JPS6355536U - - Google Patents
Info
- Publication number
- JPS6355536U JPS6355536U JP1986150240U JP15024086U JPS6355536U JP S6355536 U JPS6355536 U JP S6355536U JP 1986150240 U JP1986150240 U JP 1986150240U JP 15024086 U JP15024086 U JP 15024086U JP S6355536 U JPS6355536 U JP S6355536U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor chip
- metal stem
- adhesive
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/30—
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- H10W72/07353—
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- H10W72/334—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/884—
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- H10W72/931—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150240U JPS6355536U (enExample) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986150240U JPS6355536U (enExample) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355536U true JPS6355536U (enExample) | 1988-04-14 |
Family
ID=31066203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986150240U Pending JPS6355536U (enExample) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355536U (enExample) |
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1986
- 1986-09-29 JP JP1986150240U patent/JPS6355536U/ja active Pending