JPS6027434U - ワイヤボンデイング用キヤピラリ - Google Patents

ワイヤボンデイング用キヤピラリ

Info

Publication number
JPS6027434U
JPS6027434U JP1983119755U JP11975583U JPS6027434U JP S6027434 U JPS6027434 U JP S6027434U JP 1983119755 U JP1983119755 U JP 1983119755U JP 11975583 U JP11975583 U JP 11975583U JP S6027434 U JPS6027434 U JP S6027434U
Authority
JP
Japan
Prior art keywords
capillary
wire
wire bonding
pressing part
wire pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983119755U
Other languages
English (en)
Inventor
十三男 小林
博 丑木
門沢　元昭
山崎　信人
Original Assignee
株式会社　新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　新川 filed Critical 株式会社　新川
Priority to JP1983119755U priority Critical patent/JPS6027434U/ja
Publication of JPS6027434U publication Critical patent/JPS6027434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のキャピラリの断面図、第２図は第１図の
キャピラリによる第２ボンド後のワイヤ形状を示す側面
図、第３図は本考案になるキャピラリの一実施例を示す
断面図、第４図、第５図は第３図のキャピラリによる第
２ボンドを示し、第４図は第２ボンド状態における断面
図、第５図は第２ボンド後のワイヤ形状の側面図である
。 １０・・・キャピラリ、１１・・・ワイヤ押圧部、１２
・・・ワイヤ導出孔、１３・・・先端内側面取り部、１
４・・・突出部、２０・・・ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤ導出孔の先端部に先端内側面取り部が形成され、
    この先端内側面取り部の外側の先端部にワイヤ押圧部を
    有するワイヤボンディング用キャピラリにおいて、前記
    ワイヤ押圧部は平らに形成され、このワイヤ押圧部の内
    側に前記先端内側面取り部の周りを囲むように環状に鋭
    利な突出部を形成したことを特徴とするワイヤボンディ
    ング用キャピラリ。　　　　　・
JP1983119755U 1983-08-02 1983-08-02 ワイヤボンデイング用キヤピラリ Pending JPS6027434U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983119755U JPS6027434U (ja) 1983-08-02 1983-08-02 ワイヤボンデイング用キヤピラリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983119755U JPS6027434U (ja) 1983-08-02 1983-08-02 ワイヤボンデイング用キヤピラリ

Publications (1)

Publication Number Publication Date
JPS6027434U true JPS6027434U (ja) 1985-02-25

Family

ID=30274718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983119755U Pending JPS6027434U (ja) 1983-08-02 1983-08-02 ワイヤボンデイング用キヤピラリ

Country Status (1)

Country Link
JP (1) JPS6027434U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201900024295A1 (it) * 2019-12-17 2021-06-17 St Microelectronics Srl Utensile di wire bonding, procedimento e struttura di bond corrispondenti

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58424B2 (ja) * 1973-08-17 1983-01-06 ワ−ナ− ランバ−ト コンパニ− サンカンセイスルホキシミドノ セイゾウホウホウ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58424B2 (ja) * 1973-08-17 1983-01-06 ワ−ナ− ランバ−ト コンパニ− サンカンセイスルホキシミドノ セイゾウホウホウ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201900024295A1 (it) * 2019-12-17 2021-06-17 St Microelectronics Srl Utensile di wire bonding, procedimento e struttura di bond corrispondenti

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