JPH02170595A - 多層プリント基板の基準マーク位置自動検出方法 - Google Patents

多層プリント基板の基準マーク位置自動検出方法

Info

Publication number
JPH02170595A
JPH02170595A JP32354288A JP32354288A JPH02170595A JP H02170595 A JPH02170595 A JP H02170595A JP 32354288 A JP32354288 A JP 32354288A JP 32354288 A JP32354288 A JP 32354288A JP H02170595 A JPH02170595 A JP H02170595A
Authority
JP
Japan
Prior art keywords
reference mark
window
image
mark
binary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32354288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0557753B2 (enExample
Inventor
Nobuo Oku
信夫 奥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP32354288A priority Critical patent/JPH02170595A/ja
Publication of JPH02170595A publication Critical patent/JPH02170595A/ja
Publication of JPH0557753B2 publication Critical patent/JPH0557753B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP32354288A 1988-12-23 1988-12-23 多層プリント基板の基準マーク位置自動検出方法 Granted JPH02170595A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32354288A JPH02170595A (ja) 1988-12-23 1988-12-23 多層プリント基板の基準マーク位置自動検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32354288A JPH02170595A (ja) 1988-12-23 1988-12-23 多層プリント基板の基準マーク位置自動検出方法

Publications (2)

Publication Number Publication Date
JPH02170595A true JPH02170595A (ja) 1990-07-02
JPH0557753B2 JPH0557753B2 (enExample) 1993-08-24

Family

ID=18155865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32354288A Granted JPH02170595A (ja) 1988-12-23 1988-12-23 多層プリント基板の基準マーク位置自動検出方法

Country Status (1)

Country Link
JP (1) JPH02170595A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152048A (ja) * 1990-10-11 1992-05-26 Japan Steel Works Ltd:The 多層プリント基板の基準マーク位置自動穴あけ方法
JPH06288715A (ja) * 1993-04-02 1994-10-18 Nec Corp プリント基板のマーク位置認識装置及び方法
US7456372B2 (en) 1996-11-20 2008-11-25 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462802B2 (en) 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JP2018046132A (ja) * 2016-09-14 2018-03-22 株式会社ムラキ 多層回路基板基準穴明機に応用される自動搬送装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152048A (ja) * 1990-10-11 1992-05-26 Japan Steel Works Ltd:The 多層プリント基板の基準マーク位置自動穴あけ方法
JPH06288715A (ja) * 1993-04-02 1994-10-18 Nec Corp プリント基板のマーク位置認識装置及び方法
US7456372B2 (en) 1996-11-20 2008-11-25 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462802B2 (en) 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7462801B1 (en) * 1996-11-20 2008-12-09 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7667160B2 (en) 1996-11-20 2010-02-23 Ibiden Co., Ltd Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
US7732732B2 (en) 1996-11-20 2010-06-08 Ibiden Co., Ltd. Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board
JP2018046132A (ja) * 2016-09-14 2018-03-22 株式会社ムラキ 多層回路基板基準穴明機に応用される自動搬送装置

Also Published As

Publication number Publication date
JPH0557753B2 (enExample) 1993-08-24

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