JPS6237698Y2 - - Google Patents
Info
- Publication number
- JPS6237698Y2 JPS6237698Y2 JP12712281U JP12712281U JPS6237698Y2 JP S6237698 Y2 JPS6237698 Y2 JP S6237698Y2 JP 12712281 U JP12712281 U JP 12712281U JP 12712281 U JP12712281 U JP 12712281U JP S6237698 Y2 JPS6237698 Y2 JP S6237698Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- rod
- mold
- shaped body
- encapsulation molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 25
- 238000005538 encapsulation Methods 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 230000033001 locomotion Effects 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12712281U JPS5831114U (ja) | 1981-08-26 | 1981-08-26 | 封入成形機におけるリ−ドフレ−ムの搬出入装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12712281U JPS5831114U (ja) | 1981-08-26 | 1981-08-26 | 封入成形機におけるリ−ドフレ−ムの搬出入装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5831114U JPS5831114U (ja) | 1983-03-01 |
| JPS6237698Y2 true JPS6237698Y2 (cs) | 1987-09-26 |
Family
ID=29920865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12712281U Granted JPS5831114U (ja) | 1981-08-26 | 1981-08-26 | 封入成形機におけるリ−ドフレ−ムの搬出入装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831114U (cs) |
-
1981
- 1981-08-26 JP JP12712281U patent/JPS5831114U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5831114U (ja) | 1983-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5297897A (en) | Single-strip molding apparatus | |
| KR0157929B1 (ko) | 다층금형방식의 반도체패키지 몰딩장치 | |
| DE4426127C2 (de) | Verfahren und Vorrichtung zum Vergießen elektronischer Teile mit Gießharz | |
| EP0633111A2 (en) | Single-strip moulding apparatus with movable mould halves | |
| KR20120034556A (ko) | 수지밀봉장치 및 수지밀봉방법 | |
| US5158780A (en) | Device for encapsulating electronic components | |
| US3737998A (en) | Method and apparatus for making electrical connector assemblies | |
| JPS6237698Y2 (cs) | ||
| CN110369222B (zh) | 一种应用于物理微电子封装的微电子点胶设备 | |
| JP3609824B1 (ja) | 樹脂封止成形装置 | |
| CN104799422B (zh) | 一种舔块成型自动生产线装置 | |
| CN116995009B (zh) | 一种芯片封装加工用模具组件 | |
| JP2932137B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| US2336212A (en) | Stripper for molding presses | |
| JP3033258B2 (ja) | 電子部品のモールドプレス装置 | |
| CN221727064U (zh) | 一种芯片生产用塑封机 | |
| CN206855450U (zh) | 一种带线led模组底座全自动注塑机的自动取料机械手 | |
| JPH0217855Y2 (cs) | ||
| CN117690832B (zh) | 一种半导体器件封装装置 | |
| CN204670361U (zh) | 一种舔块成型自动生产线装置 | |
| JP2004063851A (ja) | 樹脂封止装置 | |
| JPH0432756Y2 (cs) | ||
| CN215992623U (zh) | 块状宠物零食成型模具及其设备 | |
| JP2666041B2 (ja) | 電子部品の樹脂封止成形方法 | |
| JPS6157261B2 (cs) |