JPH02127030U - - Google Patents

Info

Publication number
JPH02127030U
JPH02127030U JP3707189U JP3707189U JPH02127030U JP H02127030 U JPH02127030 U JP H02127030U JP 3707189 U JP3707189 U JP 3707189U JP 3707189 U JP3707189 U JP 3707189U JP H02127030 U JPH02127030 U JP H02127030U
Authority
JP
Japan
Prior art keywords
wafer table
cylindrical insulator
wafer
plasma etching
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3707189U
Other languages
English (en)
Other versions
JPH0741155Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989037071U priority Critical patent/JPH0741155Y2/ja
Publication of JPH02127030U publication Critical patent/JPH02127030U/ja
Application granted granted Critical
Publication of JPH0741155Y2 publication Critical patent/JPH0741155Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るウエハーテーブルを適用
したエツチング装置の概略全体図、第２図は筒状
絶縁体の斜視図、第３図は別実施例を示すウエハ
ーテーブルの断面図である。 尚、図面中１は装置本体、３はチヤンバー、４
はウエハー、５はウエハーテーブル、６は高周波
電源、７は筒状絶縁体、８は反応ガス給排穴、１
２はマイクロ波発振器である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 高周波電源に接続されるプラズマエツチング用
    ウエハーテーブルにおいて、このウエハーテーブ
    ル上面には筒状絶縁体が設けられ、この筒状絶縁
    体は内径寸法をウエハーの外径寸法よりも大とさ
    れ且つ周方向に離間して多数の反応ガス給排穴が
    形成されていることを特徴とするプラズマエツチ
    ング用ウエハーテーブル。
JP1989037071U 1989-03-30 1989-03-30 プラズマエッチング装置 Expired - Lifetime JPH0741155Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989037071U JPH0741155Y2 (ja) 1989-03-30 1989-03-30 プラズマエッチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989037071U JPH0741155Y2 (ja) 1989-03-30 1989-03-30 プラズマエッチング装置

Publications (2)

Publication Number Publication Date
JPH02127030U true JPH02127030U (ja) 1990-10-19
JPH0741155Y2 JPH0741155Y2 (ja) 1995-09-20

Family

ID=31543854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989037071U Expired - Lifetime JPH0741155Y2 (ja) 1989-03-30 1989-03-30 プラズマエッチング装置

Country Status (1)

Country Link
JP (1) JPH0741155Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04334022A (ja) * 1991-05-09 1992-11-20 Sony Corp ドライエッチング方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196724A (ja) * 1984-10-17 1986-05-15 Agency Of Ind Science & Technol 容量結合型プラズマｃｖｄ装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196724A (ja) * 1984-10-17 1986-05-15 Agency Of Ind Science & Technol 容量結合型プラズマｃｖｄ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04334022A (ja) * 1991-05-09 1992-11-20 Sony Corp ドライエッチング方法

Also Published As

Publication number Publication date
JPH0741155Y2 (ja) 1995-09-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term