JPH0213731U - - Google Patents
Info
- Publication number
- JPH0213731U JPH0213731U JP1988091565U JP9156588U JPH0213731U JP H0213731 U JPH0213731 U JP H0213731U JP 1988091565 U JP1988091565 U JP 1988091565U JP 9156588 U JP9156588 U JP 9156588U JP H0213731 U JPH0213731 U JP H0213731U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- integrated circuit
- thin metal
- electronic components
- metal wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988091565U JPH0213731U (enExample) | 1988-07-11 | 1988-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988091565U JPH0213731U (enExample) | 1988-07-11 | 1988-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213731U true JPH0213731U (enExample) | 1990-01-29 |
Family
ID=31316037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988091565U Pending JPH0213731U (enExample) | 1988-07-11 | 1988-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213731U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013070260A (ja) * | 2011-09-22 | 2013-04-18 | Nippon Dempa Kogyo Co Ltd | 弾性表面波素子及びその製造方法 |
-
1988
- 1988-07-11 JP JP1988091565U patent/JPH0213731U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013070260A (ja) * | 2011-09-22 | 2013-04-18 | Nippon Dempa Kogyo Co Ltd | 弾性表面波素子及びその製造方法 |