JPH0219868B2 - - Google Patents
Info
- Publication number
- JPH0219868B2 JPH0219868B2 JP8626682A JP8626682A JPH0219868B2 JP H0219868 B2 JPH0219868 B2 JP H0219868B2 JP 8626682 A JP8626682 A JP 8626682A JP 8626682 A JP8626682 A JP 8626682A JP H0219868 B2 JPH0219868 B2 JP H0219868B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- copper
- weight
- composition
- polyvinyl butyral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 14
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- 239000004840 adhesive resin Substances 0.000 claims description 2
- 229920006223 adhesive resin Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 238000005476 soldering Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920003987 resole Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- -1 glycidyl compound Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8626682A JPS58204072A (ja) | 1982-05-21 | 1982-05-21 | 銅張積層板用接着性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8626682A JPS58204072A (ja) | 1982-05-21 | 1982-05-21 | 銅張積層板用接着性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58204072A JPS58204072A (ja) | 1983-11-28 |
| JPH0219868B2 true JPH0219868B2 (zh) | 1990-05-07 |
Family
ID=13882012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8626682A Granted JPS58204072A (ja) | 1982-05-21 | 1982-05-21 | 銅張積層板用接着性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58204072A (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3412095A1 (de) * | 1984-03-31 | 1985-10-17 | Hoechst Ag, 6230 Frankfurt | Mischung zur herstellung von saeurefesten dichtungen und impraegnierungen, verfahren zu ihrer herstellung sowie ihre verwendung |
| JPS61283673A (ja) * | 1985-06-10 | 1986-12-13 | Mitsui Toatsu Chem Inc | 接着剤組成物 |
| US5066691A (en) * | 1988-12-05 | 1991-11-19 | Hitachi Chemical Co., Ltd. | Adhesive composition for metal-clad laminates |
| JPH03264350A (ja) * | 1990-03-15 | 1991-11-25 | Showa Denko Kk | 銅張積層板 |
| JPH0793496B2 (ja) * | 1990-10-04 | 1995-10-09 | 日立化成工業株式会社 | 銅張積層板用銅箔樹脂接着層 |
-
1982
- 1982-05-21 JP JP8626682A patent/JPS58204072A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58204072A (ja) | 1983-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5160783A (en) | Epoxy resin-impregnated glass cloth sheet having adhesive layer | |
| JPS59210946A (ja) | 耐炎性積層板 | |
| JPH0453911B2 (zh) | ||
| US4837086A (en) | Adhesive clad insulating substrate used for producing printed circuit boards | |
| JPH0257812B2 (zh) | ||
| JPH0219868B2 (zh) | ||
| JP3209767B2 (ja) | 銅張積層板用接着剤 | |
| JPH01172479A (ja) | 銅張積層板用接着剤 | |
| JP2003198141A (ja) | 多層プリント配線板用絶縁材、金属箔付き絶縁材及び多層プリント配線板 | |
| JPH07165885A (ja) | エポキシ樹脂組成物 | |
| JPH0251470B2 (zh) | ||
| JP2835797B2 (ja) | Ｔａｂ用テープ | |
| JPH01172480A (ja) | 銅張積層板用接着剤 | |
| JP2935907B2 (ja) | 銅張積層板用接着剤 | |
| JPS62101674A (ja) | 銅張積層板用銅箔接着剤 | |
| JPH0340072B2 (zh) | ||
| KR100827756B1 (ko) | 열경화성 접착제 및 이것을 사용한 접착체 필름 | |
| JPS61126187A (ja) | 銅張積層板用接着剤 | |
| JPH04216813A (ja) | 銅張積層板用接着剤 | |
| KR20240066073A (ko) | 수지 조성물 및 이를 포함하는 인쇄회로기판 | |
| JPS61255972A (ja) | 積層板用接着剤組成物 | |
| JPH01282281A (ja) | 銅張積層板用接着剤 | |
| JPH03192185A (ja) | 銅張積層板用接着剤 | |
| JPS5975693A (ja) | 印刷回路用接着性組成物 | |
| JPS5984966A (ja) | 印刷回路用接着性組成物 |