board, A first step of positioning the suction nozzle at a second time, a second step of measuring the height of an electronic component to be suctioned by the suction nozzle after the first step, and a step of measuring the height of the electronic component based on the data obtained in the second step. A third step of calculating a descending amount of the suction nozzle and lowering the suction nozzle based on the calculation result to suck the electronic component; and moving the electronic component sucked in the third step above a predetermined position on a printed circuit board. And a fifth step of lowering the suction nozzle and mounting the electronic component on a printed circuit board after the fourth step, thereby automatically performing a good suction operation. This eliminates the need to input height data for electronic components due to model switching, which can prevent the suction rate from being reduced due to erroneous data input and prevent damage to machines and electronic components. This is effective in increasing productivity because it can be shortened.
第１図は本発明の一実施例における電子部品装着装置の
ヘッド周辺を示す断面図、第２図は同電子部品装着装置
の側面図、第３図は同装置における吸着動作のフローチ
ャート図、第４図は従来の電子部品装着装置のヘッド周
辺を示す断面図である。 ４……電子部品、５……電子部品供給装置、６……距離
測定センサー、７……吸着ヘッド、８……駆動モータ、
12……制御装置。FIG. 1 is a sectional view showing the periphery of a head of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus, FIG. FIG. 4 is a sectional view showing the periphery of a head of a conventional electronic component mounting apparatus. 4 ... electronic parts, 5 ... electronic parts supply device, 6 ... distance measuring sensor, 7 ... suction head, 8 ... drive motor,
12 ... Control device.
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/00 - 13/08Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 13/00-13/08
Claims (1)
降可能な吸着ノズルにて吸着しプリント基板の所定位置
に実装する電子部品実装方法において、 所定の電子部品供給装置に前記吸着ノズルを位置させる
第１工程と、 前記第１工程後、前記吸着ノズルが吸着すべき電子部品
の高さを測定する第２工程と、 前記第２工程にて得られれたデータより前記吸着ノズル
の下降量を算出し、その算出結果に基づき前記吸着ノズ
ルを下降させて前記電子部品を吸着する第３工程と、 前記第３工程にて吸着された電子部品をプリント基板の
所定位置上方に位置させる第４工程と、 前記第４工程後、前記吸着ノズルを下降させて前記電子
部品をプリント基板に実装する第５工程とからなること
を特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component at a predetermined position on a printed circuit board by sucking an electronic component from a predetermined electronic component supply device with a suction nozzle capable of moving up and down, wherein the suction nozzle is positioned at a predetermined electronic component supply device. A first step of causing the suction nozzle to measure a height of an electronic component to be sucked by the suction nozzle after the first step; and a descent amount of the suction nozzle based on data obtained in the second step. A third step of calculating and sucking the electronic component by lowering the suction nozzle based on the calculation result; and a fourth step of positioning the electronic component sucked in the third step above a predetermined position on a printed circuit board. And a fifth step of, after the fourth step, lowering the suction nozzle to mount the electronic component on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1201922A JP2770457B2 (en) | 1989-08-02 | 1989-08-02 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1201922A JP2770457B2 (en) | 1989-08-02 | 1989-08-02 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0365000A JPH0365000A (en) | 1991-03-20 |
| JP2770457B2 true JP2770457B2 (en) | 1998-07-02 |
Family
ID=16449019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1201922A Expired - Lifetime JP2770457B2 (en) | 1989-08-02 | 1989-08-02 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2770457B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3691888B2 (en) * | 1995-12-27 | 2005-09-07 | ジューキ株式会社 | Electronic component mounting method |
| JP3543044B2 (en) * | 1996-03-15 | 2004-07-14 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP4733586B2 (en) * | 2006-07-28 | 2011-07-27 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07101797B2 (en) * | 1984-09-06 | 1995-11-01 | 松下電器産業株式会社 | Electronic component mounting method |
-
1989
- 1989-08-02 JP JP1201922A patent/JP2770457B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365000A (en) | 1991-03-20 |
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