JPH03124637U - - Google Patents

Info

Publication number
JPH03124637U
JPH03124637U JP1990033755U JP3375590U JPH03124637U JP H03124637 U JPH03124637 U JP H03124637U JP 1990033755 U JP1990033755 U JP 1990033755U JP 3375590 U JP3375590 U JP 3375590U JP H03124637 U JPH03124637 U JP H03124637U
Authority
JP
Japan
Prior art keywords
wire
tip
bonding tool
bonding
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990033755U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990033755U priority Critical patent/JPH03124637U/ja
Publication of JPH03124637U publication Critical patent/JPH03124637U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP1990033755U 1990-03-30 1990-03-30 Pending JPH03124637U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990033755U JPH03124637U (enExample) 1990-03-30 1990-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990033755U JPH03124637U (enExample) 1990-03-30 1990-03-30

Publications (1)

Publication Number Publication Date
JPH03124637U true JPH03124637U (enExample) 1991-12-17

Family

ID=31537671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990033755U Pending JPH03124637U (enExample) 1990-03-30 1990-03-30

Country Status (1)

Country Link
JP (1) JPH03124637U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02275635A (ja) * 1989-04-17 1990-11-09 Nec Corp バンプ形成装置及びその形成方法
JPH039525A (ja) * 1989-06-07 1991-01-17 Nec Corp バンプ形成方法及びその形成装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02275635A (ja) * 1989-04-17 1990-11-09 Nec Corp バンプ形成装置及びその形成方法
JPH039525A (ja) * 1989-06-07 1991-01-17 Nec Corp バンプ形成方法及びその形成装置

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