JPH02118932U - - Google Patents
Info
- Publication number
- JPH02118932U JPH02118932U JP1989027336U JP2733689U JPH02118932U JP H02118932 U JPH02118932 U JP H02118932U JP 1989027336 U JP1989027336 U JP 1989027336U JP 2733689 U JP2733689 U JP 2733689U JP H02118932 U JPH02118932 U JP H02118932U
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- electrode structure
- view
- electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/231—Shapes
- H10W72/234—Cross-sectional shape, i.e. in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027336U JPH02118932U (enExample) | 1989-03-13 | 1989-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989027336U JPH02118932U (enExample) | 1989-03-13 | 1989-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118932U true JPH02118932U (enExample) | 1990-09-25 |
Family
ID=31249739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989027336U Pending JPH02118932U (enExample) | 1989-03-13 | 1989-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118932U (enExample) |
-
1989
- 1989-03-13 JP JP1989027336U patent/JPH02118932U/ja active Pending