JPH0432531U - - Google Patents
Info
- Publication number
- JPH0432531U JPH0432531U JP1990073550U JP7355090U JPH0432531U JP H0432531 U JPH0432531 U JP H0432531U JP 1990073550 U JP1990073550 U JP 1990073550U JP 7355090 U JP7355090 U JP 7355090U JP H0432531 U JPH0432531 U JP H0432531U
- Authority
- JP
- Japan
- Prior art keywords
- inner lead
- copper foil
- hole
- bump electrode
- bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/701—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990073550U JPH0432531U (enExample) | 1990-07-10 | 1990-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990073550U JPH0432531U (enExample) | 1990-07-10 | 1990-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0432531U true JPH0432531U (enExample) | 1992-03-17 |
Family
ID=31612462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990073550U Pending JPH0432531U (enExample) | 1990-07-10 | 1990-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432531U (enExample) |
-
1990
- 1990-07-10 JP JP1990073550U patent/JPH0432531U/ja active Pending