JPH0218326B2 - - Google Patents
Info
- Publication number
- JPH0218326B2 JPH0218326B2 JP56181500A JP18150081A JPH0218326B2 JP H0218326 B2 JPH0218326 B2 JP H0218326B2 JP 56181500 A JP56181500 A JP 56181500A JP 18150081 A JP18150081 A JP 18150081A JP H0218326 B2 JPH0218326 B2 JP H0218326B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- epoxy resin
- curing agent
- room temperature
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18150081A JPS5883023A (ja) | 1981-11-11 | 1981-11-11 | 硬化性組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18150081A JPS5883023A (ja) | 1981-11-11 | 1981-11-11 | 硬化性組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5883023A JPS5883023A (ja) | 1983-05-18 |
JPH0218326B2 true JPH0218326B2 (d) | 1990-04-25 |
Family
ID=16101840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18150081A Granted JPS5883023A (ja) | 1981-11-11 | 1981-11-11 | 硬化性組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5883023A (d) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5959720A (ja) * | 1982-09-29 | 1984-04-05 | Asahi Chem Ind Co Ltd | 新規な一成分型エポキシ樹脂用硬化剤 |
JPS61190521A (ja) * | 1985-02-18 | 1986-08-25 | Asahi Chem Ind Co Ltd | エポキシ樹脂組成物 |
JPS61192722A (ja) * | 1985-02-21 | 1986-08-27 | Asahi Chem Ind Co Ltd | 硬化性組成物 |
JP2589325B2 (ja) * | 1987-10-27 | 1997-03-12 | ソニーケミカル 株式会社 | フィルム状熱硬化型接着剤及びその製造方法 |
JP2610900B2 (ja) * | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | 熱硬化型異方性導電接着シート及びその製造方法 |
JP2688694B2 (ja) * | 1989-01-20 | 1997-12-10 | 旭化成工業株式会社 | コンデンサー封止用一液性エポキシ樹脂組成物 |
JP3007026B2 (ja) * | 1995-09-27 | 2000-02-07 | サンスター技研株式会社 | 加熱硬化性エポキシ樹脂組成物 |
US6441064B1 (en) | 2000-11-01 | 2002-08-27 | Air Products And Chemicals, Inc. | Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions |
JP5620323B2 (ja) * | 2011-04-06 | 2014-11-05 | 積水化学工業株式会社 | 硬化剤及び/又は硬化促進剤複合粒子の製造方法、硬化剤及び/又は硬化促進剤複合粒子、並びに、熱硬化性樹脂組成物 |
JP6872944B2 (ja) | 2017-03-27 | 2021-05-19 | セメダイン株式会社 | 低温加熱硬化型構造用接着剤組成物 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54160496A (en) * | 1978-06-09 | 1979-12-19 | Taoka Chem Co Ltd | Curable composition |
-
1981
- 1981-11-11 JP JP18150081A patent/JPS5883023A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5883023A (ja) | 1983-05-18 |
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