JPH02199075A - セラミックス―金属接合体 - Google Patents

セラミックス―金属接合体

Info

Publication number
JPH02199075A
JPH02199075A JP32571489A JP32571489A JPH02199075A JP H02199075 A JPH02199075 A JP H02199075A JP 32571489 A JP32571489 A JP 32571489A JP 32571489 A JP32571489 A JP 32571489A JP H02199075 A JPH02199075 A JP H02199075A
Authority
JP
Japan
Prior art keywords
metal
ceramic
oxide
ceramic member
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32571489A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0460946B2 (enEXAMPLES
Inventor
Nobuyuki Mizunoya
水野谷　信幸
Hajime Kohama
小浜　一
Yasuyuki Sugiura
杉浦　康之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP32571489A priority Critical patent/JPH02199075A/ja
Publication of JPH02199075A publication Critical patent/JPH02199075A/ja
Publication of JPH0460946B2 publication Critical patent/JPH0460946B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
JP32571489A 1989-12-15 1989-12-15 セラミックス―金属接合体 Granted JPH02199075A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32571489A JPH02199075A (ja) 1989-12-15 1989-12-15 セラミックス―金属接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32571489A JPH02199075A (ja) 1989-12-15 1989-12-15 セラミックス―金属接合体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11240282A Division JPS593077A (ja) 1982-06-29 1982-06-29 セラミツク部材と金属との接合方法

Publications (2)

Publication Number Publication Date
JPH02199075A true JPH02199075A (ja) 1990-08-07
JPH0460946B2 JPH0460946B2 (enEXAMPLES) 1992-09-29

Family

ID=18179875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32571489A Granted JPH02199075A (ja) 1989-12-15 1989-12-15 セラミックス―金属接合体

Country Status (1)

Country Link
JP (1) JPH02199075A (enEXAMPLES)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996009266A1 (fr) * 1994-09-22 1996-03-28 Sumitomo Electric Industries, Ltd. Corps d'aluminium et d'azoture de silicium lies et son procede de production
US6170734B1 (en) * 1998-07-24 2001-01-09 Korea Research Institute Of Chemical Technology Method of joining silicon nitride to carbon steel
JP2007008762A (ja) * 2005-06-30 2007-01-18 Tdk Corp 複合多孔体
JP2007007995A (ja) * 2005-06-30 2007-01-18 Tdk Corp 複合多孔体及び複合多孔体の製造方法
CN111212874A (zh) * 2017-10-18 2020-05-29 大金工业株式会社 交联性弹性体组合物和氟橡胶成型品

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102310A (en) * 1977-02-18 1978-09-06 Tokyo Shibaura Electric Co Heat conducting base plates

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53102310A (en) * 1977-02-18 1978-09-06 Tokyo Shibaura Electric Co Heat conducting base plates

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996009266A1 (fr) * 1994-09-22 1996-03-28 Sumitomo Electric Industries, Ltd. Corps d'aluminium et d'azoture de silicium lies et son procede de production
US5904993A (en) * 1994-09-22 1999-05-18 Sumitomo Electric Industries, Ltd. Joint body of aluminum and silicon nitride and method of preparing the same
US6170734B1 (en) * 1998-07-24 2001-01-09 Korea Research Institute Of Chemical Technology Method of joining silicon nitride to carbon steel
JP2007008762A (ja) * 2005-06-30 2007-01-18 Tdk Corp 複合多孔体
JP2007007995A (ja) * 2005-06-30 2007-01-18 Tdk Corp 複合多孔体及び複合多孔体の製造方法
CN111212874A (zh) * 2017-10-18 2020-05-29 大金工业株式会社 交联性弹性体组合物和氟橡胶成型品
CN111212874B (zh) * 2017-10-18 2022-03-04 大金工业株式会社 交联性弹性体组合物和氟橡胶成型品

Also Published As

Publication number Publication date
JPH0460946B2 (enEXAMPLES) 1992-09-29

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