JPH02142157A - ウェハーの有無・傾き判別装置 - Google Patents

ウェハーの有無・傾き判別装置

Info

Publication number
JPH02142157A
JPH02142157A JP63295817A JP29581788A JPH02142157A JP H02142157 A JPH02142157 A JP H02142157A JP 63295817 A JP63295817 A JP 63295817A JP 29581788 A JP29581788 A JP 29581788A JP H02142157 A JPH02142157 A JP H02142157A
Authority
JP
Japan
Prior art keywords
wafer
camera
cassette
wafers
coordinate values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63295817A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0477465B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Takeo Nashimoto
梨本　丈穂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON M R C KK
Original Assignee
NIPPON M R C KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON M R C KK filed Critical NIPPON M R C KK
Priority to JP63295817A priority Critical patent/JPH02142157A/ja
Publication of JPH02142157A publication Critical patent/JPH02142157A/ja
Publication of JPH0477465B2 publication Critical patent/JPH0477465B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP63295817A 1988-11-22 1988-11-22 ウェハーの有無・傾き判別装置 Granted JPH02142157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63295817A JPH02142157A (ja) 1988-11-22 1988-11-22 ウェハーの有無・傾き判別装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63295817A JPH02142157A (ja) 1988-11-22 1988-11-22 ウェハーの有無・傾き判別装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2299678A Division JPH03163847A (ja) 1990-11-05 1990-11-05 ウェハーの位置決め装置

Publications (2)

Publication Number Publication Date
JPH02142157A true JPH02142157A (ja) 1990-05-31
JPH0477465B2 JPH0477465B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-08

Family

ID=17825551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63295817A Granted JPH02142157A (ja) 1988-11-22 1988-11-22 ウェハーの有無・傾き判別装置

Country Status (1)

Country Link
JP (1) JPH02142157A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100290217B1 (ko) * 1992-05-18 2001-06-01 라일 알. 바우어스 반도체 웨이퍼 카세트 맵퍼 및 반도체 웨이퍼 존재 혹은 크로스 슬롯 여부 탐지방법
JP2003068829A (ja) * 2001-08-30 2003-03-07 Anelva Corp 基板搬送システム及び基板処理装置
US6636626B1 (en) 1999-11-30 2003-10-21 Wafermasters, Inc. Wafer mapping apparatus and method
WO2003100725A1 (en) * 2000-12-01 2003-12-04 Wafermasters, Incorporated Wafer mapping apparatus and method
JP2020136395A (ja) * 2019-02-15 2020-08-31 Tdk株式会社 ロードポート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109352A (en) * 1980-12-26 1982-07-07 Toshiba Corp Position sensing apparatus
JPS59175740A (ja) * 1983-03-25 1984-10-04 Telmec Co Ltd ウエハ検出装置
JPS60157230A (ja) * 1984-01-11 1985-08-17 Telmec Co Ltd 半導体ウエハ搬送方法
JPS60257121A (ja) * 1984-06-01 1985-12-18 Fujitsu Ltd 半導体ウエハ検知方法
JPS6171383A (ja) * 1984-09-17 1986-04-12 Canon Inc ウエハ位置検出装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57109352A (en) * 1980-12-26 1982-07-07 Toshiba Corp Position sensing apparatus
JPS59175740A (ja) * 1983-03-25 1984-10-04 Telmec Co Ltd ウエハ検出装置
JPS60157230A (ja) * 1984-01-11 1985-08-17 Telmec Co Ltd 半導体ウエハ搬送方法
JPS60257121A (ja) * 1984-06-01 1985-12-18 Fujitsu Ltd 半導体ウエハ検知方法
JPS6171383A (ja) * 1984-09-17 1986-04-12 Canon Inc ウエハ位置検出装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100290217B1 (ko) * 1992-05-18 2001-06-01 라일 알. 바우어스 반도체 웨이퍼 카세트 맵퍼 및 반도체 웨이퍼 존재 혹은 크로스 슬롯 여부 탐지방법
US6636626B1 (en) 1999-11-30 2003-10-21 Wafermasters, Inc. Wafer mapping apparatus and method
WO2003100725A1 (en) * 2000-12-01 2003-12-04 Wafermasters, Incorporated Wafer mapping apparatus and method
JP2003068829A (ja) * 2001-08-30 2003-03-07 Anelva Corp 基板搬送システム及び基板処理装置
JP2020136395A (ja) * 2019-02-15 2020-08-31 Tdk株式会社 ロードポート

Also Published As

Publication number Publication date
JPH0477465B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-08

Similar Documents

Publication Publication Date Title
US6135854A (en) Automatic workpiece transport apparatus for double-side polishing machine
JP2798665B2 (ja) 実質的に円形をした製品の移送装置
JP6329397B2 (ja) 画像検査装置及び画像検査方法
KR20070083287A (ko) 웨이퍼 얼라인 장치 및 방법
JP2007157897A (ja) 半導体ウエハの位置決定方法およびこれを用いた装置
JP2007240519A (ja) 欠陥検査方法、欠陥検査装置及びコンピュータプログラム
JP7691887B2 (ja) 基板搬送ロボットおよび基板搬送ロボットの制御方法
JP4385419B2 (ja) 外観検査方法及び外観検査装置
JP2687030B2 (ja) ロボット使用の自動移載装置
JPS6069714A (ja) 物体位置決めの装置および方法
TW201200862A (en) Flaw inspection device
JPH02142157A (ja) ウェハーの有無・傾き判別装置
KR20170031122A (ko) 기판 처리 장치, 기판 처리 방법 및 그 기판 처리 방법을 실행시키기 위한 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
TW202516665A (zh) 基板搬送裝置及具備其之基板處理裝置
JP4191295B2 (ja) 半導体パッケージの検査装置
JP2007212230A (ja) 欠陥検査方法，欠陥検査システム及びコンピュータプログラム
JP3155455B2 (ja) ワーク位置決め装置
JP3963572B2 (ja) 基板搬入搬出装置
JPH03163847A (ja) ウェハーの位置決め装置
JP2001004334A (ja) 半導体パッケージの検査装置
JP3243956U (ja) ロボットアーム自動補正装置
TWI857575B (zh) 半導體製造裝置系統
JP2025112026A (ja) 基板情報取得装置及びそれを備えた基板処理装置
JPH02135752A (ja) ウェハー検出装置
JP2004001002A (ja) レーザーマーキング装置