JPH0213935B2 - - Google Patents
Info
- Publication number
- JPH0213935B2 JPH0213935B2 JP13330283A JP13330283A JPH0213935B2 JP H0213935 B2 JPH0213935 B2 JP H0213935B2 JP 13330283 A JP13330283 A JP 13330283A JP 13330283 A JP13330283 A JP 13330283A JP H0213935 B2 JPH0213935 B2 JP H0213935B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- hole
- tape
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 description 16
- 239000008188 pellet Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000523 sample Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13330283A JPS6025263A (ja) | 1983-07-21 | 1983-07-21 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13330283A JPS6025263A (ja) | 1983-07-21 | 1983-07-21 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6025263A JPS6025263A (ja) | 1985-02-08 |
JPH0213935B2 true JPH0213935B2 (de) | 1990-04-05 |
Family
ID=15101482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13330283A Granted JPS6025263A (ja) | 1983-07-21 | 1983-07-21 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6025263A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129848U (de) * | 1990-04-10 | 1991-12-26 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4899207A (en) * | 1986-08-27 | 1990-02-06 | Digital Equipment Corporation | Outer lead tape automated bonding |
JP2559902B2 (ja) * | 1990-11-14 | 1996-12-04 | 大江化学工業株式会社 | ヒートシール性通気包装材料の製造方法 |
-
1983
- 1983-07-21 JP JP13330283A patent/JPS6025263A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129848U (de) * | 1990-04-10 | 1991-12-26 |
Also Published As
Publication number | Publication date |
---|---|
JPS6025263A (ja) | 1985-02-08 |
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