JPH0373439U - - Google Patents
Info
- Publication number
- JPH0373439U JPH0373439U JP1989135109U JP13510989U JPH0373439U JP H0373439 U JPH0373439 U JP H0373439U JP 1989135109 U JP1989135109 U JP 1989135109U JP 13510989 U JP13510989 U JP 13510989U JP H0373439 U JPH0373439 U JP H0373439U
- Authority
- JP
- Japan
- Prior art keywords
- bump electrode
- ball
- electrode wire
- semiconductor pellet
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/012—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135109U JPH0373439U (enExample) | 1989-11-21 | 1989-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135109U JPH0373439U (enExample) | 1989-11-21 | 1989-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0373439U true JPH0373439U (enExample) | 1991-07-24 |
Family
ID=31682398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135109U Pending JPH0373439U (enExample) | 1989-11-21 | 1989-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0373439U (enExample) |
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1989
- 1989-11-21 JP JP1989135109U patent/JPH0373439U/ja active Pending