JPS6155337U - - Google Patents
Info
- Publication number
- JPS6155337U JPS6155337U JP1984140602U JP14060284U JPS6155337U JP S6155337 U JPS6155337 U JP S6155337U JP 1984140602 U JP1984140602 U JP 1984140602U JP 14060284 U JP14060284 U JP 14060284U JP S6155337 U JPS6155337 U JP S6155337U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- integrated circuit
- substrate
- resin
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
-
- H10W70/685—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984140602U JPS6155337U (enExample) | 1984-09-17 | 1984-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984140602U JPS6155337U (enExample) | 1984-09-17 | 1984-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6155337U true JPS6155337U (enExample) | 1986-04-14 |
Family
ID=30698956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984140602U Pending JPS6155337U (enExample) | 1984-09-17 | 1984-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6155337U (enExample) |
-
1984
- 1984-09-17 JP JP1984140602U patent/JPS6155337U/ja active Pending
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