JPS61149334U - - Google Patents
Info
- Publication number
- JPS61149334U JPS61149334U JP1985031038U JP3103885U JPS61149334U JP S61149334 U JPS61149334 U JP S61149334U JP 1985031038 U JP1985031038 U JP 1985031038U JP 3103885 U JP3103885 U JP 3103885U JP S61149334 U JPS61149334 U JP S61149334U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit
- recess
- hybrid integrated
- circuit components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/884—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985031038U JPS61149334U (enExample) | 1985-03-05 | 1985-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985031038U JPS61149334U (enExample) | 1985-03-05 | 1985-03-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61149334U true JPS61149334U (enExample) | 1986-09-16 |
Family
ID=30531279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985031038U Pending JPS61149334U (enExample) | 1985-03-05 | 1985-03-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61149334U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010073994A (ja) * | 2008-09-19 | 2010-04-02 | Powertech Technology Inc | ウインドウ型ｂｇａパッケージ及びその製造方法 |
-
1985
- 1985-03-05 JP JP1985031038U patent/JPS61149334U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010073994A (ja) * | 2008-09-19 | 2010-04-02 | Powertech Technology Inc | ウインドウ型ｂｇａパッケージ及びその製造方法 |