JPH0217855Y2 - - Google Patents
Info
- Publication number
- JPH0217855Y2 JPH0217855Y2 JP12437081U JP12437081U JPH0217855Y2 JP H0217855 Y2 JPH0217855 Y2 JP H0217855Y2 JP 12437081 U JP12437081 U JP 12437081U JP 12437081 U JP12437081 U JP 12437081U JP H0217855 Y2 JPH0217855 Y2 JP H0217855Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- frame
- mold
- holding frame
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12437081U JPS5829416U (ja) | 1981-08-21 | 1981-08-21 | 封入成形機におけるリ−ドフレ−ム搬入装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12437081U JPS5829416U (ja) | 1981-08-21 | 1981-08-21 | 封入成形機におけるリ−ドフレ−ム搬入装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5829416U JPS5829416U (ja) | 1983-02-25 |
| JPH0217855Y2 true JPH0217855Y2 (cs) | 1990-05-18 |
Family
ID=29918239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12437081U Granted JPS5829416U (ja) | 1981-08-21 | 1981-08-21 | 封入成形機におけるリ−ドフレ−ム搬入装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5829416U (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59156711A (ja) * | 1983-02-25 | 1984-09-06 | Fujitsu Ltd | モ−ルド金型 |
-
1981
- 1981-08-21 JP JP12437081U patent/JPS5829416U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5829416U (ja) | 1983-02-25 |
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